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US4618874A Expired / Lapsed US ⏱️ 0.0 years remaining

Solid state imaging device

Assignee: Toshiba Corp
•
Filing: 1984-09-06
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Granted: 1986-10-21
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Expires: 2004-09-06
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Abstract

Abstract There is disclosed a solid state imaging device comprising P + regions formed in photo-electro converting element regions and the separating region defined therebetween, respectively, the P + regions being continuous to each other and defining no step portion therebetween. There is also disclosed a method of manufacturing the imaging device, the method comprising a step of forming P + regions in photo-electro converting element regions and the separating region defined therebetween, respectively.

Inventors

  • 👤 Tetsuo Yamada

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 15:19
CPC Classifications
H; H10; H10F; H10F71/00; H10F71/121; H10F39/00; H10F39/10; H10F39/12; H10F39/15; H10F39/153; Y; Y02; Y02E; Y02E10/00; Y02E10/50; Y02E10/547; Y02P; Y02P70/00; Y02P70/50

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 126 words
A semiconductor device in a solid state imaging device comprising: a semiconductor layer of a first conductivity type; one or more photo-electro converting elements, of a second conductivity type, formed in said semiconductor layer, said converting elements being arranged in a predetermined pattern; one or more charge transfer elements, of said second conductivity type, formed in said semiconductor layer, said charge transfer elements transferring charges generated in said converting elements; and one or more further elements of said first conductivity type for suppressing the flow of dark current through the surface of said semiconductor layer, said further elements being formed in said photo-electro converting elements and in the separating region defined therebetween, said further elements having an impurity concentration higher than that of said semiconductor layer.
Claim 2
Dependent Claim 126 words
A semiconductor device in a solid state imaging device comprising: a semiconductor layer of a first conductivity type; one or more photo-electro converting elements, of a second conductivity type, formed in said semiconductor layer, said converting elements being arranged in a predetermined pattern; one or more charge transfer elements, of said second conductivity type, formed in said semiconductor layer, said charge transfer elements transferring charges generated in said converting elements; and one or more further elements of said first conductivity type for suppressing the flow of dark current through the surface of said semiconductor layer, said further elements being formed in said photo-electro converting elements and in the separating region defined therebetween, said further elements having an impurity concentration higher than that of said semiconductor layer.
Claim 3
Dependent Claim 33 words
A semiconductor device according to claim 1, wherein the solid stage imaging device further comprises a semiconductor substrate having a second conductivity type, and said semiconductor layer is formed on said semiconductor substrate.

References Cited (Backward Citations)

US4011105A Cited
US4389661A Cited
US4498013A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-10-20 1990-04-21 1990-10-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-10-20 1994-04-21 1994-10-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-10-20 1998-04-21 1998-10-21 $7700.00 Window Closed / Lapsed

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