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US4609614A Expired / Lapsed US ⏱️ 0.0 years remaining

Process of using absorptive layer in optical lithography with overlying photoresist layer to form relief pattern on substrate

Assignee: Intersil Corp
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Filing: 1985-06-24
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Granted: 1986-09-02
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Expires: 2005-06-24
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Abstract

Abstract A multilayer, photoresist recording medium is disclosed which comprises an absorptive layer and an oxygen plasma-resistant photoresist layer thereover. The structure is substantially free of intermixing of the two layers and separation of the photoresist layer during processing. The absorptive layer is formed by a two-step curing of a composition comprising a solution of a multifunctional acrylate or methacrylate monomer, a suitable dye and a photoinitiator in a suitable solvent. A coating of this composition is rapidly solidified to form an absorptive layer by high intensity irradiation and then baked to remove residual solvent and assure complete polymerization of the monomer.

Inventors

  • 👤 Thomas R. Pampalone
  • 👤 Ahmad H. Khan
  • 👤 James J. DiPiazza

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 01:44
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/09; G03F7/094

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 137 words
A process of forming a relief pattern on a substrate of a multilayer photoresist recording medium consisting of an absorptive layer and a photoresist layer thereover, said process comprising: (a) coating the substrate with a composition consisting essentially of a solution of a polyfunctional acrylate or methacrylate monomer, a dye having a high absorption at the wavelengths useful to irradiate the photoresist layer and a photoinitiator in a solvent; (b) curing said composition in two steps comprising irradiating with an irradiation source that will rapidly solidify the composition to form an absorptive layer and baking to remove residual solvent therefrom; (c) applying a layer of oxygen plasma-resistant photoresist thereover; (d) pattern irradiating and developing the photoresist layer, thus exposing a portion of the absorptive layer; and (e) plasma etching the exposed absorptive layer with an oxygen plasma.
Claim 2
Dependent Claim 137 words
A process of forming a relief pattern on a substrate of a multilayer photoresist recording medium consisting of an absorptive layer and a photoresist layer thereover, said process comprising: (a) coating the substrate with a composition consisting essentially of a solution of a polyfunctional acrylate or methacrylate monomer, a dye having a high absorption at the wavelengths useful to irradiate the photoresist layer and a photoinitiator in a solvent; (b) curing said composition in two steps comprising irradiating with an irradiation source that will rapidly solidify the composition to form an absorptive layer and baking to remove residual solvent therefrom; (c) applying a layer of oxygen plasma-resistant photoresist thereover; (d) pattern irradiating and developing the photoresist layer, thus exposing a portion of the absorptive layer; and (e) plasma etching the exposed absorptive layer with an oxygen plasma.
Claim 3
Dependent Claim 27 words
A process in accordance with claim 1 wherein the polyfunctional monomer is selected from the group consisting of trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, hexamethylenediol diacrylate and pentaerythritol triacrylate.
Claim 4
Dependent Claim 14 words
A process in accordance with claim 2, wherein the polyfunctional monomer is pentaerythritol triacrylate.
Claim 5
Dependent Claim 14 words
A process in accordance with claim 1, wherein the dye is Disperse Yellow 201.
Claim 6
Dependent Claim 17 words
A process in accordance with claim 1, wherein the photoresist is a diazoquinone/novolac resin type positive photoresist.
Claim 7
Dependent Claim 20 words
A process in accordance with claim 1, wherein the composition is irradiated in step (b) with a pulsed xenon lamp.

References Cited (Backward Citations)

US3873313A Cited
US4244799A Cited
US4384040A Cited
US4362809A Cited
US4370405A Cited
US4522681A Cited
US4535053A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-09-01 1990-03-03 1990-09-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-09-01 1994-03-03 1994-09-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-09-01 1998-03-03 1998-09-02 $7700.00 Window Closed / Lapsed

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