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Ceramic wiring board and process for producing the same

Assignee: Hitachi Ltd
•
Filing: 1985-09-17
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Granted: 1986-08-26
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Expires: 2005-09-17
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Abstract

Abstract A ceramic wiring board comprising a silica board having pores of several ten to several hundred Å in diameter amounting to 5 to 20 vol % of the insulating layer, and a process for producing the same, which comprises heat-treating a silicon alkoxide to form a fine silica powder and sintering the fine powder. This board has good mechanical characteristics and a high signal propagation speed.

Inventors

  • 👤 Gyozo Toda
  • 👤 Tsuyoshi Fujita
  • 👤 Hiromi Tosaki
  • 👤 Takashi Kuroki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 20:15
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W99/00; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 17 words
A ceramic wiring board comprising an insulating layer made of silica and having pores in said silica.
Claim 2
Dependent Claim 17 words
A ceramic wiring board comprising an insulating layer made of silica and having pores in said silica.
Claim 3
Dependent Claim 24 words
A ceramic wiring board as claimed in claim 1, wherein the pore volume amounts to 5 to 20 vol % of said insulating layer.
Claim 4
Dependent Claim 19 words
A ceramic wiring board as claimed in claim 2, wherein the average pore diameter is 50 to 800 Å.
Claim 5
Dependent Claim 16 words
A ceramic wiring board as claimed in claim 3, wherein the pore shape is substantially spherical.
Claim 6
Dependent Claim 38 words
A process for producing a ceramic wiring board, comprising the steps of heat-treating a silicon alkoxide to form a fine silica powder, and sintering said fine silica powder to form an insulating layer having pores in the silica.
Claim 7
Dependent Claim 38 words
A process for producing a ceramic wiring board, comprising the steps of heat-treating a silicon alkoxide to form a fine silica powder, and sintering said fine silica powder to form an insulating layer having pores in the silica.

References Cited (Backward Citations)

US4387131A Cited
US4299873A Cited
US4465727A Cited
US4418025A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-08-25 1990-02-24 1990-08-26 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-08-25 1994-02-24 1994-08-26 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-08-25 1998-02-24 1998-08-26 $7700.00 Window Closed / Lapsed

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