US4608316A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic wiring board and process for producing the same
Assignee: Hitachi Ltd
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Filing: 1985-09-17
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Granted: 1986-08-26
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Expires: 2005-09-17
Abstract
Abstract A ceramic wiring board comprising a silica board having pores of several ten to several hundred Å in diameter amounting to 5 to 20 vol % of the insulating layer, and a process for producing the same, which comprises heat-treating a silicon alkoxide to form a fine silica powder and sintering the fine powder. This board has good mechanical characteristics and a high signal propagation speed.
Inventors
- 👤 Gyozo Toda
- 👤 Tsuyoshi Fujita
- 👤 Hiromi Tosaki
- 👤 Takashi Kuroki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 08:43
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W99/00; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
17 words
A ceramic wiring board comprising an insulating layer made of silica and having pores in said silica.
Claim 2
Dependent Claim
17 words
A ceramic wiring board comprising an insulating layer made of silica and having pores in said silica.
Claim 3
Dependent Claim
24 words
A ceramic wiring board as claimed in claim 1, wherein the pore volume amounts to 5 to 20 vol % of said insulating layer.
Claim 4
Dependent Claim
19 words
A ceramic wiring board as claimed in claim 2, wherein the average pore diameter is 50 to 800 Å.
Claim 5
Dependent Claim
16 words
A ceramic wiring board as claimed in claim 3, wherein the pore shape is substantially spherical.
Claim 6
Dependent Claim
38 words
A process for producing a ceramic wiring board, comprising the steps of heat-treating a silicon alkoxide to form a fine silica powder, and sintering said fine silica powder to form an insulating layer having pores in the silica.
Claim 7
Dependent Claim
38 words
A process for producing a ceramic wiring board, comprising the steps of heat-treating a silicon alkoxide to form a fine silica powder, and sintering said fine silica powder to form an insulating layer having pores in the silica.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-08-25 | 1990-02-24 | 1990-08-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-08-25 | 1994-02-24 | 1994-08-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-08-25 | 1998-02-24 | 1998-08-26 | $7700.00 | Window Closed / Lapsed |