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US4606011A Expired / Lapsed US ⏱️ 0.0 years remaining

Single transistor/capacitor semiconductor memory device and method for manufacture

Assignee: Toshiba Corp
•
Filing: 1985-10-24
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Granted: 1986-08-12
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Expires: 2005-10-24
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Abstract

Abstract A semiconductor memory device and a method for manufacturing such a device provides increased capacitance for memory cells of a dynamic RAM by using the top and sides of island regions formed in the substrate.

Inventors

  • 👤 Masashi Wada
  • 👤 Shigeyoshi Watanabe
  • 👤 Fujio Masuoka

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 11:00
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/01; H10B12/02; H10B12/03; H10B12/038; H10B12/30; H10B12/37; H10D; H10D1/00; H10D1/60; H10D1/62; H10D1/66; H10D1/665; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/012; H10W10/0121; H10W10/014; H10W10/10; H10W10/13; H10W10/17

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 182 words
A semiconductor memory comprising: (a) a plurality of memory cells formed on a substrate of a first conductivity type, each said memory cell including (i) an MOS transistor having a gate and a conduction path, and (ii) an MOS capacitor coupled to one side of said conduction path, said MOS capacitor including (aa) a first electrode of a second conductivity type formed in said substrate in contact with said one side of said conduction path, said first electrode having at least three sides, (bb) a thin insulation film formed on said first electrode to cover said three sides of said first electrode, (cc) a second electrode formed on said thin insulation film and opposite each of said at least three faces, and (dd) a device protection film formed on said second electrode; (b) a plurality of word lines each coupled to the gates of ones of said plurality of MOS transistors in a different row; and (c) a plurality of bit lines each coupled to the other side of the conduction paths of ones of said MOS transistors in a different column.
Claim 2
Dependent Claim 182 words
A semiconductor memory comprising: (a) a plurality of memory cells formed on a substrate of a first conductivity type, each said memory cell including (i) an MOS transistor having a gate and a conduction path, and (ii) an MOS capacitor coupled to one side of said conduction path, said MOS capacitor including (aa) a first electrode of a second conductivity type formed in said substrate in contact with said one side of said conduction path, said first electrode having at least three sides, (bb) a thin insulation film formed on said first electrode to cover said three sides of said first electrode, (cc) a second electrode formed on said thin insulation film and opposite each of said at least three faces, and (dd) a device protection film formed on said second electrode; (b) a plurality of word lines each coupled to the gates of ones of said plurality of MOS transistors in a different row; and (c) a plurality of bit lines each coupled to the other side of the conduction paths of ones of said MOS transistors in a different column.
Claim 3
Dependent Claim 53 words
The semiconductor memory of claim 1 wherein said memory cells are formed on island regions of said substrate, each island region having a top and at least two sides and wherein said at least three sides of said electrode include portions of the top and at least two sides of said island regions.
Claim 4
Dependent Claim 16 words
The semiconductor memory of claim 2 wherein two memory cells are formed on each island region.
Claim 5
Dependent Claim 58 words
The semiconductor memory of claim 2 wherein said island regions are separated by grooves and wherein said memory further comprises a device separation region of said first conductivity type at the bottom of each said groove and a field isolation film filling part of said groove, said field isolation film having a top surface which is substantially flat.
Claim 6
Dependent Claim 34 words
The semiconductor memory of claim 1 wherein said thin insulation film includes a thermal oxide film, wherein said device protection film comprises SiO 2 , and wherein said word lines comprise polycrystalline silicon film.

References Cited (Backward Citations)

US4199722A Cited
US4547792A Cited
JPS58212161A Cited
JPS5972161A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-08-11 1990-02-10 1990-08-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-08-11 1994-02-10 1994-08-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-08-11 1998-02-10 1998-08-12 $7700.00 Window Closed / Lapsed

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