Patent US4605987A successfully refreshed from Google Patents.
US4605987A
Expired / Lapsed
US
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Method of controlling printed circuit board solder fillets and printed circuit boards including solder fillet control patterns
Assignee: Motorola Solutions Inc
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Filing: 1983-12-22
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Granted: 1986-08-12
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Expires: 2003-12-22
Abstract
Abstract A solder fillet control pattern provides a predictable solder quality control for the components mounted on printed circuit boards. The pattern can include a plurality of solder fillet control boxes, which define the individual component locations. The pattern allows for a greatly increased component packing density on the boards without increasing soldering defects.
Inventors
- 👤 Dana R. Allensworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 18:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3452; H05K1/00; H05K1/02; H05K1/0266; H05K1/0269; H05K3/341; H05K3/3431; H05K3/3442; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2201/09818; H05K2201/099; H05K2201/09909; H05K2201/10; H05K2201/10431; H05K2201/10507; H05K2201/10522; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0588; H05K2203/16; H05K2203/161; H05K2203/167; H05K2203/168; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
132 words
A printed circuit board having controlled solder fillets, on said board having a number of surface mounted components locations, which components having leadless electrodes of a predetermined height z are attached by a solder process, said board comprising: a solder resist control pattern affixed on said board around at least some of said surface mounted component locations to define the solder fillets such that the maximum distance each said solder fillet extends from said leadless electrode is not less than z; and means for controlling solder fillet width to be substantially uniform over the maximum distance each said solder fillet extends from said leadless electrode; whereby at least some of said components affixed to said board in said solder resist control pattern by the solder process are provided a predictable solder quality.
Claim 2
Dependent Claim
132 words
A printed circuit board having controlled solder fillets, on said board having a number of surface mounted components locations, which components having leadless electrodes of a predetermined height z are attached by a solder process, said board comprising: a solder resist control pattern affixed on said board around at least some of said surface mounted component locations to define the solder fillets such that the maximum distance each said solder fillet extends from said leadless electrode is not less than z; and means for controlling solder fillet width to be substantially uniform over the maximum distance each said solder fillet extends from said leadless electrode; whereby at least some of said components affixed to said board in said solder resist control pattern by the solder process are provided a predictable solder quality.
Claim 3
Dependent Claim
24 words
The board as defined in claim 1 wherein: said pattern is formed of a color contrasting with the surface thereunder to define said locations.
Claim 4
Dependent Claim
32 words
The board as defined in claim 1 wherein: said pattern includes a plurality of individual fillet control boxes, at least one box defining said pattern around each of said defined component locations.
Claim 5
Dependent Claim
25 words
The board as defined in claim 3 wherein: said boxes define substantially all of said component locations to facilitate the board design and eliminate defects.
Claim 6
Dependent Claim
32 words
The board as defined in claim 4 wherein: said boxes are rectangular in shape and overlap at least some of one another when said defined component locations are aligned end to end.
Claim 7
Dependent Claim
36 words
The board as defined in claim 4 wherein: said boxes are located adjacent one another as closely as possible on both sides of said board to increase the component density on said board without increasing defects.
Claim 8
Dependent Claim
49 words
The board as defined in claim 1 wherein: said board includes a plurality of leadless component and a plurality of lead type component mounting locations; and said pattern is affixed on said board around at least some of said leadless and some of some lead type component mounting locations.
Claim 9
Dependent Claim
32 words
The board as defined in claim 7 wherein: said pattern includes a plurality of individual fillet control boxes, at least one box defining said pattern around each of said defined component locations.
Claim 10
Dependent Claim
25 words
The board as defined in claim 8 wherein: said boxes define substantially all of said component locations to facilitate the board design and eliminate defects.
Claim 11
Dependent Claim
32 words
The board as defined in claim 9 wherein: said boxes are rectangular in shape and overlap at least some of one another when said defined component locations are aligned end to end.
Claim 12
Dependent Claim
36 words
The board as defined in claim 9 wherein: said boxes are located adjacent one another as closely as possible on both sides of said board to increase the component density on said board without increasing defects.
Claim 13
Dependent Claim
32 words
A printed circuit board having controlled solder fillets as described in claim 1, wherein said solder fillet is controlled such that the solder mass decreases with increasing distance from the leadless electrode.
Claim 14
Dependent Claim
26 words
A printed circuit board having controlled solder fillets in claim 1, wherein said solder fillets are shared by components having leadless electrodes and components having leads.
Claim 15
Dependent Claim
124 words
A printed circuit subassembly having a means for controlling the solder fillets to be formed on said subassembly, said subassembly having a number of surface mounted component locations, which components having leadless electrodes of a predetermined height z are to be attached by a solder process, said subassembly control means comprising: a solder resist control pattern affixed on said subassembly around at least some of said surface mounted component locations to define the solder fillets of substantially uniform width such that the maximum distance each said solder fillet extends from said leadless electrodes is not less than z when said subassembly and components are subjected to a solder process to provide a predictable control of the solder quality of said components on said subassembly.
Claim 16
Dependent Claim
124 words
A printed circuit subassembly having a means for controlling the solder fillets to be formed on said subassembly, said subassembly having a number of surface mounted component locations, which components having leadless electrodes of a predetermined height z are to be attached by a solder process, said subassembly control means comprising: a solder resist control pattern affixed on said subassembly around at least some of said surface mounted component locations to define the solder fillets of substantially uniform width such that the maximum distance each said solder fillet extends from said leadless electrodes is not less than z when said subassembly and components are subjected to a solder process to provide a predictable control of the solder quality of said components on said subassembly.
Claim 17
Dependent Claim
25 words
The control means as defined in claim 14 wherein: said pattern is formed of a color contrasting with the surface thereunder to define said locations.
Claim 18
Dependent Claim
33 words
The control means as defined in claim 14 wherein: said pattern includes a plurality of individual fillet control boxes, at least one box defining said pattern around each of said defined component locations.
Claim 19
Dependent Claim
26 words
The control means as defined in claim 16 wherein: said boxes define substantially all of said component locations to facilitate the board design and eliminate defects.
Claim 20
Dependent Claim
33 words
The control means as defined in claim 17 wherein: said boxes are rectangular in shape and overlap at least some of one another when said defined component locations are aligned end to end.
Claim 21
Dependent Claim
37 words
The control means as defined in claim 17 wherein: said boxes are located adjacent one another as closely as possible on both sides of said subassembly to increase the component density on said subassembly without increasing defects.
Claim 22
Dependent Claim
50 words
The control means as defined in claim 14 wherein: said subassembly includes a plurality of leadless component and a plurality of lead type component mounting locations; and said pattern is affixed on said subassembly around at least some of said leadless and some of some lead type component mounting locations.
Claim 23
Dependent Claim
33 words
The control means as defined in claim 20 wherein: said pattern includes a plurality of individual fillet control boxes, at least one box defining said pattern around each of said defined component locations.
Claim 24
Dependent Claim
26 words
The control means as defined in claim 21 wherein: said boxes define substantially all of said component locations to facilitate the board design and eliminate defects.
Claim 25
Dependent Claim
33 words
The control means as defined in claim 22 wherein: said boxes are rectangular in shape and overlap at least some of one another when said defined component locations are alignd end to end.
Claim 26
Dependent Claim
37 words
The control means as defined in claim 22 wherein: said boxes are located adjacent one another as closely as possible on both sides of said subassembly to increase the component density on said subassembly without increasing defects.
Claim 27
Dependent Claim
37 words
A printed circuit board subassembly having a means for controlling the solder fillets as described in claim 14, wherein said solder fillet is controlled such that the solder mass decreases with increasing distance from the leadless electrode.
Claim 28
Dependent Claim
33 words
A printed circuit board subassembly having a means for controlling the solder fillets as described in claim 14, wherein said solder fillets are shared by components having leadless electrodes and components having leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-08-11 | 1990-02-10 | 1990-08-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-08-11 | 1994-02-10 | 1994-08-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-08-11 | 1998-02-10 | 1998-08-12 | $7700.00 | Window Closed / Lapsed |