Patent US4605533A successfully refreshed from Google Patents.
US4605533A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame coated with aluminum as a packaging material in integrated circuits
Assignee: Sumitomo Electric Industries Ltd
•
Filing: 1985-04-19
•
Granted: 1986-08-12
•
Expires: 2005-04-19
Abstract
Abstract The present invention relates to an improvement of a packaging material for use in integrated circuits (IC) such as IC, LSI and VLSI, and in particular to an improvement of a lead frame made of iron-nickel alloys used as a material in a low-melting-point glass-ceramic package. The invention resides in provision of a lead frame faces made of an iron-nickel alloy substrate containing nickel therein at a ratio of 42 to 49% by weight and the improvement wherein an aluminium layer of 0.2 to 10 microns thick is coated on both faces and sides of the substrate.
Inventors
- 👤 Kazunao Kudoh
- 👤 Yoshikazu Hashimoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 08:33
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/01; B32B15/012; H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/457; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12542; Y10T428/12597; Y10T428/12736; Y10T428/1275; Y10T428/12757
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
86 words
In a lead frame for use in integrated circuits, in which a lead frame comprising an iron-nickel alloy substrate and a packaging ceramic are sealed with low-melting-point glass, the improvement in that both faces and sides of said iron-nickel alloy substrate containing nickel therein in a proportion of 42 to 49% by weight are coated with an aluminum layer of 0.2 to 10 microns thick such that the entire surface of the substrate in contact with the low melting point glass has a chemical layer thereupon.
Claim 2
Dependent Claim
86 words
In a lead frame for use in integrated circuits, in which a lead frame comprising an iron-nickel alloy substrate and a packaging ceramic are sealed with low-melting-point glass, the improvement in that both faces and sides of said iron-nickel alloy substrate containing nickel therein in a proportion of 42 to 49% by weight are coated with an aluminum layer of 0.2 to 10 microns thick such that the entire surface of the substrate in contact with the low melting point glass has a chemical layer thereupon.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-08-11 | 1990-02-10 | 1990-08-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-08-11 | 1994-02-10 | 1994-08-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-08-11 | 1998-02-10 | 1998-08-12 | $7700.00 | Window Closed / Lapsed |