Patent US4603867A successfully refreshed from Google Patents.
US4603867A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Spinner chuck
Assignee: Motorola Solutions Inc
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Filing: 1984-04-02
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Granted: 1986-08-05
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Expires: 2004-04-02
Abstract
Abstract A vacuum spinner chuck having improved holding power for thin wafers is obtained by providing a retention means for moveably holding an O-ring on the peripheral edge of the chuck. There is a first part-circular portion adjacent the upper surface of the chuck, arranged so that in the absence of vacuum the O-ring protrudes above the chuck surface and contacts the wafer. Below this first part-circular portion is a second sloped portion which tilts away from the surface of the spinner chuck by an angle preferably in the range 30-60 degrees. There is a smooth transition between these two portions. When vacuum is applied to the space between the wafer and the chuck, the wafer presses on the O-ring causing it to stretch and move down from the part-circular portion onto the sloped portion until the wafer rests on the surface of the chuck. The stretch creates an opposing force which holds the O-ring in contact with the wafer and the spinner chuck to prevent loss of vacuum. The stretch automatically returns the O-ring to its initial position when the vacuum is removed. The holding power of the chuck is doubled.
Inventors
- 👤 Richard R. Babb
- 👤 Howard A. Kirschler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 11:13
CPC Classifications
B; B23; B23B; B23B31/00; B23B31/02; B23B31/24; B23B31/30; B23B31/307; Y; Y10; Y10S; Y10S264/00; Y10S264/78; Y10T; Y10T279/00; Y10T279/11
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
193 words
A vacuum chuck for spinning a wafer during processing, comprising: a wafer platform for supporting said wafer on a first surface; spindle means centrally attached to said wafer platform adapted to connect said wafer platform to a means for spinning said platform; channels in said first surface of said wafer platform adapted to provide a source of suction; a depressed region in said first surface of said wafer platform located laterally exterior to said channels and adapted to receive an O-ring of a pre-determined thickness for sealing against said wafer; wherein said depressed region is wider and deeper than said pre-determined thickness; wherein said depressed region has a first sidewall portion adapted to moveably retain said O-ring so that, in the absence of said wafer, the upper surface of said O-ring protrudes above said first surface; and wherein said depressed region has a substantially straight second sidewall portion to moveably receive said O-ring, and wherein said second sidewall portion is tangentially joined to said first sidewall portion, is sloped away from said spindle means at a substantially constant angle with respect to said first surface and is located below said first sidewall portion.
Claim 2
Dependent Claim
193 words
A vacuum chuck for spinning a wafer during processing, comprising: a wafer platform for supporting said wafer on a first surface; spindle means centrally attached to said wafer platform adapted to connect said wafer platform to a means for spinning said platform; channels in said first surface of said wafer platform adapted to provide a source of suction; a depressed region in said first surface of said wafer platform located laterally exterior to said channels and adapted to receive an O-ring of a pre-determined thickness for sealing against said wafer; wherein said depressed region is wider and deeper than said pre-determined thickness; wherein said depressed region has a first sidewall portion adapted to moveably retain said O-ring so that, in the absence of said wafer, the upper surface of said O-ring protrudes above said first surface; and wherein said depressed region has a substantially straight second sidewall portion to moveably receive said O-ring, and wherein said second sidewall portion is tangentially joined to said first sidewall portion, is sloped away from said spindle means at a substantially constant angle with respect to said first surface and is located below said first sidewall portion.
Claim 3
Dependent Claim
18 words
The chuck of claim 1 wherein said angle is in the range between 20 degrees and 70 degrees.
Claim 4
Dependent Claim
18 words
The chuck of claim 2 wherein said angle is in the range between about 30 and 60 degrees.
Claim 5
Dependent Claim
202 words
A vacuum chuck for spinning a wafer during processing, comprising: a wafer platform for supporting said wafer on a first surface; spindle means centrally attached to said wafer platform adapted to connect said wafer platform to a means for spinning said platform; channels in said first surface of said wafer platform adapted to provide a source of suction; a depressed region in said first susrface of said wafer platform located laterally exterior to said channels and adapted to receive an O-ring of a pre-determined thickness for sealing against said wafer; wherein said depressed region is wider and deeper than said pre-determined thickness; wherein said depressed region has a first sidewall portion adapted to moveably retain said O-ring so that, in the absence of said wafer, the upper surface of said O-ring protrudes above said first surface; wherein said depressed region has a second portion sloped away from said spindle means at a substantially constant angle with respect to said first surface and located below said first sidewall portion; and wherein said first sidewall portion has a toroidal-shape conforming to the interior radius of said O-ring and said second sloped portion has a conical-shape and wherein said first and second portions join tangentially.
Claim 6
Dependent Claim
202 words
A vacuum chuck for spinning a wafer during processing, comprising: a wafer platform for supporting said wafer on a first surface; spindle means centrally attached to said wafer platform adapted to connect said wafer platform to a means for spinning said platform; channels in said first surface of said wafer platform adapted to provide a source of suction; a depressed region in said first susrface of said wafer platform located laterally exterior to said channels and adapted to receive an O-ring of a pre-determined thickness for sealing against said wafer; wherein said depressed region is wider and deeper than said pre-determined thickness; wherein said depressed region has a first sidewall portion adapted to moveably retain said O-ring so that, in the absence of said wafer, the upper surface of said O-ring protrudes above said first surface; wherein said depressed region has a second portion sloped away from said spindle means at a substantially constant angle with respect to said first surface and located below said first sidewall portion; and wherein said first sidewall portion has a toroidal-shape conforming to the interior radius of said O-ring and said second sloped portion has a conical-shape and wherein said first and second portions join tangentially.
Claim 7
Dependent Claim
272 words
A rotatable holder for wafer processing, comprising: a platform having a first surface adapted to receive said wafer; spindle means centrally coupled to said platform at a right angle thereto for rotating said first surface about the longitudinal axis of said spindle; retention means at the periphery of said first surface adapted to moveably retain an O-ring for sealing against said wafer and having a depth greater than the thickness of said O-ring; wherein said retention means comprises a recessed region located below said first surface and adapted to moveably retain said O-ring in a first position so that a first portion of said O-ring for contacting said wafer protrudes above said first surface; wherein said O-ring retention means comprises an extension portion, located beneath said recessed region and smoothly joined therewith, and sloping away from said first surface at an angle with respect to said first surface of not less than the angle of said recessed region measured with respect to said first surface in a plane perpendicular to said first surface where said recessed region intersects said extension region; and wherein said recessed region has a cross-section whose perimeter comprises a sector of a circle, wherein said sector of said circle has a center of curvature located beneath said first surface by a distance less than the radius of curvature of said circle, wherein said extension portion has a cross-section whose perimeter comprises a substantially straight line sloping away from said first surface at a predetermined substantially constant angle, and wherein said sector of said circle and said line intersect tangentially at a point located below said center of curvature.
Claim 8
Dependent Claim
272 words
A rotatable holder for wafer processing, comprising: a platform having a first surface adapted to receive said wafer; spindle means centrally coupled to said platform at a right angle thereto for rotating said first surface about the longitudinal axis of said spindle; retention means at the periphery of said first surface adapted to moveably retain an O-ring for sealing against said wafer and having a depth greater than the thickness of said O-ring; wherein said retention means comprises a recessed region located below said first surface and adapted to moveably retain said O-ring in a first position so that a first portion of said O-ring for contacting said wafer protrudes above said first surface; wherein said O-ring retention means comprises an extension portion, located beneath said recessed region and smoothly joined therewith, and sloping away from said first surface at an angle with respect to said first surface of not less than the angle of said recessed region measured with respect to said first surface in a plane perpendicular to said first surface where said recessed region intersects said extension region; and wherein said recessed region has a cross-section whose perimeter comprises a sector of a circle, wherein said sector of said circle has a center of curvature located beneath said first surface by a distance less than the radius of curvature of said circle, wherein said extension portion has a cross-section whose perimeter comprises a substantially straight line sloping away from said first surface at a predetermined substantially constant angle, and wherein said sector of said circle and said line intersect tangentially at a point located below said center of curvature.
Claim 9
Dependent Claim
24 words
The platform of claim 5 wherein said sector of said circle has an included angle in the range of about 60 to 140 degrees.
Claim 10
Dependent Claim
24 words
The platform of claim 6 wherein said sector of said circle has an included angle in the range of about 80 to 120 degrees.
Claim 11
Independent Claim
141 words
A method for spinning a wafer comprising: providing a wafer chuck having a peripheral seal holding groove with a conical skirt below said groove; providing in said groove a moveable circular seal for contacting and sealing against said wafer and said wafer chuck, wherein a portion of said seal protrudes from a first surface of said chuck; placing a wafer on said seal above said first surface; applying a pressing force to said wafer in a direction toward said first surface; moving said seal, in contact with said wafer and said wafer chuck, downwards over said conical skirt without substantially crushing said seal while simultaneously radially stretching said seal to provide an opposing force for sealing and for automatically restoring said seal to its position prior to said applying step after spinning is stopped; and spinning said chuck and said wafer.
Claim 12
Independent Claim
141 words
A method for spinning a wafer comprising: providing a wafer chuck having a peripheral seal holding groove with a conical skirt below said groove; providing in said groove a moveable circular seal for contacting and sealing against said wafer and said wafer chuck, wherein a portion of said seal protrudes from a first surface of said chuck; placing a wafer on said seal above said first surface; applying a pressing force to said wafer in a direction toward said first surface; moving said seal, in contact with said wafer and said wafer chuck, downwards over said conical skirt without substantially crushing said seal while simultaneously radially stretching said seal to provide an opposing force for sealing and for automatically restoring said seal to its position prior to said applying step after spinning is stopped; and spinning said chuck and said wafer.
Claim 13
Dependent Claim
33 words
The method of claim 8 further comprising, after said applying step, moving said wafer in the direction of said pressing force to lie substantially flat against said first surface of said wafer chuck.
Claim 14
Independent Claim
141 words
A method for mounting a fragile wafer on a chuck for processing, comprising: providing a chuck having a seal holding means including a conical skirt located below a first surface of said chuck, for retaining a moveable seal for contacting and sealing against said wafer and said chuck, wherein a portion of said seal protrudes from said first surface of said chuck and wherein said seal holding means and skirt together have a depth perpendicular to said surface exceeding the thickness of said seal; placing a wafer on said seal above said first surface; applying a pressing force to said wafer in a direction toward said first surfaqce; moving said seal away from said surface along said conical skirt, in contact with said wafer and said chuck, without substantially crushing said seal; and applying a centrifugal force to said moveable seal.
Claim 15
Independent Claim
141 words
A method for mounting a fragile wafer on a chuck for processing, comprising: providing a chuck having a seal holding means including a conical skirt located below a first surface of said chuck, for retaining a moveable seal for contacting and sealing against said wafer and said chuck, wherein a portion of said seal protrudes from said first surface of said chuck and wherein said seal holding means and skirt together have a depth perpendicular to said surface exceeding the thickness of said seal; placing a wafer on said seal above said first surface; applying a pressing force to said wafer in a direction toward said first surfaqce; moving said seal away from said surface along said conical skirt, in contact with said wafer and said chuck, without substantially crushing said seal; and applying a centrifugal force to said moveable seal.
Claim 16
Dependent Claim
29 words
The method of claim 10 wherein said step of applying said centrifugal force comprises rotating said moveable seal about an axis substantially perpendicular to the plane of said wafer.
Claim 17
Independent Claim
179 words
A method for holding wafers, comprising: providing a wafer chuck having a first surface containing a vacuum suction means, an elastic seal, and a retaining means for moveably retaining said elastic seal, wherein said retaining means has a depth greater than the thickness of said seal, a first portion for initially locating said seal adjacent said first surface, and a second portion adjacent said first portion for retracting said seal so as to be, except for irregularities in said wafer, substantially flush with said first surface; locating said elastic seal in said first portion of said retaining means so that it initially protrudes from said first surface by a predetermined distance; placing a wafer on the protruding surface of said elastic seal; applying vacuum suction to draw said wafer toward said first surface; and retracting said seal by moving said seal perpendicular to said first surface by a first amount not more than said pre-determined distance while at the same time radially stretching said seal by a second amount directly proportional to said first amount and spinning said chuck.
Claim 18
Independent Claim
179 words
A method for holding wafers, comprising: providing a wafer chuck having a first surface containing a vacuum suction means, an elastic seal, and a retaining means for moveably retaining said elastic seal, wherein said retaining means has a depth greater than the thickness of said seal, a first portion for initially locating said seal adjacent said first surface, and a second portion adjacent said first portion for retracting said seal so as to be, except for irregularities in said wafer, substantially flush with said first surface; locating said elastic seal in said first portion of said retaining means so that it initially protrudes from said first surface by a predetermined distance; placing a wafer on the protruding surface of said elastic seal; applying vacuum suction to draw said wafer toward said first surface; and retracting said seal by moving said seal perpendicular to said first surface by a first amount not more than said pre-determined distance while at the same time radially stretching said seal by a second amount directly proportional to said first amount and spinning said chuck.
Claim 19
Dependent Claim
189 words
A rotatable holder for wafer processing, comprising: a platform having a first surface adapted to receive said wafer; spindle means centrally coupled to said platform at a right angle thereto for rotating said first surface about the longitudinal axis of said spindle; retention means at the periphery of said first surface adapted to moveably retain an O-ring for sealing against said wafer and having a depth greater than the thickness of said O-ring; wherein said retention means comprises a recessed region located below said first surface and adapted to moveably retain said O-ring in a first position so that a first portion of said O-ring for contacting said wafer protrudes above said first surface; and wherein said O-ring retention means comprises an extension portion for moveably receiving said O-ring, located beneath said recessed region and smoothly joined therewith, and sloping away from said first surface at a subtantially constant angle with respect to said first surface of not less than the angle of said recessed region measured with respect to said first surface in a plane perpendicular to said first surface where said recessed region intersects said extension region.
Claim 20
Dependent Claim
189 words
A rotatable holder for wafer processing, comprising: a platform having a first surface adapted to receive said wafer; spindle means centrally coupled to said platform at a right angle thereto for rotating said first surface about the longitudinal axis of said spindle; retention means at the periphery of said first surface adapted to moveably retain an O-ring for sealing against said wafer and having a depth greater than the thickness of said O-ring; wherein said retention means comprises a recessed region located below said first surface and adapted to moveably retain said O-ring in a first position so that a first portion of said O-ring for contacting said wafer protrudes above said first surface; and wherein said O-ring retention means comprises an extension portion for moveably receiving said O-ring, located beneath said recessed region and smoothly joined therewith, and sloping away from said first surface at a subtantially constant angle with respect to said first surface of not less than the angle of said recessed region measured with respect to said first surface in a plane perpendicular to said first surface where said recessed region intersects said extension region.
Claim 21
Dependent Claim
16 words
The chuck of claim 13 wherein said angle is in the range 20 to 70 degrees.
Claim 22
Dependent Claim
16 words
The chuck of claim 13 wherein said angle is in the range 30 to 60 degrees.
Claim 23
Dependent Claim
140 words
A vacuum chuck for retaining a wafer, comprising: a first surface of said chuck adapted to receive said wafer; suction means in said first surface for applying suction to said wafer to cause it to move toward said first surface; and retention means in said first surface for moveably retaining an O-ring for sealing against said wafer and said chuck while said O-ring slides or rolls away from said first surface in response to the motion of said wafer toward said first surface, said retention means having a first portion adjacent said first surface for initially locating said O-ring so that it partially protrudes from said first surface and a second portion below said first portion, joining smoothly therewith, and making an angle with respect to said first surface which does not decrease with increasing distance from said first surface.
Claim 24
Dependent Claim
140 words
A vacuum chuck for retaining a wafer, comprising: a first surface of said chuck adapted to receive said wafer; suction means in said first surface for applying suction to said wafer to cause it to move toward said first surface; and retention means in said first surface for moveably retaining an O-ring for sealing against said wafer and said chuck while said O-ring slides or rolls away from said first surface in response to the motion of said wafer toward said first surface, said retention means having a first portion adjacent said first surface for initially locating said O-ring so that it partially protrudes from said first surface and a second portion below said first portion, joining smoothly therewith, and making an angle with respect to said first surface which does not decrease with increasing distance from said first surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-08-04 | 1990-02-03 | 1990-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-08-04 | 1994-02-03 | 1994-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-08-04 | 1998-02-03 | 1998-08-05 | $7700.00 | Window Closed / Lapsed |