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US4603471A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for making a CMOS circuit having a reduced tendency to latch by controlling the band-gap of source and drain regions

Assignee: Fairchild Semiconductor Corp
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Filing: 1984-09-06
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Granted: 1986-08-05
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Expires: 2004-09-06
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Abstract

Abstract The tendency of a CMOS circuit to latch up is reduced by implanting ions of germanium or tin into the source and drain regions of the circuit. The low energy gap of these ions lowers the band gap of the source and drain regions, which in turn inhibits their ability to inject carriers into the substrate and well.

Inventors

  • 👤 Robert J. Strain

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 19:01
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/202; H10P30/204; H10D; H10D62/00; H10D62/10; H10D62/13; H10D62/149; H10D62/151; H10D62/80; H10D62/83; H10D62/834; H10D84/00; H10D84/80; H10D84/82; H10D84/83; H10D84/85; H10D84/854; H10P30/208; Y; Y10; Y10S; Y10S148/00; Y10S148/061; Y10S438/00; Y10S438/914; Y10S438/918

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 67 words
In a CMOS integrated circuit comprising complementary NMOS and PMOS transistors formed on a substrate, a method for reducing the tendency of the circuit to latch comprising the step of implanting ions into the source region of each of the NMOS and PMOS transistors, said ions being of a material having an energy gap which is lower than the energy gap of the material forming the substrate.
Claim 2
Dependent Claim 67 words
In a CMOS integrated circuit comprising complementary NMOS and PMOS transistors formed on a substrate, a method for reducing the tendency of the circuit to latch comprising the step of implanting ions into the source region of each of the NMOS and PMOS transistors, said ions being of a material having an energy gap which is lower than the energy gap of the material forming the substrate.
Claim 3
Dependent Claim 26 words
The method of claim 1 wherein ions of said lower energy gap material are also implanted into the drain regions of said NMOS and PMOS transistors.
Claim 4
Dependent Claim 20 words
The method of claim 1 wherein the substrate is made of silicon and said lower energy gap material is germanium.
Claim 5
Dependent Claim 20 words
The method of claim 1 wherein the substrate is made of silicon and said lower energy gap material is tin.
Claim 6
Dependent Claim 132 words
In a CMOS integrated circuit comprising a substrate of one conductivity, a source and a drain each of a conductivity opposite to said one conductivity formed in said substrate, a well of said opposite conductivity formed in said substrate and a source and a drain of said one conductivity formed in said well, a method for reducing the tendency of the circuit to latch up comprising the steps of modifying the energy gap of one of said substrate and said source of said opposite conductivity so that the energy gap of said source is less than that of said substrate, and modifying the energy gap of one of said well and said source of said one conductivity so that the energy gap of said source is less than that of said well.
Claim 7
Dependent Claim 132 words
In a CMOS integrated circuit comprising a substrate of one conductivity, a source and a drain each of a conductivity opposite to said one conductivity formed in said substrate, a well of said opposite conductivity formed in said substrate and a source and a drain of said one conductivity formed in said well, a method for reducing the tendency of the circuit to latch up comprising the steps of modifying the energy gap of one of said substrate and said source of said opposite conductivity so that the energy gap of said source is less than that of said substrate, and modifying the energy gap of one of said well and said source of said one conductivity so that the energy gap of said source is less than that of said well.
Claim 8
Dependent Claim 32 words
The method of claim 5 wherein said modifying steps comprise implanting said sources with ions of a material having a lower energy gap than the material forming said substrate and said well.

References Cited (Backward Citations)

US3796929A Cited
US4111719A Cited
US4511408A Cited
US4498224A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-08-04 1990-02-03 1990-08-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-08-04 1994-02-03 1994-08-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-08-04 1998-02-03 1998-08-05 $7700.00 Window Closed / Lapsed

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