US4600968A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device package having regions of different thermal properties
Assignee: Fuji Electric Co Ltd
•
Filing: 1984-11-13
•
Granted: 1986-07-15
•
Expires: 2004-11-13
Abstract
Abstract In the particular embodiments of the invention described in the specification, a semiconductor package is made from two modules, one containing a semiconductor element having a high allowable temperature and the other containing a circuit component having a lower allowable temperature. The modules are combined by corresponding embossed and recessed surfaces or by pin connection or by a connecting screw.
Inventors
- 👤 Tsuneto Sekiya
- 👤 Osamu Matsuura
- 👤 Shooichi Huruhata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 06:17
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K10/00
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
170 words
A semiconductive package comprising a first case of a first resin having a relatively high heat resistance and including semiconductive elements tolerant of relatively high operating temperatures and free of components intolerant of an operating temperature in excess of a given temperature, and a second case of a second resin having a relatively lower heat resistance and including semiconductive elements intolerant of operating temperatures in excess of the given temperature, the first case including a first set of terminals for interconnecting its components with the components in the second case, the second case including a second set of terminals for interconnecting its components with the components in the first case, one of two sets of terminals projecting from its case, the other of the two sets being in recessed means in its case, the projecting terminals removably merging with the terminals in the recessed means, electrically interconnecting the two sets of terminals and merging the two cases together to form an intimate interface between the two cases at the merger.
Claim 2
Dependent Claim
170 words
A semiconductive package comprising a first case of a first resin having a relatively high heat resistance and including semiconductive elements tolerant of relatively high operating temperatures and free of components intolerant of an operating temperature in excess of a given temperature, and a second case of a second resin having a relatively lower heat resistance and including semiconductive elements intolerant of operating temperatures in excess of the given temperature, the first case including a first set of terminals for interconnecting its components with the components in the second case, the second case including a second set of terminals for interconnecting its components with the components in the first case, one of two sets of terminals projecting from its case, the other of the two sets being in recessed means in its case, the projecting terminals removably merging with the terminals in the recessed means, electrically interconnecting the two sets of terminals and merging the two cases together to form an intimate interface between the two cases at the merger.
References Cited (Backward Citations)
US2976806A
Cited
US3054024A
Cited
US3267334A
Cited
US3290559A
Cited
US3555364A
Cited
US3723833A
Cited
US4423465A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-07-14 | 1990-01-13 | 1990-07-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-07-14 | 1994-01-13 | 1994-07-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-07-14 | 1998-01-13 | 1998-07-15 | $7700.00 | Window Closed / Lapsed |