Curable, partially advanced epoxy resins

Claim 2

A partially advanced epoxy resin composition comprising a product resulting from reacting a composition comprising (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule; (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups; (C) (1) optionally, one or more catalysts for promoting the reaction between components (A) and (B); (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles; or (3) a combination of (1) and (2); and (D) one or more stabilizer materials; wherein (i) components (A), (B), (C) and (D) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A); from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A); the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1 and component (D) is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage; and (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is greater than about 20 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D) with the proviso that said partially advanced composition is melt flowable at or below about 250° C. and if said increase in melt viscosity is greater than about 1250 percent, a solvent is required.

Claim 3

A partially advanced epoxy resin of claim 1 wherein (i) component (A) is a polyglycidyl ether of a polyhydric aromatic compound; (ii) component (B) is selected from phthaleins, sulfonphthaleins, or xanthenes having at least two hydroxyl groups per molecule; those materials represented by formulas (I), (II) or (III) in the specification or a combination thereof; (iii) components (A), (B), (C) and (D) are present in quantities which provide from about 0.15 to about 0.85 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.00005 to about 0.05 mole of component (C1) per epoxide equivalent in component (A); from about 0.05 to about 0.75 equivalent of component (C2) per epoxide equivalent in component (A); the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.2:1 to about 1.05:1; and from about 0.0001 to about 0.01 mole of component (D) per epoxide equivalent in component (A); and (iv) the composition is partially advanced to the extent that the melt viscosity has increased to a value of from about 25 to about 625 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D).

Claim 4

A partially advanced epoxy resin composition of claim 2 wherein (i) component (A) is selected from those compounds represented by formulas (IV), (V), (VI) or (VII) in the specification, diglycidyl ethers of phthaleins, sulfonphthaleins or xanthanes or a combination thereof; (ii) components (A) and (B) are employed in quantities which provide from about 0.25 to about 0.75 active hydrogen equivalent per epoxide equivalent; (iii) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof and is employed in an amount of from about 0.0001 to about 0.03 mole per epoxide equivalent in component (A); (iv) component (C2) is selected from amines, aromatic sulfonic acid amides, imidazoles or a combination thereof and is present in a quantity of from about 0.075 to about 0.75 equivalents per epoxide equivalent in component (A); (v) the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.325:1 to about 1:1; (vi) component (D) is selected from organic or inorganic acids, salts or esters of organic and inorganic acids or a combination thereof and is present in a quantity which provides from about 0.0005 to about 0.005 mole per epoxide equivalent in component (A); and (vii) the composition is partially advanced to the extend that the melt viscosity has advanced to a value of from about 50 percent to about 300 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D).

Claim 5

A partially advanced epoxy resin composition of claim 3 wherein (i) component (A) is a diglycidyl ether of bisphenol A, bisphenol S, bisphenol K, tetrabromobisphenol A, phenolphthalein, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, tetramethyltribromodihydroxybiphenyl, the triglycidyl ether of tris(hydroxyphenyl)methane or a combination thereof; (ii) component (B) is tetrabromobisphenol A, bisphenol A, bisphenol K, bisphenol S, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, dimethylhydantoin, tetramethyltribromodihydroxy-biphenyl, tetramethylbisphenol K, tetrabromobisphenol K or a combination thereof; (iii) components (C2) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicyclic acid, 2-methylimidazole, 4,4'-diaminodiphenylsulfone or a combination thereof; and (iv) component (D) is p-toluene sulfonic acid, benzene sulfonic acid, methyl p-toluene sulfonate, ammonium perchlorate, fluoboric acid, perchloric acid, nitric acid or a combination thereof.

Claim 6

A partially advanced epoxy resin of claim 4 wherein (i) component (A) is a diglycidyl ether of bisphenol A having an average epoxide equivalent weight of from about 170 to about 300; (ii) component (B) is bisphenol A, tetramethyltribromodihydroxybiphenyl or tetrabromobisphenol A; (iii) component (C) is a mixture of components (C1) and (C2); (iv) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and fluoboric acid in a respective molar ratio of from about 1:0.9 to about 1:1.25, 2-methylimidazole or a combination thereof; (v) component (C2) is sulfanilamide, 4,4'-diaminodiphenylsulfone, or a combination thereof; and (vi) component (D) is methyl p-toluenesulfonate, fluoboric acid or a combination thereof.

Claim 7

A product resulting from reacting and curing a composition comprising a mixture of (I) a partially advanced epoxy resin of claims 1, 2, 3, 4 or 5; (II) at least one curing agent therefor; and (III) optionally, a catalytic quantity of one or more catalysts for effecting the reaction between components (IA) and (IB); and wherein the components are employed in an equivalent ratio of (IA):(IB):(IC2+II) of from about 1:0.1:0.5 to about 1:0.9:0.2; the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.6:1 to about 1.1:1 and the combined quantity of components (IC1) and (III) is that which provides from about zero to about 0.2 mole of catalyst per epoxide equivalent in component (IA).

Claim 8

A product of claim 6 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.15:0.7 to about 1:0.85:0.2; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.85:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0001 to about 0.1 mole of catalyst per epoxide equivalent in component (IA).

Claim 9

A product of claim 7 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.25:0.65 to about 1:0.75:0.3; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.9:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0005 to about 0.05 mole of catalyst per epoxide equivalent in component (IA).

Claim 10

A product of claim 8 wherein (i) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof; and (ii) component (II) is selected from amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, guanidines, aromatic sulfonic acid amides, imidazoles or a combination thereof.

Claim 11

A product of claim 9 wherein (i) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and fluoboric acid in a respective molar ratio of from about 1:0.9 to about 1:1.25, 2-methylimidazole or a combination thereof; and (ii) component (II) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicylic acid, 2-methylimidazole, dicyandiamide, 4,4'-diaminodiphenylsulfone or a combination thereof.

Claim 12

A product of claim 6 which is a structural or an electrical laminate or composite.

Claim 13

A product of claim 7 which is a structural or an electrical laminate or composite.

Claim 14

A product of claim 8 which is a structural or an electrical laminate or composite.

Claim 15

A product of claim 9 which is a structural or an electrical laminate or composite.

Claim 16

A product of claim 10 which is a structural or an electrical laminate or composite.

Claim 17

A product of claim 6 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 18

A product of claim 7 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 19

A product of claim 8 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 20

A product of claim 9 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 21

A product of claim 10 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 22

A laminating varnish comprising a mixture of (I) a partially advanced epoxy resin of claims 1, 2, 3, 4 or 5; (II) at least one curing agent therefor; and (III) optionally, a catalytic quantity of one or more catalysts for effecting the reaction between components (IA) and (IB); and (IV) optionally, one or more solvents in a quantity sufficient to provide a suitable application viscosity; and wherein the components are employed in an equivalent ratio of (IA):(IB):(IC2+II) of from about 1:0.1:0.5 to about 1:0.9:0.2; the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.6:1 to about 1.1:1 and the combined quantity of components (IC1) and (III) is that which provides from about zero to about 0.2 mole of catalyst per epoxide equivalent in component (IA).

Claim 23

A laminating varnish of claim 21 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.15:0.7 to about 1:0.85:0.2; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.85:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0001 to about 0.1 mole of catalyst per epoxide equivalent in component (IA).

Claim 24

A laminating varnish of claim 22 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.25:0.65 to about 1:0.75:0.3; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.9:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0005 to about 0.05 mole of catalyst per epoxide equivalent in component (IA).

Claim 25

A laminating varnish of claim 23 wherein (i) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof; and (ii) component (II) is selected from amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, guanidines, aromatic sulfonic acid amides, imidazoles or a combination thereof.

Claim 26

A laminating varnish of claim 24 wherein (i) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and fluoboric acid in a respective molar ratio of from about 1:0.9 to about 1:1.2, 2-methylimidazole or a combination thereof; and (ii) component (II) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicylic acid, 2-methylimidazole, dicyandiamide, 4,4'-diaminodiphenylsulfone or a combination thereof.

Claim 27

The product resulting from B-staging a substrate which has been impregnated or coated with a laminating varnish of claim 21.

Claim 28

The product resulting from B-staging a substrate which has been impregnated or coated with a laminating varnish of claim 22.

Claim 29

The product resulting from B-staging a substrate which has been impregnated or coated with a laminating varnish of claim 23.

Claim 30

The product resulting from B-staging a substrate which has been impregnated or coated with a laminating varnish of claim 24.

Claim 31

The product resulting from B-staging a substrate which has been impregnated or coated with a laminating varnish of claim 25.

Claim 32

A laminate or composite resulting from curing one or more plies of claim 26.

Claim 33

A laminate or composite resulting from curing one or more plies of claim 27.

Claim 34

A laminate or composite resulting from curing one or more plies of claim 28.

Claim 35

A laminate or composite resulting from curing one or more plies of claim 29.

Claim 36

A laminate or composite resulting from curing one or more plies of claim 30.

Claim 37

A solvent free, partially advanced, epoxy resin composition comprising a product resulting from reacting a composition comprising (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule; (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups; (C) (1) optionally, one or more catalysts for promoting the reaction between components (A) and (B); (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles; or (3) a combination of (1) and (2); and (D) optionally, one or more stabilizer materials; wherein (i) components (A), (B), (C) and (D) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A) and the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1; from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A); and component (D), when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage; and (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is at least about 1250 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D); with the proviso that said partially advanced composition is melt flowable at or below about 250° C.

Claim 38

A solvent free, partially advanced, epoxy resin composition comprising a product resulting from reacting a composition comprising (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule; (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups; (C) (1) optionally, one or more catalysts for promoting the reaction between components (A) and (B); (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles; or (3) a combination of (1) and (2); and (D) optionally, one or more stabilizer materials; wherein (i) components (A), (B), (C) and (D) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A) and the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1; from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A); and component (D), when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage; and (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is at least about 1250 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D); with the proviso that said partially advanced composition is melt flowable at or below about 250° C.

Claim 39

A solvent free, partially advanced, epoxy resin of claim 36 wherein (i) component (A) is a polyglycidyl ether of a polyhydric aromatic compound; (ii) component (B) is selected from phthaleins, sulfonphthaleins, or xanthenes having at least two hydroxyl groups per molecule; those materials represented by formulas (I), (II) or (III) in the specification or a combination thereof; and (iii) components (A), (B), (C) and (D) are present in quantities which provide from about 0.15 to about 0.85 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.00005 to about 0.05 mole of component (C1) per epoxide equivalent in component (A); from about 0.05 to about 0.75 equivalent of component (C2) per epoxide equivalent in component (A); the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.2:1 to about 1.05:1; and from about 0.0001 to about 0.01 mole of component (D) per epoxide equivalent in component (A).

Claim 40

A solvent free, partially advanced, epoxy resin composition of claim 37 wherein (i) component (A) is selected from those compounds represented by formulas (IV), (V), (VI) or (VII) in the specification, diglycidyl ethers of phthaleins, sulfonphthaleins or xanthanes or a combination thereof; (ii) components (A) and (B) are employed in quantities which provide from about 0.25 to about 0.75 active hydrogen equivalent per epoxide equivalent; (iii) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof and is employed in an amount of from about 0.0001 to about 0.03 mole per epoxide equivalent in component (A); (iv) component (C2) is selected from amines, aromatic sulfonic acid amides, imidazoles or a combination thereof and is present in a quantity of from about 0.075 to about 0.75 equivalents per epoxide equivalent in component (A); (v) the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.325 to about 1:1; and (vi) component (D) is selected from organic or inorganic acids, salts or esters of organic and inorganic acids or a combination thereof and is present in a quantity which provides from about zero to about 0.005 mole per epoxide equivalent in component (A).

Claim 41

A solvent free, partially advanced epoxy resin composition of claim 38 wherein (i) component (A) is a diglycidyl ether of bisphenol A, bisphenol S, bisphenol K, tetrabromobisphenol A, phenolphthalein, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, tetramethyltribromodihydroxybiphenyl, the triglycidyl ether of tris(hydroxyphenyl)methane, or a combination thereof; (ii) component (B) is tetrabromobisphenol A, bisphenol A, bisphenol K, bisphenol S, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, dimethylhydantoin, tetramethyltribromodihydroxybiphenyl, tetramethylbisphenol K, tetrabromobisphenol K or a combination thereof; (iii) component (C2) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicyclic acid, 2-methylimidazole, 4,4'-diaminodiphenylsulfone or a combination thereof; and (iv) component (D) is p-toluene sulfonic acid, benzene sulfonic acid, methyl p-toluene sulfonate, ammonium perchlorate, fluoboric acid, perchloric acid, nitric acid or a combination thereof.

Claim 42

A solvent free, partially advanced, epoxy resin of claim 39 wherein (i) component (A) is a diglycidyl ether of bisphenol A having an average epoxide equivalent weight of from about 170 to about 300; (ii) component (B) is bisphenol A, tetramethyltribromodihydroxybiphenyl or tetrabromobisphenol A; (iii) component (C) is a mixture of components (C1) and (C2); (iv) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate acetic.acid complex and a stoichiometric amount of fluoboric acid or 2-methylimidazole or a combination thereof; (v) component (C2) is sulfanilamide, 4,4'-diaminodiphenylsulfone, or a combination thereof; and (vi) component (D), when present, is methyl p-toluenesulfonate, fluoboric acid or a combination thereof.

Claim 43

A powder coating composition comprising (I) a solvent free, partially advanced, epoxy resin of claims 36, 37, 38, 39 or 40; (II) at least one curing agent therefor; and (III) optionally, a catalytic quantity of one or more catalysts for effecting the reaction between components (IA) and (IB); and wherein the components are employed in an equivalent ratio of (IA):(IB):(IC2+II) of from about 1:0.1:0.5 to about 1:0.9:0.2; the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.6:1 to about 1.1:1 and the combined quantity of components (IC1) and (III) is that which provides from about zero to about 0.2 mole of catalyst per epoxide equivalent in component (IA).

Claim 44

A powder coating composition of claim 41 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.15:0.7 to about 1:0.85:0.2; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.85:1 to about 1.05:1, and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0001 to about 0.1 mole of catalyst per epoxide equivalent in component (IA).

Claim 45

A powder coating composition of claim 42 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.25:0.65 to about 1:0.75:0.3; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.9:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0005 to about 0.05 mole of catalyst per epoxide equivalent in component (IA).

Claim 46

A powder coating composition of claim 43 wherein (i) component (II) is selected from amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, guanidines, aromatic sulfonic acid amides, imidazoles or a combination thereof; and (ii) component (III) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof.

Claim 47

A powder coating composition of claim 44 wherein (i) component (II) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicylic acid, 2-methylimidazole, dicyandiamide, 4,4'-diaminodiphenylsulfone or a combination thereof; and (ii) component (III) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and fluoboric acid in a respective molar ratio of from about 1:0.9 to about 1:1.2, 2-methylimidazole or a combination thereof.

Claim 48

A substrate coated with a cured powder coating of claim 41.

Claim 49

A substrate coated with a cured powder coating of claim 42.

Claim 50

A substrate coated with a cured powder coating of claim 43.

Claim 51

A substrate coated with a cured powder coating of claim 44.

Claim 52

A substrate coated with a cured powder coating of claim 45.

Claim 53

A partially advanced epoxy resin composition comprising a product resulting from reacting a composition comprising (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule; (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups; (C) (1) optionally, one or more catalysts for promoting the reaction between components (A) and (B); (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles; or (3) a combination of (1) and (2); (D) one or more solvents; and (E) optionally, one or more stabilizer materials; wherein (i) components (A), (B), (C), (D) and (E) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A); from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A); the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1; component (D) is present in a quantity of from about 5 to about 90 percent by weight of the combined weight of components (A), (B), (C) and (D); and component (E) when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage; and (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is greater than about 20 percent greater than the melt viscosity of the initial mixture of components (A), (B) and (C) with the proviso that reacted components (A), (B) and (C) of said partially advanced composition is soluble in component (D).

Claim 54

A partially advanced epoxy resin composition comprising a product resulting from reacting a composition comprising (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule; (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups; (C) (1) optionally, one or more catalysts for promoting the reaction between components (A) and (B); (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles; or (3) a combination of (1) and (2); (D) one or more solvents; and (E) optionally, one or more stabilizer materials; wherein (i) components (A), (B), (C), (D) and (E) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A); from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A); the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1; component (D) is present in a quantity of from about 5 to about 90 percent by weight of the combined weight of components (A), (B), (C) and (D); and component (E) when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage; and (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is greater than about 20 percent greater than the melt viscosity of the initial mixture of components (A), (B) and (C) with the proviso that reacted components (A), (B) and (C) of said partially advanced composition is soluble in component (D).

Claim 55

A partially advanced epoxy resin of claim 51 wherein (i) component (A) is a polyglycidyl ether of a polyhydric aromatic compound; (ii) component (B) is selected from phthaleins, sulfonphthaleins, or xanthenes having at least two hydroxyl groups per molecule; those materials represented by formulas (I), (II) or (III) in the specification or a combination thereof; (iii) components (A), (B), (C) and (D) are present in quantities which provide from about 0.15 to about 0.85 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.0005 to about 0.05 mole of component (C1) per epoxide equivalent in component (A); from about 0.05 to about 0.75 equivalent of component (C2) per epoxide equivalent in component (A); the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.2:1 to about 1.05:1; and from about 10 to about 40 percent by weight of component (D) based upon the combined weight of components (A), (B), (C) and (D); and (iv) the composition is partially advanced to the extent that the melt viscosity has advanced to a value of from about 25 to about 625 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C), (D) and (E).

Claim 56

A partially advanced epoxy resin composition of claim 52 wherein (i) component (A) is selected from those compounds represented by formulas (IV), (V), (VI) or (VII) in the specification, diglycidyl ethers of phthaleins, sulfonphthaleins or xanthanes or a combination thereof; (ii) components (A) and (B) are employed in quantities which provide from about 0.25 to about 0.75 active hydrogen equivalent per epoxide equivalent; (iii) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof and is employed in an amount of from about 0.0001 to about 0.03 mole per epoxide equivalent in component (A); (iv) component (C2) is selected from amines, aromatic sulfonic acid amides, imidazoles or a combination thereof and is present in quantity of from about 0.075 to about 0.75 equivalents per epoxide equivalent in component (A); (v) the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.325:1 to about 1:1; (vi) component (D) is selected from ketones, alcohols, glycol ethers, aromatic and aliphatic hydrocarbons, cyclic ethers, halogenated hydrocarbons, nitro-substituted hydrocarbons, amides or a combination thereof; and (vii) the composition is partially advanced to the extent that the melt viscosity has advanced to a value of from about 50 to about 300 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C), (D) and (E).

Claim 57

A partially advanced epoxy resin composition of claim 53 wherein (i) component (A) is a diglycidyl ether of bisphenol A, bisphenol S, bisphenol K, tetrabromobisphenol A, phenolphthalein, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, tetramethyltribromodihydroxybiphenyl, the triglycidyl ether of tris(hydroxyphenyl)methane, or a combination thereof; (ii) component (B) is tetrabromobisphenol A, bisphenol A, bisphenol K, bisphenol S, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, dimethylhydantoin, tetramethyltribromodihydroxybiphenyl, tetramethylbisphenol K, tetrabromobisphenol K or a combination thereof; (iii) component (C2) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicyclic acid, 2-methylimidazole, 4,4'-diaminodiphenylsulfone or a combination thereof; and (iv) component (D) is acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl amyl ketone, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, ethylene glycol monobutyl ether, methylene chloride, chloroform, 2-nitropropane or a combination thereof.

Claim 58

A partially advanced epoxy resin of claim 54 wherein (i) component (A) is a diglycidyl ether of bisphenol A having an average epoxide equivalent weight of from about 170 to about 300; (ii) component (B) is bisphenol A, tetramethyltribromodihydroxybiphenyl or tetrabromobisphenol A; (iii) component (C) is a mixture of components (C1) and (C2); (iv) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and fluoboric acid in a respective molar ratio of from about 1:0.9 to about 1:1.25, 2-methylimidazole or a combination thereof; (v) component (C2) is sulfanilamide, 4,4'-diaminodiphenylsulfone, or a combination thereof; and (vi) component (D) is acetone, methyl ethyl ketone, methyl isobutyl ketone, methylene chloride or combination thereof.

Claim 59

A partially advanced epoxy resin of claim 51 wherein (i) component (A) is a polyglycidyl ether of a polyhydric aromatic compound; (ii) component (B) is selected from phthaleins, sulfonphthaleins, or xanthenes having at least two hydroxyl groups per molecule; those materials represented by formulas (I), (II) or (III) in the specification or a combination thereof; (iii) components (A), (B), (C) and (D) are present in quantities which provide from about 0.15 to about 0.85 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.00005 to about 0.05 mole of component (C1) per epoxide equivalent in component (A); from about 0.05 to about 0.75 equivalent of component (C2) per epoxide equivalent in component (A); the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.2:1 to about 1.05:1; and from about 40 to about 80 percent by weight of component (D) based on the combined weight of components (A), (B), (C) and (D); and (iv) the composition is partially advanced to the extent that the melt viscosity has advanced to a value of from about 25 to about 625 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C), (D) and (E).

Claim 60

A partially advanced epoxy resin composition of claim 56 wherein (i) component (A) is selected from those compounds represented by formulas (IV), (V), (VI) or (VII) in the specification, diglycidyl ethers or phthaleins, sulfonphthaleins or xanthanes or a combination thereof; (ii) components (A) and (B) are employed in quantities which provide from about 0.25 to about 0.75 active hydrogen equivalent per epoxide equivalent; (iii) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof and is employed in an amount of from about 0.0001 to about 0.03 mole per epoxide equivalent in component (A); (iv) component (C2) is selected from amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, guanidines, aromatic sulfonic acid amides, imidazoles or a combination thereof and is present in a quantity of from about 0.075 to about 0.75 equivalents per epoxide equivalent in component (A); (v) the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.325:1 to about 1:1; (vi) component (D) is selected from ketones, alcohols, glycol ethers, aromatic and aliphatic hydrocarbons, cyclic ethers, halogenated hydrocarbons, nitro-substituted hydrocarbons, amides or a combination thereof; and (vii) the composition is partially advanced to the extent that the melt viscosity has advanced to a value of from about 50 to about 300 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C), (D) and (E).

Claim 61

A partially advanced epoxy resin composition of claim 57 wherein (i) component (A) is a diglycidyl ether of bisphenol A, bisphenol S, bisphenol K, tetrabromobisphenol A, phenolphthalein, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, tetramethyltribromohydroxybiphenyl, the triglycidyl ether of tris(hydroxyphenyl)methane, or a combination thereof; (ii) component (B) is tetrabromobisphenol A, bisphenol A, bisphenol K, bisphenol S, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, dimethylhydantoin, tetramethyltribromodihydroxybiphenyl, tetramethylbisphenol K, tetrabromobisphenol K or a combination thereof; (iii) component (C2) is sulfanilamide, methylene dianiline, triethylenetretramine, diaminocyclohexane, 4-aminosalicyclic acid, 2-methylimidazole, dicyandiamide, 4,4'-diaminodiphenylsulfone or a combination thereof; and (iv) component (D) is acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl amyl ketone, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, ethylene glycol monobutyl ether, methylene chloride, chloroform, 2-nitropropane or a combination thereof.

Claim 62

A partially advanced epoxy resin of claim 58 wherein (i) component (A) is a diglycidyl ether of bisphenol A having an average epoxide equivalent weight of from about 170 to about 300; (ii) component (B) is bisphenol A, tetramethyltribromodihydroxybiphenyl or tetrabromobisphenol A; (iii) component (C) is a mixture of components (C1) and (C2); (iv) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and fluoboric acid in a respective molar ratio of from about 1:0.9 to about 1:1.25, 2-methylimidazole or a combination thereof; (v) component (C2) is sulfanilamide, 4,4'-diaminodiphenylsulfone, or a combination thereof; and (vi) component (D) is acetone, methyl ethyl ketone, methyl isobutyl ketone, methylene chloride or a combination thereof.

Claim 63

A product resulting from reacting and curing a composition comprising a mixture of (I) a partially advanced epoxy resin of claims 51, 52, 53, 54, 55, 56, 57, 58 or 59; (II) at least one curing agent therefor; and (III) optionally, a catalytic quantity of one or more catalysts for effecting the reaction between components (IA) and (IB); and wherein the components are employed in a equivalent ratio of (IA):(IB):(IC2+II) of from about 1:0.1:0.5 to about 1:0.9:0.2; the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.6:1 to about 1.1:1 and the combined quantity of components (IC1) and (III) is that which provides from about zero to about 0.2 mole of catalyst per epoxide equivalent in component (IA).

Claim 64

A product of claim 60 wherein (i) the eqivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.15:0.7 to about 1:0.85:0.2; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.85:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0001 to about 0.1 mole of catalyst per epoxide equivalent in component (IA).

Claim 65

A product of claim 61 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.25:0.65 to about 1:0.75:0.3; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.9:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0005 to about 0.05 mole of catalyst per epoxide equivalent in component (IA).

Claim 66

A product of claim 62 wherein (i) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof; and (ii) component (II) is selected from amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, guanidines, aromatic sulfonic acid amides, imidazoles or a combination thereof.

Claim 67

A product of claim 63 wherein (i) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and fluoboric acid in a respective molar ratio of from about 1:0.9 to about 1:1.25, 2-methylimidazole or a combination thereof; and (ii) component (II) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicylic acid, 2-methylimidazole, dicyandiamide, 4,4'-diaminodiphenylsulfone or a combination thereof.

Claim 68

A product of claim 60 which is a structural or an electrical laminate or composite.

Claim 69

A product of claim 61 which is a structural or an electrical laminate or composite.

Claim 70

A product of claim 62 which is a structural or an electrical laminate or composite.

Claim 71

A product of claim 63 which is a structural or an electrical laminate or composite.

Claim 72

A product of claim 64 which is a structural or an electrical laminate or composite.

Claim 73

A product of claim 60 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 74

A product of claim 61 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 75

A product of claim 62 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 76

A product of claim 63 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 77

A product of claim 64 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 78

A solvent free, partially advanced, epoxy resin composition comprising a product resulting from reacting a composition comprising (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule; (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups; (C) a least one of (1) one or more catalysts for promoting the reaction between components (A) and (B); (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles; or (3) a combination of (1) and (2); and (D) optionally, one or more stabilizer materials; wherein (i) components (A), (B), (C) and (D) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A) and the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1; from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A); and component (D), when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage; and (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is from about 20 to about 1250 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D).

Claim 79

A solvent free, partially advanced, epoxy resin composition comprising a product resulting from reacting a composition comprising (A) at least one relatively low equivalent weight epoxy resin having an average of more than one vicinal epoxy group per molecule; (B) at least one extender material having an average of about two active hydrogen atoms per molecule which are reactive with vicinal epoxy groups; (C) a least one of (1) one or more catalysts for promoting the reaction between components (A) and (B); (2) one or more epoxy resin curing agents selected from the group consisting of amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, aromatic sulfonic acid amides and imidazoles; or (3) a combination of (1) and (2); and (D) optionally, one or more stabilizer materials; wherein (i) components (A), (B), (C) and (D) are present in quantities which provide from about 0.1 to about 0.9 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.05 to about 0.9 equivalent of component (C2) per epoxide equivalent in component (A) and the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.15:1 to about 1.1:1; from about zero to about 0.1 mole of component (C1) per epoxide equivalent in component (A); and component (D), when present, is present in a quantity which is sufficient to reduce the viscosity increase of the resultant partially advanced epoxy resin composition during storage; and (ii) the composition is partially advanced to the extent that the melt viscosity has increased to a value which is from about 20 to about 1250 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D).

Claim 80

A solvent free, partially advanced, epoxy resin of claim 75 wherein (i) component (A) is a polyglycidyl ether of a polyhydric aromatic compound; (ii) component (B) is selected from phthaleins, sulfonphthaleins, or xanthenes having at least two hydroxyl groups per molecule; those materials represented by formulas (I), (II) or (III) in the specification or a combination thereof; (iii) components (A), (B), (C) and (D) are present in quantities which provide from about 0.15 to about 0.85 active hydrogen equivalent in component (B) per epoxide equivalent in component (A); from about 0.00005 to about 0.05 mole of component (C1) per epoxide equivalent in component (A); from about 0.05 to about 0.75 equivalent of component (C2) per epoxide equivalent in component (A); the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.2:1 to about 1.05:1; and from about zero to about 0.01 mole of component (D) per epoxide equivalent in component (A); and (iv) the composition is partially advanced to the extent that the melt viscosity has increased to a value of from about 25 to about 625 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D).

Claim 81

A solvent free, partially advanced, epoxy resin composition of claim 76 wherein (i) component (A) is selected from those compounds represented by formulas (IV), (V), (VI) or (VII) in the specification, diglycidyl ethers of phthaleins, sulfonphthaleins or xanthanes or a combination thereof; (ii) components (A) and (B) are employed in quantities which provide from about 0.25 to about 0.75 active hydrogen equivalent per epoxide equivalent; (iii) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof and is employed in an amount of from about 0.0001 to about 0.03 mole per epoxide equivalent in component (A); (iv) component (C2) is selected from amines, aromatic sulfonic acid amides or a combination thereof and is present in a quantity of from about 0.075 to about 0.75 equivalents per epoxide equivalent in component (A); (v) the combined equivalents of components (B) and (C2) per epoxide equivalent in component (A) is from about 0.325 to about 1:1; (vi) component (D) is selected from organic or inorganic acids, salts or esters of organic and inorganic acids or a combination thereof and is present in a quantity which provides from about zero to about 0.005 mole per epoxide equivalent in component (A); and (vii) the composition is partially advanced to the extent that the melt viscosity has increased to a value of from about 50 to about 300 percent greater than the melt viscosity of the initial mixture of components (A), (B), (C) and (D).

Claim 82

A solvent free, partially advanced, epoxy resin composition of claim 77 wherein (i) component (A) is a diglycidyl ether of bisphenol A, bisphenol S, bisphenol K, tetrabromobisphenol A, phenolphthalein, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, tetramethyltribromodihydroxybiphenyl, the triglycidyl ether of tris(hydroxyphenyl)methane, or a combination thereof; (ii) component (B) is tetrabromobisphenol A, bisphenol A, bisphenol K, bisphenol S, 3,5,3',5'-tetramethyl-2,6,2',6'-tetrabromo-4,4'-dihydroxybiphenyl, dimethylhydantion, tetramethyl tribromodihydroxybiphenyl, tetramethylbisphenol K, tetrabromobisphenol S or a combination thereof; (iii) component (C2) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicylic acid, 4,4'-diaminodiphenylsulfone or a combination thereof; and (iv) component (D), when present, is p-toluene sulfonic acid, benzene sulfonic acid, methyl p-toluene sulfonate, ammonium perchlorate, fluoboric acid, perchloric acid, nitric acid or a combination thereof.

Claim 83

A solvent free, partially advanced, epoxy resin composition of claim 78 wherein (i) component (A) is a diglycidyl ether of bisphenol A having an average epoxide equivalent weight of from about 170 to about 300; (ii) component (B) is bisphenol A, tetrabromobisphenol A or tetramethyl tribromodihydroxybiphenyl; (iii) component (C) is a mixture of components (C1) and (C2); (iv) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and a stoichiometric amount of fluoboric acid or 2-methylimidazole or a combination thereof; (v) component (C2) is sulfanilamide, 4,4'-diaminodiphenylsulfone, or a combination thereof; and (vi) component (D), when present, is methyl p-toluenesulfonate, fluoboric acid or a combination thereof.

Claim 84

A product resulting from reacting and curing a composition comprising a mixture of (I) a partially advanced epoxy resin of claims 75, 76, 77, 78 or 79; (II) at least one curing agent therefor; and (III) optionally, a catalytic quantity of one or more catalysts for effecting the reaction between components (IA) and (IB); and wherein the components are employed in an equivalent ratio of (IA):(IB):(IC2+II) of from about 1:0.1:0.5 to about 1:0.9:0.2; the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.6:1 to about 1.1:1 and the combined quantity of components (IC1) and (III) is that which provides from about zero to about 0.2 mole of catalyst per epoxide equivalent in component (IA).

Claim 85

A product of claim 80 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.15:0.7 to about 1:0.85:0.2; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.85:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0001 to about 0.1 mole of catalyst per epoxide equivalent in component (IA).

Claim 86

A product of claim 81 wherein (i) the equivalent ratio of components (IA):(IB):(IC2+II) is from about 1:0.25:0.65 to about 1:0.75:0.3; (ii) the combined equivalents of components (IB), (IC2) and (II) per epoxide equivalent in component (IA) is from about 0.9:1 to about 1.05:1; and (iii) components (IC1) and (III) are present in a combined quantity which provides from about 0.0005 to about 0.05 mole of catalyst per epoxide equivalent in component (IA).

Claim 87

A product of claim 82 wherein (i) component (C1) is a quaternary phosphonium or ammonium compound, an imidazole or a combination thereof; and (ii) component (II) is selected from amines, mercaptans, carboxylic acids, carboxylic acid anhydrides, guanidines, aromatic sulfonic acid amides, imidazoles or a combination thereof.

Claim 88

A product of claim 83 wherein (i) component (C1) is the product resulting from a mixture of a quaternary phosphonium acetate.acetic acid complex and fluoboric acid in a respective molar ratio of from about 1:0.9 to about 1:1.25, 2-methylimidazole or a combination thereof; and (ii) component (II) is sulfanilamide, methylene dianiline, triethylenetetramine, diaminocyclohexane, 4-aminosalicylic acid, 2-methylimidazole, dicyandiamide, 4,4'-diaminodiphenylsulfone or a combination thereof.

Claim 89

A product of claim 80 which is a structural or an electrical laminate or composite.

Claim 90

A product of claim 81 which is a structural or an electrical laminate or composite.

Claim 91

A product of claim 82 which is a structural or an electrical laminate or composite.

Claim 92

A product of claim 83 which is a structural or an electrical laminate or composite.

Claim 93

A product of claim 84 which is a structural or an electrical laminate or composite.

Claim 94

A product of claim 80 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 95

A product of claim 81 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 96

A product of claim 82 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 97

A product of claim 83 which is a coating, casting, adhesive, encapsulated article or molded article.

Claim 98

A product of claim 84 which is a coating, casting, adhesive, encapsulated article or molded article.