US4592944A
Expired / Lapsed
US
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Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article
Assignee: International Business Machines Corp
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Filing: 1984-07-12
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Granted: 1986-06-03
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Expires: 2004-07-12
Abstract
Abstract An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR2## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein X is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer with the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.
Inventors
- 👤 Roger J. Clark
- 👤 James Economy
- 👤 Mary A. Flandera
- 👤 John R. Susko
- 👤 Robin A. Wheater
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 07:11
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/025; H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
201 words
An electronic circuit comprising: a substrate; electrically conductive pattern on said substrate in the form of at least one integrated circuit chip and a top seal coating for protecting the top side of circuit which contains the at least one integrated circuit chip from corrosion or electromigration or both and wherein said top seal coating is a continuous film formed from a soluble polymerizable oligomer wherein said oligomer is obtained from 1,3,5-triethynylbenzene, has a molecular weight of about 400 to about 2000, at least 60% of the acetylenic groups thereof are diacetylenic groups, each molecule of the oligomer contains at least two acetylenic groups, and the oligomer contains up to 20% by weight ethnyl content; and wherein said film is formed from a composition containing said oligomer and a plasticizer or toughening agent or both; wherein said plasticizer is selected from the group of diphenyldiacetylene, diphenylbutadiene, diphenylether, phenyltriethynyl silane, 4,4'diethynyl diphenyl ether, or mixtures thereof and said toughening agent is selected from the group of aromatic diphenylether, cyclized poly-(arylacetylene)polymer, acrylonitrile polymers, polyimides, polyquinoxalines, polyesters, polysilicones, or mixtures thereof; and wherein the plasticizer or toughening agent, or both, is employed in amounts of 10% to 75% by weight based upon the oligomer.
Claim 2
Dependent Claim
201 words
An electronic circuit comprising: a substrate; electrically conductive pattern on said substrate in the form of at least one integrated circuit chip and a top seal coating for protecting the top side of circuit which contains the at least one integrated circuit chip from corrosion or electromigration or both and wherein said top seal coating is a continuous film formed from a soluble polymerizable oligomer wherein said oligomer is obtained from 1,3,5-triethynylbenzene, has a molecular weight of about 400 to about 2000, at least 60% of the acetylenic groups thereof are diacetylenic groups, each molecule of the oligomer contains at least two acetylenic groups, and the oligomer contains up to 20% by weight ethnyl content; and wherein said film is formed from a composition containing said oligomer and a plasticizer or toughening agent or both; wherein said plasticizer is selected from the group of diphenyldiacetylene, diphenylbutadiene, diphenylether, phenyltriethynyl silane, 4,4'diethynyl diphenyl ether, or mixtures thereof and said toughening agent is selected from the group of aromatic diphenylether, cyclized poly-(arylacetylene)polymer, acrylonitrile polymers, polyimides, polyquinoxalines, polyesters, polysilicones, or mixtures thereof; and wherein the plasticizer or toughening agent, or both, is employed in amounts of 10% to 75% by weight based upon the oligomer.
Claim 3
Dependent Claim
47 words
The circuit of claim 1 wherein said oligomer has about 6 to 20% free ethynyl groups per aromatic ring, a M z of about 1500 to about 2500, a M w of about 1000 to about 1200, and a M n of about 700 to about 900.
Claim 4
Dependent Claim
32 words
The circuit of claim 1 wherein the plasticizer or toughening agent or both is employed in amounts of about 25 to about 50% by weight based upon the weight of the oligomer.
Claim 5
Dependent Claim
62 words
The electronic circuit of claim 1 wherein said at least one integrated circuit chip is attached to said substrate by solder and wherein said coating provides for a continuous pin-hole free coating of the solder pattern between the substrate and said at least one integrated circuit chip and provides for an excellent α particle barrier beneath said at least one integrated chip.
Claim 6
Dependent Claim
18 words
The circuit of claim 1 wherein the thickness of the coating is about 5 to about 50 microns.
Claim 7
Dependent Claim
18 words
The circuit of claim 1 wherein the thickness of the coating is about 12 to about 25 microns.
Claim 8
Dependent Claim
21 words
The circuit of claim 1 wherein said toughening agent is selected from the group of aromatic diphenyl ether and cyclized poly(arylacetylene)polymers.
Claim 9
Dependent Claim
22 words
The circuit of claim 1 wherein the continuous film is formed from a composition which also contains a solvent for said oligomer.
Claim 10
Dependent Claim
13 words
The circuit of claim 8 wherein said solvent includes a reactive acetylenic solvent.
Claim 11
Dependent Claim
25 words
The circuit of claim 9 wherein said acetylenic solvent is represented by the formula ##STR15## wherein R is H, halogen, lower alkyl, or lower alkoxy.
Claim 12
Dependent Claim
11 words
The circuit of claim 10 wherein said acetylenic solvent is phenylacetylene.
Claim 13
Dependent Claim
12 words
The circuit of claim 8 wherein said solvent includes a nonreactive solvent.
Claim 14
Dependent Claim
13 words
The circuit of claim 12 wherein said nonreactive solvent is an oxygen-containing solvent.
Claim 15
Dependent Claim
20 words
The circuit of claim 13 wherein said nonreactive solvent is selected from the group of alcohols, (bis)2-methoxyethyl(ether), cyclohexanone, and methyl-2-pyrrolidinone.
Claim 16
Dependent Claim
17 words
The circuit of claim 14 wherein said alcohol is selected from the group of 1-butanol and 2-ethoxyethanol.
Claim 17
Dependent Claim
23 words
The circuit of claim 14 wherein said oligomer is present in amounts of about 5 to about 80 mg per ml of solvent.
Claim 18
Dependent Claim
29 words
The circuit of claim 14 wherein said solvent is a mixture of about 5 to about 30 parts of ethoxyethanol and about 70 to about 95 parts of 1-methyl-2-pyrrolidinone.
Claim 19
Dependent Claim
26 words
The circuit of claim 14 wherein said solvent is a mixture of 1-methyl-2-pyrrolidinone and 1-butanol in a ratio of about 50 parts to about 50 parts.
Claim 20
Dependent Claim
24 words
The circuit of claim 14 wherein said solvent is a mixture of cyclohexanone and ethoxyethanol in a ratio of about 60 to about 'parts.
Claim 21
Independent Claim
224 words
A method for providing a top seal coating on a substrate containing an electrically conductive pattern in the form of at least one integrated circuit chip which comprises coating a major surface of said substrate which contains said at least one integrated circuit chip with a composition containing a soluble polymerizable oligomer wherein said oligomer is obtained from 1,3,5-triethynylbenzene; has a molecular weight of about 400 to about 2000, at least 60% of the acetylenic groups thereof are diacetylenic groups, each molecule of the oligomer contains at least two acetylenic groups, and the oligomer contains up to 20% by weight ethnyl content; wherein said film is formed from a composition containing said oligomer and a plasticizer or toughening agent, or both, said plasticizer is selected from the group of diphenyldiacetylene, diphenylbutadiene, diphenylether, phenyltriethynyl silane, 4,4'diethynyl diphenyl ether, or mixtures thereof, and said toughening agent is selected from the group of aromatic diphenylether, cyclized poly(arylacetylene)polymer, acrylonitrile polymers, polyimides, polyquinoxalines, polyesters, polysilicones, or mixtures thereof; and wherein the plasticizer or toughening agent, or both, is employed in amounts of 10% to 75% by weight based upon the oligomer; and then hardening the composition by further polymerization to thereby provide a top seal coating for protecting the major surface of the substrate which contains said at least one integrated circuit chip from corrosion or electromigration or both.
Claim 22
Independent Claim
224 words
A method for providing a top seal coating on a substrate containing an electrically conductive pattern in the form of at least one integrated circuit chip which comprises coating a major surface of said substrate which contains said at least one integrated circuit chip with a composition containing a soluble polymerizable oligomer wherein said oligomer is obtained from 1,3,5-triethynylbenzene; has a molecular weight of about 400 to about 2000, at least 60% of the acetylenic groups thereof are diacetylenic groups, each molecule of the oligomer contains at least two acetylenic groups, and the oligomer contains up to 20% by weight ethnyl content; wherein said film is formed from a composition containing said oligomer and a plasticizer or toughening agent, or both, said plasticizer is selected from the group of diphenyldiacetylene, diphenylbutadiene, diphenylether, phenyltriethynyl silane, 4,4'diethynyl diphenyl ether, or mixtures thereof, and said toughening agent is selected from the group of aromatic diphenylether, cyclized poly(arylacetylene)polymer, acrylonitrile polymers, polyimides, polyquinoxalines, polyesters, polysilicones, or mixtures thereof; and wherein the plasticizer or toughening agent, or both, is employed in amounts of 10% to 75% by weight based upon the oligomer; and then hardening the composition by further polymerization to thereby provide a top seal coating for protecting the major surface of the substrate which contains said at least one integrated circuit chip from corrosion or electromigration or both.
Claim 23
Dependent Claim
21 words
The method of claim 20 wherein said toughening agent is selected from the group of aromatic diphenyl ether and cyclized poly(arylacetylene)polymers.
Claim 24
Dependent Claim
60 words
The method of claim 20 which further comprises soldering said at least one integrated circuit chip to said substrate and wherein said coating provides for a continuous pin-hole free coating of the solder pattern between the substrate and said at least one integrated circuit chip and provides for an excellent α particle barrier beneath said at least one integrated chip.
Claim 25
Dependent Claim
20 words
The method of claim 20 wherein the thickness of said coating after polymerization is about 5 to about 50 microns.
Claim 26
Dependent Claim
20 words
The method of claim 20 wherein the thickness of said coating after polymerization is about 12 to about 25 microns.
Claim 27
Dependent Claim
12 words
The method of claim 20 wherein said substrate is a ceramic substrate.
Claim 28
Dependent Claim
47 words
The method of claim 20 wherein said oligomer has about 6 to 20% free ethynyl groups per aromatic ring, a M z of about 1500 to about 2500, a M w of about 1000 to about 1200, and a M n of about 700 to about 900.
Claim 29
Dependent Claim
32 words
The method of claim 20 wherein the plasticizer or toughening agent or both is employed in amounts of about 25 to about 50% by weight based upon the weight of the oligomer.
Claim 30
Dependent Claim
22 words
The method of claim 20 wherein the continuous film is formed from a composition which also contains a solvent for said oligomer.
Claim 31
Dependent Claim
17 words
The method of claim 20 wherein said composition is subjected to elevated temperature to cause further polymerization.
Claim 32
Dependent Claim
16 words
The method of claim 29 wherein said elevated temperature is about 150° to about 250° C.
Claim 33
Dependent Claim
20 words
The method of claim 29 wherein said composition is subjected to elevated temperatures for about 1/2 to about 5 hours.
Claim 34
Dependent Claim
20 words
The method of claim 29 wherein said composition is subjected to elevated temperatures for about 1/2 to about 2 hours.
Claim 35
Dependent Claim
20 words
The method of claim 30 wherein said composition is subjected to elevated temperatures for about 1/2 to about 2 hours.
Claim 36
Dependent Claim
28 words
The method of claim 20 wherein said solvent includes a reactive acetylenic solvent represented by the formula ##STR16## wherein R is H, halogen, lower alkyl, or lower alkoxy.
Claim 37
Dependent Claim
11 words
The method of claim 34 wherein said acetylenic solvent is phenylacetylene.
Claim 38
Dependent Claim
12 words
The method of claim 20 wherein said solvent includes a nonreactive solvent.
Claim 39
Dependent Claim
20 words
The method of claim 36 wherein said nonreactive solvent is selected from the group of alcohols, (bis)2-methoxyethyl(ether), cyclohexanone, and 1-methyl-2-pyrrodidinone.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-06-02 | 1989-12-02 | 1990-06-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-06-02 | 1993-12-02 | 1994-06-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-06-02 | 1997-12-02 | 1998-06-03 | $7700.00 | Window Closed / Lapsed |