Poly(arylacetylene) molding compositions

Claim 2

A molding composition comprising a blend of (1) a prepolymer of at least one polyacetylenically substituted aromatic compound selected from the group consisting of diethynylbenzene; diethynyltoluene; diethynylxylene; diethynylbiphenyl; 9,10-diethynylanthracene; 9,10-diethynylphenanthrene; di(ethynylphenyl)ether; 1-chloro-2,5-diethynylbenzene; 2,3,5,6-tetrachloro-1,4-diethynylbenzene; 4,4'-diethynyl-transazobenzene; diphenylbutadiyne; 2,2'-dichlorodiphenyldiacetylene; 4,4'-dichlorodiphenyldiacetylene; 4,4'-dibromodiphenyldiacetylene; di-p-tolydiacetylene; di-α-naphthyldiacetylene; dibenzyldiacetylene; 1,4-bis(phenylethynyl)benzene; 1,3-bis(phenylethynyl)benzene; 9,10-bis(phenylethynyl)anthracene; 1,3,5-triethynylbenzene; 1,2,4-triethynylbenzene; 1,3,5-tris(phenylethynyl)-2,4,6-triphenylbenzene; 1,2,4-tris(phenylethynyl)-3,5,6-triphenylbenzene and tris(ethynylphenyl)benzene, said prepolymer having a number average molecular weight of from about 900 to about 12,000, a ratio of aromatic protons to olefinic protons greater than about 2.4 and containing from about 5 to about 20% acetylenic groups by weight of the prepolymer, with (2) from about 2 to about 70% by weight of the prepolymer, of at least one monomeric acetylenically substituted aromatic compound having a melting point below about 185° C. and a boiling point above about 250° C. and being selected from the group consisting of β-naphthylacetylene; biphenylacetylene; 4-ethynyl-trans-azobenzene; diphenylacetylene, di-o-tolylacetylene; di-m-tolylacetylene; bis(4-ethylphenyl)acetylene; bis(3,4-dimethylphenyl)acetylene; bis(4-chlorophenyl)acetylene; di(α-naphthyl)acetylene; β-naphthylphenylacetylene; phenyl benzoyl acetylene; 1,4-diethynylnaphthalene; 9,10-diethynylanthracene; 9,10-diethynylphenanthrene; 4,4'-diethynylbiphenyl; 4,4'-diethynyl-trans-azobenzene; 4,4'-diethynyldiphenyl ether; 2,3,5,6-tetrachloro-1,4-diethynylbenzene; diphenylbutadiyne; 2,2'-dichlorodiphenyldiacetylene; 3,3'-dichlorodiphenyldiacetylene; di-p-tolyldiacetylene; di-α-naphthyldiacetylene; dibenzyldiacetylene and diethynyldiphenyldiacetylene.

Claim 3

The molding composition of claim 1 containing from about 5 to about 70%, by weight of the composition, of a filler.

Claim 4

The molding composition of claim 1 wherein the prepolymer comprises a polymer of a diethynylbenzene.

Claim 5

The molding composition of claim 3 wherein the monomeric acetylenically substituted aromatic compound is diphenylacetylene.

Claim 6

The molding composition of claim 3 wherein the polymer of a diethynylbenzene is a copolymer of a diethynylbenzene and diphenylbutadiyne.

Claim 7

The molding composition of claim 3 wherein the polymer of a diethynylbenzene is a copolymer of a diethynylbenzene and phenylacetylene.

Claim 8

The molding composition of claim 6 wherein the monomeric acetylenically substituted aromatic compound is diphenylbutadiyne.

Claim 9

A thermoset resin comprising a copolymer of the prepolymer and the monomeric acetylenically substituted aromatic compound of claim 1.

Claim 10

The thermoset resin of claim 8 having a flexural strength of at least about 4000 p.s.i. and a flexural modulus of at least about 350,000 p.s.i.

Claim 11

The thermoset resin of claim 8 wherein the prepolymer comprises a polymer of a diethynylbenzene.

Claim 12

The thermoset resin of claim 10 wherein the monomeric acetylenically substituted aromatic compound is diphenylbutadiyne.

Claim 13

The thermoset resin of claim 10 wherein the monomeric acetylenically substituted aromatic compound is diphenylacetylene.

Claim 14

The thermoset resin of claim 10 wherein the monomeric acetylenically substituted aromatic compound is 4,4-diethynyldiphenyl ether.

Claim 15

The thermoset resin of claim 10 wherein the polymer of a diethynylbenzene is a copolymer of a diethynylbenzene and diphenylbutadiyne.

Claim 16

The thermoset resin of claim 10 wherein the polymer of a diethynylbenzene is a copolymer of a diethynylbenzene and phenylacetylene.

Claim 17

The thermoset resin of claim 15 wherein the monomeric acetylenically substituted aromatic compound is diphenylbutadiyne.

Claim 18

The thermoset resin of claim 8 wherein the prepolymer is a polymer of di(ethynylphenyl) ether.

Claim 19

The thermoset resin of claim 8 wherein the prepolymer is a polymer of diethynylbiphenyl.

Claim 20

The thermoset resin of claim 8 containing from about 5 to about 70%, by weight of the resin, composition of a filler.

Claim 21

The process of preparing a thermoset resin essentially free pf aliphatic unsaturation which comprises (1) in a first stage (a) preparing a prepolymer by polymerizing at least one polyacetylenically substituted aromatic compound by heating said compound with an aromatization catalyst in an inert organic diluent to a temperature of from about 55° C. to about 250° C. until from about 30% to about 90% of said compound has been converted to polymer, said compound being selected from the group consisting of diethynylbenzene; diethynyltoluene; diethynylxylene; diethynylbiphenyl; 9,10-diethynylanthracene; 9,10-diethynylphenanthrene; di(ethynylphenyl)ether; 1-chloro-2,5-diethynylbenzene; 2,3,5,6-tetrachloro-1,4-diethynylbenzene; 4,4'-diethynyl-trans-azobenzene; diphenylbutadiyne; 2,2'-dichlorodiphenyldiacetylene; 4,4'-dichlorodiphenyldiacetylene; 4,4'-dibromodiphenyldiacetylene; di-p-tolyldiacetylene; di-α -naphthyldiacetylene; dibenzyldiacetylene; 1,4-bis(phenylethynyl)benzene; 1,3-bis(phenylethynyl)benzene; 9,10-bis(phenylethynyl)anthracene; 1,3,5-triethynylbenzene; 1,2,4-triethynylbenzene; 1,3,5-tris(phenylethynyl)2,4,6-triphenylbenzene; 1,2,4-tris(phenylethynyl)-3,5,6-triphenylbenzene and tris(ethylnylphenyl)benzene, (b) separating the prepolymer from the polymerization reaction mixture, and (2) in a second stage, (a) shaping a mixture of said prepolymer and from about 2 to about 70%, by weight of the prepolymer, of at least one monomeric acetylenically substituted aromatic compound having a melting point below about 185° C. and a boiling point above about 250° C. and being selected from the group consisting of β-naphthylacetylene; biphenylacetylene; 4-ethynyl-trans-azobenzene; diphenylacetylene, di-o-tolyacetylene; di-m-tolyacetylene; bis(4-ethylphenyl)acetylene; bis(3,4-dimethylphenyl)acetylene; bis(4-chlorophenyl)acetylene; di(α-naphthyl)acetylene; β-naphthylphenylacetylene; phenyl benzoyl acetylene; 1,4-diethynylnaphthalene; 9,10-diethynylanthracene; 9,10-diethynylphenanthrene; 4,4'-diethynylbiphenyl; 4,4'-diethynyl-trans-azobenzene; 4,4'-diethynyldiphenyl ether; 2,3,5,6-tetrachloro-1,4-diethynylbenzene; diphenylbutadiyne; 2,2'-dichlorodiphenyldiacetylene; 3,3'-dichlorodiphenyldiacetylene; di-p-tolyldiacetylene; di-α-naphthyldiacetylene; dibenzyldiacetylene and diethynyldiphenyldiacetylene, and (b) heating the shaped mixture to a temperature of from about 100° C. to about 300° C.

Claim 22

The process of preparing a thermoset resin essentially free pf aliphatic unsaturation which comprises (1) in a first stage (a) preparing a prepolymer by polymerizing at least one polyacetylenically substituted aromatic compound by heating said compound with an aromatization catalyst in an inert organic diluent to a temperature of from about 55° C. to about 250° C. until from about 30% to about 90% of said compound has been converted to polymer, said compound being selected from the group consisting of diethynylbenzene; diethynyltoluene; diethynylxylene; diethynylbiphenyl; 9,10-diethynylanthracene; 9,10-diethynylphenanthrene; di(ethynylphenyl)ether; 1-chloro-2,5-diethynylbenzene; 2,3,5,6-tetrachloro-1,4-diethynylbenzene; 4,4'-diethynyl-trans-azobenzene; diphenylbutadiyne; 2,2'-dichlorodiphenyldiacetylene; 4,4'-dichlorodiphenyldiacetylene; 4,4'-dibromodiphenyldiacetylene; di-p-tolyldiacetylene; di-α -naphthyldiacetylene; dibenzyldiacetylene; 1,4-bis(phenylethynyl)benzene; 1,3-bis(phenylethynyl)benzene; 9,10-bis(phenylethynyl)anthracene; 1,3,5-triethynylbenzene; 1,2,4-triethynylbenzene; 1,3,5-tris(phenylethynyl)2,4,6-triphenylbenzene; 1,2,4-tris(phenylethynyl)-3,5,6-triphenylbenzene and tris(ethylnylphenyl)benzene, (b) separating the prepolymer from the polymerization reaction mixture, and (2) in a second stage, (a) shaping a mixture of said prepolymer and from about 2 to about 70%, by weight of the prepolymer, of at least one monomeric acetylenically substituted aromatic compound having a melting point below about 185° C. and a boiling point above about 250° C. and being selected from the group consisting of β-naphthylacetylene; biphenylacetylene; 4-ethynyl-trans-azobenzene; diphenylacetylene, di-o-tolyacetylene; di-m-tolyacetylene; bis(4-ethylphenyl)acetylene; bis(3,4-dimethylphenyl)acetylene; bis(4-chlorophenyl)acetylene; di(α-naphthyl)acetylene; β-naphthylphenylacetylene; phenyl benzoyl acetylene; 1,4-diethynylnaphthalene; 9,10-diethynylanthracene; 9,10-diethynylphenanthrene; 4,4'-diethynylbiphenyl; 4,4'-diethynyl-trans-azobenzene; 4,4'-diethynyldiphenyl ether; 2,3,5,6-tetrachloro-1,4-diethynylbenzene; diphenylbutadiyne; 2,2'-dichlorodiphenyldiacetylene; 3,3'-dichlorodiphenyldiacetylene; di-p-tolyldiacetylene; di-α-naphthyldiacetylene; dibenzyldiacetylene and diethynyldiphenyldiacetylene, and (b) heating the shaped mixture to a temperature of from about 100° C. to about 300° C.

Claim 23

The process of claim 20 wherein the prepolymer prepared in the first stage is prepared from a diethynylbenzene and the monomeric acetylenically substituted aromatic compound used in the second stage is diphenylacetylene.