Patent US4586252A successfully refreshed from Google Patents.
US4586252A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tool for removing soldered components
Assignee: Textron Systems Corp
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Filing: 1985-02-15
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Granted: 1986-05-06
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Expires: 2005-02-15
Abstract
Abstract Apparatus is presented for removing a faulty component from a printed circuit board when attachment is by a plurality of input/output pins that extend outwardly from the component and protrude through holes in the printed circuit board where they are then soldered to printed circuitry. Removal is accomplished by clamping the printed circuit board in a fixture which includes a container of molten solder together with aligning and retaining elements which support the board over the surface of the molten solder so as to bring the protruding tips of the input/output pins into contact therewith. Above the clamped down printed circuit board a movable trolley is situated on a beam located parallel to and several inches above the printed circuit board. Extending downward from the trolley is a tubular metal bellows on the lower end of which is a rubber suction cup. The upper end of the bellows connects via flexible tubing to a vacuum pumping source. The trolley is moved along the beam until the suction cup can be made to contact the top surface of the faulty component. Application of a vacuum causes the tubular bellows to shrink in length creating a uniform pulling force on the component which draws it free from the printed circuit board as soon as the solder is melted from the downward extending pins.
Inventors
- 👤 Robert L. Faticanti
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 04:36
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/08; B23K3/087; B23K1/00; B23K1/018; H; H05; H05K; H05K13/00; H05K13/04; H05K13/0486; B23K2101/00; B23K2101/36; B23K2101/42; Y; Y10; Y10T; Y10T29/00; Y10T29/53; Y10T29/5313; Y10T29/53191; Y10T29/53274
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
265 words
A tool for removing a faulty component from a printed circuit board when said component has a plurality of input/output pins that protrude through holes in said board and are soldered to printed circuits on the underside thereof, said tool comprising: masking means for covering the bottom surface of said printed circuit board except for that area spanning the pins of the faulty component; a fixture including a container for molten solder together with aligning and retaining means for supporting said printed circuit board over the surface of molten solder so as to bring the tips of said plurality of input/output pins into contact therewith where said pins protrude through said printed circuit board; a beam supported at its ends and positioned parallel to and above the top surface of said printed circuit board, at least one position along said beam being directly over the area where said faulty component attaches to said printed circuit board; a trolley movable along said beam to a position directly above said faulty component; a vacuum pumping source; and vacuum lifting means depending from said trolley and in communication with said vacuum pumping source for contacting and raising said faulty component free from said printed circuit board when the soldered connections holding the plurality of input/output pins to said printed circuits melt, said vacuum lifting means including a tubular bellows having on its lower end a suction cup for making contact with said faulty component for accomplishing the lifting function, the cross sectional area of said suction cup being sized to control the magnitude of the component raising force.
Claim 2
Dependent Claim
265 words
A tool for removing a faulty component from a printed circuit board when said component has a plurality of input/output pins that protrude through holes in said board and are soldered to printed circuits on the underside thereof, said tool comprising: masking means for covering the bottom surface of said printed circuit board except for that area spanning the pins of the faulty component; a fixture including a container for molten solder together with aligning and retaining means for supporting said printed circuit board over the surface of molten solder so as to bring the tips of said plurality of input/output pins into contact therewith where said pins protrude through said printed circuit board; a beam supported at its ends and positioned parallel to and above the top surface of said printed circuit board, at least one position along said beam being directly over the area where said faulty component attaches to said printed circuit board; a trolley movable along said beam to a position directly above said faulty component; a vacuum pumping source; and vacuum lifting means depending from said trolley and in communication with said vacuum pumping source for contacting and raising said faulty component free from said printed circuit board when the soldered connections holding the plurality of input/output pins to said printed circuits melt, said vacuum lifting means including a tubular bellows having on its lower end a suction cup for making contact with said faulty component for accomplishing the lifting function, the cross sectional area of said suction cup being sized to control the magnitude of the component raising force.
Claim 3
Dependent Claim
25 words
The faulty component removal tool as defined in claim 1 wherein said rubber suction cup displaces 0.5 square in. of surface on said faulty component.
Claim 4
Dependent Claim
16 words
The invention as defined in claim 1 wherein the faulty component is a flex arm connector.
Claim 5
Dependent Claim
215 words
Apparatus for removing a faulty flex arm from a main interconnect board wherein said faulty flex arm is attached to said main interconnect board by a plurality of input/output pins forming an array that protrudes from one end of said flex arm, penetrates through said board making soldered connections with printed circuit elements on the bottom side of said board, said apparatus comprising: a fixture including a container for molten solder together with aligning and retaining means for supporting said printed circuit board over the surface of molten solder so as to bring the tips of said plurality of input/output pins into contact therewith where said pins protrude through said main interconnect board; a vacuum pumping source; and suction cup means positioned above and suspended over the top surface of the flex arm attachment with said main interconnect board, said suction cup means being in communication with said vacuum pumping source and serving to lift said flex arm from said board when melting of the soldered connections holding the plurality of input/output pins to said printed circuit elements is accomplished, the magnitude of the pulling force serving to lift said flex arm free from said interconnect board being proportional to the area displaced by the suction cup on the top surface of said flex arm.
Claim 6
Dependent Claim
215 words
Apparatus for removing a faulty flex arm from a main interconnect board wherein said faulty flex arm is attached to said main interconnect board by a plurality of input/output pins forming an array that protrudes from one end of said flex arm, penetrates through said board making soldered connections with printed circuit elements on the bottom side of said board, said apparatus comprising: a fixture including a container for molten solder together with aligning and retaining means for supporting said printed circuit board over the surface of molten solder so as to bring the tips of said plurality of input/output pins into contact therewith where said pins protrude through said main interconnect board; a vacuum pumping source; and suction cup means positioned above and suspended over the top surface of the flex arm attachment with said main interconnect board, said suction cup means being in communication with said vacuum pumping source and serving to lift said flex arm from said board when melting of the soldered connections holding the plurality of input/output pins to said printed circuit elements is accomplished, the magnitude of the pulling force serving to lift said flex arm free from said interconnect board being proportional to the area displaced by the suction cup on the top surface of said flex arm.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-05-05 | 1989-11-04 | 1990-05-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-05-05 | 1993-11-04 | 1994-05-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-05-05 | 1997-11-04 | 1998-05-06 | $7700.00 | Window Closed / Lapsed |