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US4580157A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device having a soft-error preventing structure

Assignee: Fujitsu Ltd
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Filing: 1983-03-02
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Granted: 1986-04-01
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Expires: 2003-03-02
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Abstract

Abstract In a semiconductor device, particularly a memory device, radioactive rays emitted from the ceramic material of the package enclosing the LSI chip of the device detrimentally influence the electrical properties of the device. In the memory device, the information is destroyed by the radioactive ray emission, which is referred to as a soft error. In the present invention, a shield plate having a shielding effect against radioactive rays is arranged in the space defined by a cover and a carrier. Thus, the radioactive rays emitted from the cover and carrier are blocked by the shielding plate, preferably made of high purity silicon, as well as by the silicon substrate of the LSI chip.

Inventors

  • 👤 Norio Honda

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 23:29
CPC Classifications
H; H10; H10P; H10P34/00; H10W; H10W42/00; H10W42/20; H10W42/25; H10W70/00; H10W70/60; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/40; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/721; H10W90/722; H10W90/731; H10W90/734; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 124 words
A semiconductor device comprising: a LSI chip provided with semiconductor elements on one surface thereof; a non-conductive carrier for mounting said LSI chip in a space within the carrier; a cover for hermetically enclosing said LSI chip within the carrier, said cover being rigidly connected to the carrier by a sealing material; and a shield plate having such a high purity that any radioactive rays emanating therefrom do not cause soft error, and being arranged in the space between said LSI chip and said carrier, so that said shield plate confronts said one surface of said LSI chip and supports said LSI chip, the surface area of said shield plate being larger than the surface area of said one surface of said LSI chip.
Claim 2
Dependent Claim 124 words
A semiconductor device comprising: a LSI chip provided with semiconductor elements on one surface thereof; a non-conductive carrier for mounting said LSI chip in a space within the carrier; a cover for hermetically enclosing said LSI chip within the carrier, said cover being rigidly connected to the carrier by a sealing material; and a shield plate having such a high purity that any radioactive rays emanating therefrom do not cause soft error, and being arranged in the space between said LSI chip and said carrier, so that said shield plate confronts said one surface of said LSI chip and supports said LSI chip, the surface area of said shield plate being larger than the surface area of said one surface of said LSI chip.
Claim 3
Dependent Claim 23 words
A semiconductor device according to claim 1, wherein said shield plate is provided with conductor leads on a surface confronting said semiconductor elements.
Claim 4
Dependent Claim 36 words
A semiconductor device according to claim 2, wherein said LSI chip is supported by said shield plate via said conductor leads and by pads formed on the surface of the LSI chip confronting said shield plate.
Claim 5
Dependent Claim 38 words
A semiconductor device according to claim 1, wherein said shield plate includes a lug along the periphery thereof, so that the radioactive rays emitted laterally from an inner wall of said carrier can be shielded by said lug.
Claim 6
Dependent Claim 22 words
A semiconductor device according to claim 1, 2, 3 or 4 wherein said shield plate is made of a high purity silicon.
Claim 7
Dependent Claim 22 words
A semiconductor device according to claim 1, 2, 3 or 4 wherein said shield plate is made of a high purity metal.
Claim 8
Dependent Claim 35 words
A semiconductor device according to claim 1, 2, 3 or 4 wherein said semiconductor elements comprise memory cells which store information by the existence or non existence of electrons or holes in the memory cells.
Claim 9
Dependent Claim 25 words
A semiconductor device according to claim 1, wherein said shield plate consists of high purity silicon having a purity identical to that of semiconductor material.
Claim 10
Dependent Claim 22 words
A semiconductor device according to claim 1, wherein an insulating material film is formed on the inner surface of said shield plate.

References Cited (Backward Citations)

GB950592A Cited
US3257588A Cited
US3710204A Cited
GB1204805A Cited
US3614546A Cited
US3715638A Cited
US3946428A Cited
US4121240A Cited
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US4266239A Cited
US4323405A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-03-31 1989-09-30 1990-04-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-03-31 1993-09-30 1994-04-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-03-31 1997-09-30 1998-04-01 $7700.00 Window Closed / Lapsed

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