Integrated processor board assembly

Claim 2

An integrated processor assembly, comprising: a plurality of adjoining processor boards, each board including: a semiconducting substrate; integrated processing circuitry fabricated in said substrate; a plurality of input strip lines deposited on said substrate, said lines being coupled to said circuitry and terminated at a first edge of said substrate, such that said first edges of each substrate together define a plane, the strip lines terminated thereon defining a two dimensional array; a plurality of output leads deposited on said substrate, said leads being coupled to said circuitry and terminated at a second edge of said substrate; a plurality of beam leads projecting from the second edge of each substrate, one of said beam leads being affixed to each output lead on each substrate; an adhesive layer binding each processor board to the adjoining processor board; a substrate backing affixed to an outermost one of said processor boards to provide support for said processor assembly; and a plurality of multiple conductor flexible cables, one of said cables being connected to the beam leads from each substrate.

Claim 3

An optical receiver, comprising: a two dimensional array of detector elements; a plurality of adjoining processor boards, each board including: a semiconducting substrate; integrated processing circuitry fabricated in said substrate; a plurality of input strip lines deposited on said substrate, said lines being coupled to said circuitry and terminated at a first edge of said substrate; a plurality of output leads deposited on said substrate, said leads being coupled to said circuitry and terminated at a second edge of said substrate; a plurality of beam leads projecting from the second edge of each substrate, one of said beam leads being affixed to each output lead on each substrate; an adhesive layer binding each processor board to the adjoining processor board; a substrate backing affixed to an outermost one of said processor boards to provide support for said processor boards; an array of electrically conductive flexible columns connecting each of said detector elements to a corresponding one of said input strip lines; and a plurality of multiple conductor flexible cables, one of said cables being connected to the beam leads from each substrate.

Claim 4

An optical receiver, comprising: a two dimensional array of detector elements; a plurality of adjoining processor boards, each board including: a semiconducting substrate; integrated processing circuitry fabricated in said substrate; a plurality of input strip lines deposited on said substrate, said lines being coupled to said circuitry and terminated at a first edge of said substrate; a plurality of output leads deposited on said substrate, said leads being coupled to said circuitry and terminated at a second edge of said substrate; a plurality of beam leads projecting from the second edge of each substrate, one of said beam leads being affixed to each output lead on each substrate; an adhesive layer binding each processor board to the adjoining processor board; a substrate backing affixed to an outermost one of said processor boards to provide support for said processor boards; an array of electrically conductive flexible columns connecting each of said detector elements to a corresponding one of said input strip lines; and a plurality of multiple conductor flexible cables, one of said cables being connected to the beam leads from each substrate.