US4559697A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fixing insertion electrode panel in compression-bonded semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1984-12-18
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Granted: 1985-12-24
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Expires: 2004-12-18
Abstract
Abstract A method of fixing an insertion electrode panel in a compression-bonded semiconductor device, in which a screen (20) having a pattern portion (22a) is aligned on a semiconductor element (1) having an electrode pattern (3), which pattern portion (22a) is formed identically to the electrode pattern (3), a cold-setting silicon rubber solution is dropped on the screen to be attached on the electrode pattern, whereby an aligning pattern member (23) is formed in a projecting manner, and then the insertion electrode panel (4) is overlapped on the semiconductor element in alignment with the same with the pattern hole (5) fitted with the aligning pattern member, and is fixed to the same by attaching a passivation rubber member (6) on its outer circumferential portion.
Inventors
- 👤 Masaaki Sadamori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 01:02
CPC Classifications
H; H10; H10W; H10W72/00; H10W20/00; H10W20/40; H10W20/482; H10W20/484; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/53; Y10T29/5313; Y10T29/53261
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
142 words
A method of fixing an insertion electrode panel in a compression-bonded semiconductor device wherein an insertion electrode panel having a pattern hole is overlapped on a semiconductor element having an electrode pattern on its surface, with said pattern hole, being identically formed to said electrode pattern for receiving the same, aligned with said electrode pattern and the outer circumferential portion of said insertion electrode panel is fixed to said semiconductor element by attaching thereto a passivation rubber member, said method comprising the steps of: forming on said electrode pattern of said semiconductor element an aligning pattern member of an insulating material formed identically to said electrode pattern to be attached thereto in a projecting manner from said surface of said semiconductor element; and overlapping said insertion electrode panel on said semiconductor element with said pattern hole fitted with said aligning pattern member.
Claim 2
Independent Claim
142 words
A method of fixing an insertion electrode panel in a compression-bonded semiconductor device wherein an insertion electrode panel having a pattern hole is overlapped on a semiconductor element having an electrode pattern on its surface, with said pattern hole, being identically formed to said electrode pattern for receiving the same, aligned with said electrode pattern and the outer circumferential portion of said insertion electrode panel is fixed to said semiconductor element by attaching thereto a passivation rubber member, said method comprising the steps of: forming on said electrode pattern of said semiconductor element an aligning pattern member of an insulating material formed identically to said electrode pattern to be attached thereto in a projecting manner from said surface of said semiconductor element; and overlapping said insertion electrode panel on said semiconductor element with said pattern hole fitted with said aligning pattern member.
Claim 3
Dependent Claim
51 words
A method of fixing an insertion electrode panel in a compression-bonded semiconductor device in accordance with claim 1, wherein said step of forming said aligning pattern member includes the step of attaching a silicon rubber member onto said electrode pattern of said semiconductor element by screen printing and hardening the same.
Claim 4
Dependent Claim
58 words
A method of fixing an insertion electrode panel in a compression-bonded semiconductor device in accordance with claim 1, wherein said step of forming said aligning pattern member includes the step of attaching a far ultraviolet vulcanized resin member onto said electrode pattern of said semiconductor element by screen printing and hardening the same by irradiation of ultraviolet rays.
Claim 5
Dependent Claim
57 words
A method of fixing an insertion electrode panel in a compression-bonded semiconductor device in accordance with claim 1, wherein said step of forming said aligning pattern member includes the step of attaching an aligning pattern member of inorganic insulating material formed identically to said electrode pattern of said semiconductor element on said electrode pattern by a binder.
Claim 6
Dependent Claim
30 words
A method of fixing an insertion electrode panel in a compression-bonded semiconductor device in accordance with claim 4, wherein said binder is coated on said electrode pattern by screen printing.
Claim 7
Dependent Claim
27 words
A method of fixing an insertion electrode panel in a compression-bonded semiconductor device in accordance with claim 1, wherein said semiconductor element comprises of a thyristor element.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-12-23 | 1989-06-24 | 1989-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-12-23 | 1993-06-24 | 1993-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-12-23 | 1997-06-24 | 1997-12-24 | $7700.00 | Window Closed / Lapsed |