Patent US4557411A successfully refreshed from Google Patents.
US4557411A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interconnected solder pads and the method of soldering
Assignee: Nokia Bell Labs
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Filing: 1983-10-26
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Granted: 1985-12-10
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Expires: 2003-10-26
Abstract
Abstract A new soldering technique is being employed whereby solder is formed into pads, each pad connected to the next pad by a solder link. The pads are formed on center spacings equal to the spaces between assembly board terminals and heated to the melting point of the solder whereupon surface tension of the solder collapses the interconnecting pad links thereby leaving the terminals electrically isolated. The solder pad assembly is made by an etching process.
Inventors
- 👤 Robert J. Farquharson
- 👤 Stanton T. Gerns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:45
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; H05K3/3447; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K2201/10424; H05K2203/00; H05K2203/04; H05K2203/0415
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
53 words
A solder structure comprising a plurality of solder pads interconnected by a link of solder and wherein each said link separates from said pads upon the application of heat, and wherein each said link is constructed having a variable volume of solder dependent upon the volume of solder necessary at the associated pad.
Claim 2
Dependent Claim
53 words
A solder structure comprising a plurality of solder pads interconnected by a link of solder and wherein each said link separates from said pads upon the application of heat, and wherein each said link is constructed having a variable volume of solder dependent upon the volume of solder necessary at the associated pad.
Claim 3
Dependent Claim
57 words
A solder structure comprising a plurality of solder pads interconnected by a link of solder and wherein each said link separates from said pads upon the application of heat, and wherein said solder structure is a multi-row matrix assembly interconnected by a plurality of links, said links also separating upon the application of heat to said matrix.
Claim 4
Dependent Claim
57 words
A solder structure comprising a plurality of solder pads interconnected by a link of solder and wherein each said link separates from said pads upon the application of heat, and wherein said solder structure is a multi-row matrix assembly interconnected by a plurality of links, said links also separating upon the application of heat to said matrix.
Claim 5
Independent Claim
67 words
A method of manufacturing solder pad assemblies, said method comprising the steps of selecting a sheet of solder, applying a photo sensitive etchant resist to both surfaces of said selected sheet, applying, by standard printed circuit techniques, a photo pattern of pads to said selected sheet over said etched resist, and etching the solder sheet to form a series of interconnected pads by using an etching material.
Claim 6
Independent Claim
67 words
A method of manufacturing solder pad assemblies, said method comprising the steps of selecting a sheet of solder, applying a photo sensitive etchant resist to both surfaces of said selected sheet, applying, by standard printed circuit techniques, a photo pattern of pads to said selected sheet over said etched resist, and etching the solder sheet to form a series of interconnected pads by using an etching material.
Claim 7
Dependent Claim
14 words
The invention set forth in claim 3 wherein said etchant material is ferric chloride.
Claim 8
Dependent Claim
48 words
The invention set forth in claim 3 wherein said pad assemblies are rings interconnected by a link, and wherein the width of each said link is controlled by said photo mask pattern and wherein the length of each said link is controlled by the same photo mask pattern.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-12-09 | 1989-06-10 | 1989-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-12-09 | 1993-06-10 | 1993-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-12-09 | 1997-06-10 | 1997-12-10 | $7700.00 | Window Closed / Lapsed |