Patent US4552787A successfully refreshed from Google Patents.
US4552787A
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US
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Deposition of a metal from an electroless plating composition
Assignee: International Business Machines Corp
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Filing: 1984-02-29
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Granted: 1985-11-12
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Expires: 2004-02-29
Abstract
Abstract A metal is deposited onto a substrate from an electroless plating solution by plating an initial layer of metal onto the substrate, then contacting the metal-plated substrate with a solution of an acid; and plating an additional layer of metal onto the plated, acid-treated substrate. The process reduces the plating void defects.
Inventors
- 👤 Paul Chebiniak
- 👤 Ronald A. Kaschak
- 👤 Lois J. Root
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 07:11
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1651; C23C18/1689; C23C18/18; C23C18/1803; C23C18/1824; C23C18/1827; C23C18/1834
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
104 words
A process for the deposition of a metal onto a substrate from an electroless plating composition wherein said substrate is catalytic for the deposition of said metal comprising the steps of: (a) plating an initial layer of an electroless platable metal from an electroless plating composition on said substrate; (b) contacting the resulting metal-plated substrate with an an aqueous solution of an acid composition containing about 5% to about 25% by weight of the acid, for about 1 to about 5 minutes; and (c) plating an additional layer of an electroless platable metal from an electroless plating composition onto the resulting plated, acid-treated substrate.
Claim 2
Dependent Claim
104 words
A process for the deposition of a metal onto a substrate from an electroless plating composition wherein said substrate is catalytic for the deposition of said metal comprising the steps of: (a) plating an initial layer of an electroless platable metal from an electroless plating composition on said substrate; (b) contacting the resulting metal-plated substrate with an an aqueous solution of an acid composition containing about 5% to about 25% by weight of the acid, for about 1 to about 5 minutes; and (c) plating an additional layer of an electroless platable metal from an electroless plating composition onto the resulting plated, acid-treated substrate.
Claim 3
Dependent Claim
27 words
The process of claim 1 wherein said acid is in the form of an aqueous solution containing about 10% to about 25% by weight of the acid.
Claim 4
Dependent Claim
19 words
The process of claim 1 wherein the treatment with the acid is for about 1 to about 3 minutes.
Claim 5
Dependent Claim
21 words
The process of claim 1 wherein the acid is at a temperature of about room temperature or below during the contacting.
Claim 6
Dependent Claim
11 words
The process of claim 1 wherein said acid is hydrochloric acid.
Claim 7
Dependent Claim
10 words
The process of claim 1 wherein said metal is copper.
Claim 8
Dependent Claim
12 words
The process of claim 1 wherein said acid is an inorganic acid.
Claim 9
Dependent Claim
18 words
The process of claim 2 wherein the contacting with the acid is for about 1 to about 3minutes.
Claim 10
Dependent Claim
21 words
The process of claim 5 wherein the aqueous solution of hydrochloric acid is at room temperature or below during the contacting.
Claim 11
Dependent Claim
25 words
The process of claim 1 wherein said acid is selected from the group of hydrochloride acid, nitric acid, phosphoric acid, and water soluble organic acids.
Claim 12
Dependent Claim
22 words
The process of claim 10 wherein said water soluble organic acid is selected from the group of formic acid and acetic acid.
Claim 13
Dependent Claim
20 words
The process of claim 1 wherein the metal of step (a) and the metal of step (b) are the same.
Claim 14
Dependent Claim
10 words
The process of claim 12 wherein said metal is copper.
Claim 15
Dependent Claim
19 words
The process of claim 1 wherein said initial layer is about 5% to about 95% of the total thickness.
Claim 16
Dependent Claim
24 words
The process of claim 1 wherein said initial layer is about 5% to about 50% of the total thickness of metal after step (c).
Claim 17
Dependent Claim
24 words
The process of claim 1 wherein said initial layer is about 5% to about 25% of the total thickness of metal after step (c).
Claim 18
Dependent Claim
31 words
The process of claim 1 wherein the plating in step (a) lasts about 1 to about 5 hours and the plating in step (c) lasts about 8 to about 20 hours.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-11-11 | 1989-05-13 | 1989-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-11-11 | 1993-05-13 | 1993-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-11-11 | 1997-05-13 | 1997-11-12 | $7700.00 | Window Closed / Lapsed |