US4549407A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Evaporative cooling
Assignee: International Business Machines Corp
•
Filing: 1984-04-06
•
Granted: 1985-10-29
•
Expires: 2004-04-06
Abstract
Abstract Evaporative cooling particularly useful for semiconductor integrated circuits is more efficient when a liquid is completely evaporated at the heat radiating surface. The liquid is converted to droplets and mixed with the gas at the heat radiating surface.
Inventors
- 👤 Peter A. Gruber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 01:05
CPC Classifications
F; F28; F28F; F28F13/00; F28D; F28D5/00; H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; F28F13/003; Y; Y10; Y10S; Y10S165/00; Y10S165/907; Y10S165/911
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
98 words
Evaporative cooling apparatus comprising in combination a liquid delivery conduit extending from a heat transfer location to a region remote therefrom, a gas delivery conduit concentric with said liquid delivery conduit extending from said heat transfer location to a region remote therefrom, means for forming droplets of said liquid in the immediate vicinity of said heat transfer location, means for mixing said gas and said droplets for evaporation adjacent said heat transfer location, and exhaust means concentric with said liquid delivery conduit and said gas delivery conduit for removal of the combination said gas and said evaporated liquid.
Claim 2
Dependent Claim
98 words
Evaporative cooling apparatus comprising in combination a liquid delivery conduit extending from a heat transfer location to a region remote therefrom, a gas delivery conduit concentric with said liquid delivery conduit extending from said heat transfer location to a region remote therefrom, means for forming droplets of said liquid in the immediate vicinity of said heat transfer location, means for mixing said gas and said droplets for evaporation adjacent said heat transfer location, and exhaust means concentric with said liquid delivery conduit and said gas delivery conduit for removal of the combination said gas and said evaporated liquid.
Claim 3
Dependent Claim
15 words
The apparatus of claim 1 wherein said droplet forming means is in a sintered member.
Claim 4
Dependent Claim
26 words
The apparatus of claim 2 wherein said sintered member includes said means for mixing said droplets and said liquid and gas are water and air respectively.
Claim 5
Dependent Claim
125 words
Semiconductor integrated circuit chip cooling apparatus comprising in combination a liquid delivery conduit extending from the vicinity of an integrated circuit chip to a location remote from said chip, a gas delivery conduit concentric with said liquid delivery conduit extending from the vicinity of said integrated circuit chip to a location remote from said chip, means forming droplets of said liquid positioned in the immediate vicinity of a heat radiating face of said integrated circuit chip, means for mixing said gas and said droplets for evaporation in adjacent thermal contact relationship with said heat radiating face of said integrated circuit chip, and means concentric with said liquid delivery conduit and said gas delivery conduit for exhausting the combination of said gas and said evaporated droplets.
Claim 6
Dependent Claim
125 words
Semiconductor integrated circuit chip cooling apparatus comprising in combination a liquid delivery conduit extending from the vicinity of an integrated circuit chip to a location remote from said chip, a gas delivery conduit concentric with said liquid delivery conduit extending from the vicinity of said integrated circuit chip to a location remote from said chip, means forming droplets of said liquid positioned in the immediate vicinity of a heat radiating face of said integrated circuit chip, means for mixing said gas and said droplets for evaporation in adjacent thermal contact relationship with said heat radiating face of said integrated circuit chip, and means concentric with said liquid delivery conduit and said gas delivery conduit for exhausting the combination of said gas and said evaporated droplets.
Claim 7
Dependent Claim
20 words
The apparatus of claim 4 where said liquid, said gas and said exhaust conduits are external, intermediate and central, respectively.
Claim 8
Dependent Claim
10 words
The apparatus of claim 5 wherein said conduits are flexible.
Claim 9
Dependent Claim
24 words
The apparatus of claim 6 wherein said conduits and said sintered member are of nickel, said liquid is water and said gas is air.
References Cited (Backward Citations)
US1084562A
Cited
US1296916A
Cited
US2901893A
Cited
US2941759A
Cited
US2906103A
Cited
US2990696A
Cited
US3066499A
Cited
US3361195A
Cited
US3771027A
Cited
US3706010A
Cited
US3725566A
Cited
SU474122A1
Cited
US4188996A
Cited
US4126879A
Cited
US4323914A
Cited
US4322737A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-10-28 | 1989-04-29 | 1989-10-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-10-28 | 1993-04-29 | 1993-10-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-10-28 | 1997-04-29 | 1997-10-29 | $7700.00 | Window Closed / Lapsed |