Patent US2885477A successfully refreshed from Google Patents.
Patent US4532015A successfully refreshed from Google Patents.
US4532015A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Poly(arylene sulfide) printed circuit boards
Assignee: Phillips Petroleum Co
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Filing: 1982-08-20
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Granted: 1985-07-30
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Expires: 2002-08-20
Abstract
Abstract A printed circuit board is made of poly(arylene sulfide) board and a conductive metal deposited on the board by electroless plating. Adhesion between the poly(arylene sulfide) and the conductive metal is improved by allowing the plated poly(arylene sulfide) to age.
Inventors
- 👤 Harold D. Boultinghouse
- 👤 Paul J. Boeke
- 👤 Robert E. Benefield, Jr.
- 👤 John Leland
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 10:32
CPC Classifications
H; H05; H05K; H05K3/00; C; C08; C08J; C08J7/00; C08J7/12; C08J7/14; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/22; C23C18/24; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0333; H05K3/38; H05K3/381; C08J2381/00; C08J2381/02; H05K2203/00; H05K2203/02; H05K2203/025; H05K2203/11; H05K2203/1194; H05K3/10; H05K3/18; H05K3/181; Y; Y10; Y10S; Y10S205/00; Y10S205/917; Y10S205/92; Y10S205/924
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
67 words
A method for obtaining improved adhesion between a conductive metal and a poly(arylene sulfide) substrate comprising (a) depositing said conductive metal onto said poly(arylene sulfide) substrate by electroless plating, and (b) aging the plated substrate produced in (a) for a time sufficient for the adhesion between said conductive metal and said poly(arylene sulfide) substrate as tested by peel strength immediately after the electroless plating to improve significantly.
Claim 2
Independent Claim
67 words
A method for obtaining improved adhesion between a conductive metal and a poly(arylene sulfide) substrate comprising (a) depositing said conductive metal onto said poly(arylene sulfide) substrate by electroless plating, and (b) aging the plated substrate produced in (a) for a time sufficient for the adhesion between said conductive metal and said poly(arylene sulfide) substrate as tested by peel strength immediately after the electroless plating to improve significantly.
Claim 3
Dependent Claim
14 words
A method in accordance with claim 1 wherein said poly(arylene sulfide) is poly(phenylene sulfide).
Claim 4
Dependent Claim
33 words
A method in accordance with claim 1 wherein after step (a) but before step (b) additional conductive metal is electroplated onto the conductive metal deposited onto said poly(arylene sulfide) substrate in step (a).
Claim 5
Dependent Claim
106 words
In a process for the production of a printed circuit board the improvement comprising including in said process the steps of: (i) depositing a conductive metal onto a poly(arylene sulfide) board by electroless plating; (ii) electroplating additional conductive metal onto the conductive metal deposited in accordance with step (i); and (iii) after completion of step (ii) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is sufficiently strong such that the peel strength associated therewith is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
Claim 6
Dependent Claim
106 words
In a process for the production of a printed circuit board the improvement comprising including in said process the steps of: (i) depositing a conductive metal onto a poly(arylene sulfide) board by electroless plating; (ii) electroplating additional conductive metal onto the conductive metal deposited in accordance with step (i); and (iii) after completion of step (ii) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is sufficiently strong such that the peel strength associated therewith is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
Claim 7
Dependent Claim
19 words
A process in accordance with claim 4 wherein said peel strength is at least about 5 pounds per inch.
Claim 8
Dependent Claim
14 words
A process in accordance with claim 4 wherein said poly(arylene sulfide) is poly(phenylene sulfide).
Claim 9
Dependent Claim
14 words
A process in accordance with claim 5 wherein said poly(arylene sulfide) is poly(phenylene sulfide).
Claim 10
Dependent Claim
13 words
A process in accordance with claim 7 wherein said conductive metal is copper.
Claim 11
Dependent Claim
13 words
A process in accordance with claim 7 wherein said conductive metal is nickel.
Claim 12
Dependent Claim
22 words
A process in accordance with claim 4 wherein after completion of step (ii) said poly(arylene sulfide) board is at least partially dried.
Claim 13
Dependent Claim
22 words
A process in accordance with claim 4 wherein after completion of step (ii) said poly(arylene sulfide) board is at least partially cured.
Claim 14
Dependent Claim
22 words
A process in accordance with claim 4 wherein after completion of step (ii) said poly(arylene sulfide) board is heated above ambient temperature.
Claim 15
Dependent Claim
17 words
A process in accordance with claim 10, 11 or 12 wherein said poly(arylene sulfide) is poly(phenylene sulfide).
Claim 16
Dependent Claim
22 words
A process in accordance with claim 4 wherein step (iii) comprises allowing the plated board to age for at least 5 days.
Claim 17
Dependent Claim
88 words
A process for the production of a printed circuit board comprising (a) etching a poly(arylene sulfide) board with a chemical etchant, (b) depositing a conductive metal onto preselected portions of said poly(arylene sulfide) board by electroless plating to form the circuitry of said printed circuit board, and (c) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
Claim 18
Dependent Claim
88 words
A process for the production of a printed circuit board comprising (a) etching a poly(arylene sulfide) board with a chemical etchant, (b) depositing a conductive metal onto preselected portions of said poly(arylene sulfide) board by electroless plating to form the circuitry of said printed circuit board, and (c) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
Claim 19
Dependent Claim
113 words
A process for the production of a printed circuit board comprising (a) etching a poly(arylene sulfide) board with a chemical etchant, (b) depositing a conductive metal onto said poly(arylene sulfide) board by electroless plating; wherein at some time subsequent to said electroless plating a portion of said conductive metal is removed from said board leaving the remaining conductive metal in the form of the desired circuitry of said printed circuit board, and (c) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
Claim 20
Dependent Claim
113 words
A process for the production of a printed circuit board comprising (a) etching a poly(arylene sulfide) board with a chemical etchant, (b) depositing a conductive metal onto said poly(arylene sulfide) board by electroless plating; wherein at some time subsequent to said electroless plating a portion of said conductive metal is removed from said board leaving the remaining conductive metal in the form of the desired circuitry of said printed circuit board, and (c) allowing the plated board to age until the adhesion between said conductive metal and said poly(arylene sulfide) board is at least about 4 pounds per inch as measured in accordance with ASTM Test Method Part 9 B 533-79 Procedure A.
Claim 21
Dependent Claim
25 words
A process in accordance with claim 15 wherein additional conductive metal is electroplated onto the conductive metal deposited on said poly(arylene sulfide) board in (b).
Claim 22
Dependent Claim
16 words
A process in accordance with claim 15 wherein said chemical etchant is a strong oxidizing agent.
Claim 23
Dependent Claim
14 words
A process in accordance with claim 15 wherein said chemical etchant is nitric acid.
Claim 24
Dependent Claim
19 words
A process in accordance with claim 15 wherein said poly(arylene sulfide) board is grit blasted prior to step (a).
Claim 25
Dependent Claim
28 words
A process in accordance with claim 20 wherein ultrasonic cleaning is employed to remove loose material from the surface of said board after said board is grit blasted.
Claim 26
Dependent Claim
14 words
A process in accordance with claim 17 wherein said poly(arylene sulfide) is poly(phenylene sulfide).
Claim 27
Dependent Claim
13 words
A process in accordance with claim 22 wherein said conductive metal is copper.
Claim 28
Dependent Claim
18 words
A process in accordance with claim 19 wherein said poly(arylene sulfide) board is also etched with hydrofluoric acid.
Claim 29
Dependent Claim
23 words
A process in accordance with claim 15 or 16 further comprising (c) allowing the plated board to age for at least 5 days.
Claim 30
Independent Claim
84 words
A method for obtaining improved adhesion between a conductive metal and a poly(arylene sulfide) substrate comprising (a) depositing said conductive metal onto said poly(arylene sulfide) substrate by electroless plating wherein the metal to substrate adhesion as measured immediately after the electroless plating is below about 4 pounds per inch, and (b) aging the plated substrate produced in (a) for a time sufficient for the adhesion between said conductive metal and said poly(arylene sulfide) substrate to increase to at least about 4 pounds per inch.
Claim 31
Independent Claim
84 words
A method for obtaining improved adhesion between a conductive metal and a poly(arylene sulfide) substrate comprising (a) depositing said conductive metal onto said poly(arylene sulfide) substrate by electroless plating wherein the metal to substrate adhesion as measured immediately after the electroless plating is below about 4 pounds per inch, and (b) aging the plated substrate produced in (a) for a time sufficient for the adhesion between said conductive metal and said poly(arylene sulfide) substrate to increase to at least about 4 pounds per inch.
Claim 32
Dependent Claim
25 words
A process in accordance with claim 16 wherein additional conductive metal is electroplated onto the conductive metal deposited on said poly(arylene sulfide) board in (b).
Claim 33
Dependent Claim
16 words
A process in accordance with claim 16 wherein said chemical etchant is a strong oxidizing agent.
Claim 34
Dependent Claim
14 words
A process in accordance with claim 16 wherein said chemical etchant is nitric acid.
Claim 35
Dependent Claim
19 words
A process in accordance with claim 16 wherein said poly(arylene sulfide) board is grit blasted prior to step (a).
Claim 36
Dependent Claim
28 words
A process in accordance with claim 30 wherein ultrasomic cleaning is employed to remove loose material from the surface of said board after said board is grit blasted.
Claim 37
Dependent Claim
14 words
A process in accordance with claim 27 wherein said poly(arylene sulfide) is poly(phenylene sulfide).
Claim 38
Dependent Claim
13 words
A process in accordance with claim 32 wherein said conductive metal is copper.
Claim 39
Dependent Claim
18 words
A process in accordance with claim 29 wherein said polyarylene sulfide board is also etched with hydrofluoric acid.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-07-29 | 1989-01-28 | 1989-07-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-07-29 | 1993-01-28 | 1993-07-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-07-29 | 1997-01-28 | 1997-07-30 | $7700.00 | Window Closed / Lapsed |