Patent US4528216A successfully refreshed from Google Patents.
US4528216A
Expired / Lapsed
US
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Process for forming heat-resistant resin films of polyimide and organosilicic reactants
Assignee: Oki Electric Industry Co Ltd
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Filing: 1984-02-17
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Granted: 1985-07-09
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Expires: 2004-02-17
Abstract
Abstract A process for forming heat resistant resin films comprising the steps of admixing a polyimide resin precursor solution, for example, a solution containing a reactant obtained from pyrromellitic dianhydride, 3,3',4,4'-benzophenyltetracarboxylic acid dianhydride, 4,4'-diaminodiphenyl ether, and 4,4'-diaminodiphenyl ether-3-carbonic amide with an organosilicic compound solution, coating a silicon substrate with the resulting admixture, and subjecting said coated silicon substrate to heat treatment.
Inventors
- 👤 Ken Ogura
- 👤 Hiroshi Nakaboh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:00
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/69; H10P14/692; H10P14/6921; H10P14/6922; H10P14/6923; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1003; C08G73/1007; C08G73/1057; C08G73/106; H10P14/63; H10P14/6326; H10P14/6342; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
40 words
A process for forming heat resistant resin films comprising the steps of admixing a polyimide resin precursor solution with an organosilicic compound solution, coating a silicon substrate with the resulting admixture, and subjecting said silicon substrate coated to heat treatment.
Claim 2
Dependent Claim
40 words
A process for forming heat resistant resin films comprising the steps of admixing a polyimide resin precursor solution with an organosilicic compound solution, coating a silicon substrate with the resulting admixture, and subjecting said silicon substrate coated to heat treatment.
Claim 3
Dependent Claim
35 words
A process for forming heat resistant resin films as claimed in claim 1 wherein said polyimide resin precursor is polyamic acid solution or a solution containing a reactant obtained from diaminocarbonic amide and dicarboxylic anhydride.
Claim 4
Dependent Claim
37 words
A process for forming heat resistant resin films as claimed in claim 1 wherein said polyimide resin precursor is a solution containing a reactant obtained from pyrromellitic dianhydride, 3,3',4,4'-benzophenyltetracarboxylic acid dianhydride, 4,4'-diaminodiphenyl either, and 4,4'-diaminodiphenyl ether-3-carbonic amide.
Claim 5
Dependent Claim
37 words
A process for forming heat resistant resin films as claimed in claim 1 wherein said organosilicic compound solution contains a solution prepared by dissolving either silicon acetate or silicon hydroxide into ethyl alcohol as the principal constituent.
Claim 6
Dependent Claim
22 words
A process for forming heat resistant resin films as claimed in claim 1 wherein phosphorus is added to said organosilicic compound solution.
Claim 7
Dependent Claim
76 words
A process for forming heat resistant resin films as claimed in claim 1 wherein said admixture of the polyimide resin precursor solution and the organosilicic compound solution is applied on a silicon substrate, and said silicon substrate is heated to convert the polyimide precursor into a polyimide resin, while the organosilicic compound is converted into an Si--O--Si structure, whereby the heat resistant film contains the polyimide resin component and the Si--O--Si structure component uniformly distributed throughout.
Claim 8
Dependent Claim
31 words
A process for forming heat resistant resin films as claimed in claim 1 wherein said organosilicic compound solution is prepared by dissolving silicon hydroxide into ethyl alcohol as the principal constituent.
References Cited (Backward Citations)
US3682698A
Cited
US4101487A
Cited
JPS5144871A
Cited
JPS5220825A
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JPS5216488A
Cited
US4467000A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-07-08 | 1989-01-07 | 1989-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-07-08 | 1993-01-07 | 1993-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-07-08 | 1997-01-07 | 1997-07-09 | $7700.00 | Window Closed / Lapsed |