Patent US4526838A successfully refreshed from Google Patents.
US4526838A
Expired / Lapsed
US
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Polyamino-bis-imide resin
Assignee: Resonac Corp
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Filing: 1983-09-06
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Granted: 1985-07-02
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Expires: 2003-09-06
Abstract
Abstract A curable polyamino-bis-imide resin, obtained by the thermal reaction of: (A) a bis-imide represented by the general formula I: ##STR1## wherein R 1 stands for a divalent organic group having a carbon-carbon double bond and R 2 for a divalent aromatic organic group having 1 to 3 benzene rings, with (B) a diamine represented by the general formula II: ##STR2## wherein X stands for one member selected from the group consisting of O, S, SO 2 , CH 2 , CO, COO, C(CH 3 ) 2 , CF 2 and C(CF 3 ) 2 , providing that the three X's may be identical or not identical to one another and the hydrogen atoms attached to the benzene rings may be substituted by an inactive alkyl group, perfluoroalkyl group or halogen atom, a solution thereof, cross-linked resins therefrom and laminated boards therefrom.
Inventors
- 👤 Atsushi Fujioka
- 👤 Yasuo Miyadera
- 👤 Tomio Fukuda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:16
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/28; B32B15/00; B32B15/04; B32B15/08; B32B15/20; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/12; C08G73/126; B32B2305/00; B32B2305/08; B32B2305/72; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31721
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
79 words
A curable polyamino-bis-imide resin, obtained by the thermal reaction of: (A) a bis-imide represented by the general formula I: ##STR15## wherein R 1 stands for a divalent organic group having a carbon-carbon double bond and R 2 for a divalent aromatic organic group having 1 to 3 benzene rings, with (B) a diamine represented by the general formula II: ##STR16## the mole ratio of said bis-imide (A) to said diamine (B) being in the range of 1:0.1 to 1:1.
Claim 2
Dependent Claim
79 words
A curable polyamino-bis-imide resin, obtained by the thermal reaction of: (A) a bis-imide represented by the general formula I: ##STR15## wherein R 1 stands for a divalent organic group having a carbon-carbon double bond and R 2 for a divalent aromatic organic group having 1 to 3 benzene rings, with (B) a diamine represented by the general formula II: ##STR16## the mole ratio of said bis-imide (A) to said diamine (B) being in the range of 1:0.1 to 1:1.
Claim 3
Dependent Claim
14 words
A curable polyamino-bis-imide resin according to claim 1, wherein said bis-imide (A) is N,N'-4,4'-diphenylmethane-bis-maleimide.
Claim 4
Dependent Claim
16 words
A curable polyamino-bis-imide resin according to claim 2, wherein said diamine (B) is a 4,4'-di-(aminophenoxy)-diphenyl sulfone.
Claim 5
Dependent Claim
28 words
A curable polyamino-bis-imide resin according to claim 1, wherein the molar ratio of said bis-imide (A) to said diamine (B) is in the range of 1:0.25 to 1:0.8.
Claim 6
Dependent Claim
27 words
A curable polyamino-bis-imide resin according to claim 1, wherein said thermal reaction is carried out at a temperature in the range of from 100° to 200° C.
Claim 7
Dependent Claim
27 words
A curable polyamino-bis-imide resin according to claim 5, wherein said thermal reaction is carried out at a temperature in the range of from 120° to 150° C.
Claim 8
Dependent Claim
30 words
A curable polyamino-bis-imide resin according to claim 5, wherein said thermal reaction is carried out in an organic solvent selected from the group consisting of 2-methoxyethanol, 2-ethoxyethanol, 2-(methoxymethoxy)-ethanol and 2-isopropoxyethanol.
Claim 9
Dependent Claim
35 words
A polyamino-bis-imide resin solution, obtained by dissolving any of the curable polyamino-bis-imide resins set forth in claim 1 in an organic solvent having a boiling point in the range of from 70° to 160° C.
Claim 10
Dependent Claim
28 words
A polyamino-bis-imide resin solution according to claim 8, wherein said organic solvent is at least one member selected from the group consisting of methylethyl ketone, 2-methoxyethanol and 2-ethoxyethanol.
Claim 11
Dependent Claim
70 words
A cross-linked resin, obtained by thermosetting a polyamino-bis-imide resin obtained by the thermal reaction of: (A) a bis-imide represented by the general formula I: ##STR17## wherein R 1 and R 2 have the same meanings as described in claim 1 with (B) a diamine represented by the general formula II: ##STR18## the mole ratio of said bis-imide (A) to said diamine (B) being in the range of 1:0.1 to 1:1.
Claim 12
Dependent Claim
29 words
A cross-linked resin according to claim 10, wherein said thermosetting of said polyamino-bis-imide resin is carried out at a temperature in the range of from 170° to 300° C.
Claim 13
Dependent Claim
20 words
A copper clad laminated board comprising a fiber reinforced cross-linked polyamino-bis-imide resin of claim 1 bonded to a copper foil.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-07-01 | 1988-12-31 | 1989-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-07-01 | 1992-12-31 | 1993-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-07-01 | 1996-12-31 | 1997-07-02 | $7700.00 | Window Closed / Lapsed |