US4517276A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metal-containing organic photoresists
Assignee: Varian Semiconductor Equipment Associates Inc
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Filing: 1982-11-29
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Granted: 1985-05-14
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Expires: 2002-11-29
Abstract
Abstract Photoresist compositions are provided whereby metals are incorporated into the resist by providing a photoresist composition comprising the reaction product of an organic resist which has at least one reactive hydroxyl or amino group with an organometallic compound. Also provided is a process for generating a pattern on a substrate by coating the substrate with a thin film of the photoresist composition which comprises the reaction product of the organic resist which has at least one reactive hydroxyl or amino group with an organometallic compound. The photoresist compositions are particularly suitable for use in diazo-type electron beam procedures.
Inventors
- 👤 Carol R. Lewis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 20:38
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; C; C08; C08G; C08G8/00; C08G8/28; C08G85/00; C08G85/004; Y; Y10; Y10S; Y10S430/00; Y10S430/167; Y10S430/168
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
52 words
An electron beam sensitive negative photoresist composition having improved radiation sensitivity and requiring shortened exposure time comprising a cresol formaldehyde resin which has been pre-reacted with an organometallic halide of the formula: R.sub.y MX wherein R is an alkyl or aryl, M is a metal, and X is a halogen, and 1<y<4.
Claim 2
Dependent Claim
52 words
An electron beam sensitive negative photoresist composition having improved radiation sensitivity and requiring shortened exposure time comprising a cresol formaldehyde resin which has been pre-reacted with an organometallic halide of the formula: R.sub.y MX wherein R is an alkyl or aryl, M is a metal, and X is a halogen, and 1<y<4.
Claim 3
Dependent Claim
32 words
A composition according to claim 1 wherein R is alkyl or aryl of 1 to 24 carbon atoms, M is a transition metal, X is chloro or bromo and y is 3.
Claim 4
Dependent Claim
23 words
A composition according to claim 2 wherein M is Sn, Bi, Sn or Pb and R is methyl, ethyl, n-propyl, n-butyl or phenyl.
Claim 5
Dependent Claim
14 words
A composition according to claim 3 wherein the resin is a cresol novolac resin.
Claim 6
Dependent Claim
121 words
An electron beam sensitive negative photoresist composition which possesses negative photoresist properties having improved radiation sensitivity and requiring shortened exposure time comprising in admixture: (a) the pre-reaction product of an organic resist resin which has a reactive hydroxyl group and an organometallic halide compound of the formula: R.sub.y MX wherein R is an alkyl, aryl, alkaryl, or aralkyl group, M is a metal, X is a halogen, and 1<y<4 wherein the organic resist resin which has been pre-reacted with the organometallic halide compound contains 0.4-45 weight percent of metal based on the weight percent of the resin and contains at least 50-99 percent available hydrogen sites after reaction with said organometallic compound, (b) an o-quinone diazide, and (c) an organic solvent.
Claim 7
Dependent Claim
121 words
An electron beam sensitive negative photoresist composition which possesses negative photoresist properties having improved radiation sensitivity and requiring shortened exposure time comprising in admixture: (a) the pre-reaction product of an organic resist resin which has a reactive hydroxyl group and an organometallic halide compound of the formula: R.sub.y MX wherein R is an alkyl, aryl, alkaryl, or aralkyl group, M is a metal, X is a halogen, and 1<y<4 wherein the organic resist resin which has been pre-reacted with the organometallic halide compound contains 0.4-45 weight percent of metal based on the weight percent of the resin and contains at least 50-99 percent available hydrogen sites after reaction with said organometallic compound, (b) an o-quinone diazide, and (c) an organic solvent.
Claim 8
Dependent Claim
13 words
A composition according to claim 1 wherein the o-quinone diazide is naphthoquinone diazide.
Claim 9
Dependent Claim
36 words
A composition according to claim 1 wherein the organic resist is of the following formula: (Resin)-A wherein the resin is any organic resin which possesses negative photoresist properties and A is one or more hydroxyl groups.
Claim 10
Dependent Claim
79 words
A method for the preparation of a negative electron beam sensitive photoresist of claim 1 having improved rediation sensitivity and requiring shortened exposure time which comprises (a) the reaction of a negative photoresist resin which contains free hydroxyl groups with an organometallic halide compound of the formula: R.sub.y MX wherein R is an alkyl, aryl, alkaryl, or aralkyl group, M is a metal, X is halogen, and 1<y<4, and (b) mixing with an o-quinone diazide and an organic solvent.
Claim 11
Dependent Claim
20 words
A method according to claim 8 wherein the reaction is conducted in the presence of a solvent and a base.
Claim 12
Dependent Claim
39 words
A method according to claim 9 wherein the resin is a cresol-formaldehyde resin and the organometallic compound of the formula: R.sub.y MX wherein R is alkyl or aryl, M is a transition metal, and X is chloro or bromo.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-05-13 | 1988-11-12 | 1989-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-05-13 | 1992-11-12 | 1993-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-05-13 | 1996-11-12 | 1997-05-14 | $7700.00 | Window Closed / Lapsed |