Integrated-circuit support device employed in a system for selecting high-reliability integrated circuits

Claim 2

An integrated-circuit support device employed in a system for selecting high-reliability circuits as a function of predetermined thermal and dynamic stresses, the support device comprising: a plurality of plates for receiving integrated circuits each of said integrated circuits having a plurality of terminal pins with each of said pins having a reference number, wherein said integrated circuit pins are arranged in two rows, and said plurality of plates establishing interface connections to connect in parallel those of said terminal pins of said integrated circuits having the same reference number, each plate being comprised of a parent card and a plurality P of daughter cards, the said interface connections being formed as a multilayer printed circuit on the daughter cards and is in the form of a double-face circuit on the parent card which is provided on one face with a first series of P socket connectors for receiving the said daughter cards and with a second series of NXP socket connectors for receiving said integrated circuits, each daughter card being associated with a plurality N of integrated circuits, the said plates having a similar structure to form only a first, a second and a third version of different plate designs by utilizing only three types of integrated-circuit socket connectors for receiving the different integrated-circuit packages of usual types which correspond respectively to spacing standards of 0.3 inch, 0.4 inch and 0.6 inch between the two rows of terminal pins, said first, second and third versions of plates being each equipped with one type of integrated-circuit socket connector corresponding to one of the spacing standards aforesaid, and the said printed circuits enabling separate and active connection of all the terminal pins of the integrated circuits through the corresponding daughter cards from a single coupling connector located externally of the plate.

Claim 3

An integrated-circuit support device employed in a system for selecting high-reliability circuits as a function of predetermined thermal and dynamic stresses, the support device comprising a plurality of plates for receiving integrated circuits having a plurality of terminal pins with each of said pins having a reference number wherein said integrated circuits pins are arranged in two rows, and said plurality of plates establishing interface connections to connect in parallel those of said terminal pins at said integrated circuits having the same reference number, each plate being composed of a parent card and a plurality of P of daughter cards, the said interface connections being formed as a multilayer printed circuit on the daughter cards and is in the form of a double-face circuit on the parent card which is provided on one face with a first series of P socket connectors for receiving the said daughter cards and with a second series of NXP socket connectors for receiving said integrated circuits, each daughter card being associated with a plurality N of integrated circuits, the said plates having a similar structure to form only a first and a second version of different plate design by utilizing only three types of integrated-circuit socket connectors for receiving the different integrated-circuit packages of usual types which correspond respectively to spacing standards of 0.3 inch, 0.4 inch and 0.6 inch between the two rows of terminal pins, said first and second versions of plates being equipped in said first version with integrated-circuit socket connectors corresponding to one of said spacing standards and in said second version with socket connectors corresponding to the other two standards, said connectors being constituted by rows of frusto-conical plug sockets of the tulip type, the said printed circuits enabling separate and active connection of all the terminal pins of the integrated circuits through the corresponding daughter cards from a single coupling connector located externally of the plate.

Claim 4

An integrated-circuit support device employed in a system for selecting high-reliability circuits as a function of predetermined thermal and dynamic stresses, the support device comprising a plurality of plates for receiving integrated circuits having a plurality of terminal pins with each of said pins having a reference number wherein said integrated circuits pins are arranged in two rows, and said plurality of plates establishing interface connections to connect in parallel those of said terminal pins at said integrated circuits having the same reference number, each plate being composed of a parent card and a plurality of P of daughter cards, the said interface connections being formed as a multilayer printed circuit on the daughter cards and is in the form of a double-face circuit on the parent card which is provided on one face with a first series of P socket connectors for receiving the said daughter cards and with a second series of NXP socket connectors for receiving said integrated circuits, each daughter card being associated with a plurality N of integrated circuits, the said plates having a similar structure to form only a first and a second version of different plate design by utilizing only three types of integrated-circuit socket connectors for receiving the different integrated-circuit packages of usual types which correspond respectively to spacing standards of 0.3 inch, 0.4 inch and 0.6 inch between the two rows of terminal pins, said first and second versions of plates being equipped in said first version with integrated-circuit socket connectors corresponding to one of said spacing standards and in said second version with socket connectors corresponding to the other two standards, said connectors being constituted by rows of frusto-conical plug sockets of the tulip type, the said printed circuits enabling separate and active connection of all the terminal pins of the integrated circuits through the corresponding daughter cards from a single coupling connector located externally of the plate.

Claim 5

An integrated-circuit support device employed in a system for selecting high-reliability circuits as a function of predetermined thermal and dynamic stresses, the support device comprising a plurality of plates for receiving integrated circuits each of said integrated circuits having a plurality of terminal pins with each of said pins having a reference number, wherein said integrated circuits pins are arranged in two rows, and said plurality of plates establishing interface connections to connect in parallel those of said terminal pins of said integrated circuits having the same reference number, each plate being composed of a parent card and a plurality P of daughter cards, the said interface connections being formed as a same multilayer printed circuit on the daughter cards and is in the form of a double-face circuit on the parent card which is provided on one face with a first series of P socket connectors for receiving the said daughter cards and with a second series of NXP socket connectors for receiving said integrated circuits, each daughter card being associated with a plurality N of integrated circuits, the same plates each having the same structure to form a single version of plate design by utilizing only three types of integrated-circuit socket connectors for receiving the different integrated-circuit packages of usual types which correspond respectively to spacing standards of 0.3 inch, 0.4 inch and 0.6 inch between the two rows of terminal pins, said single version of plates being provided by making use of frusto-conical tulip-type plug sockets in order to form said second series of socket connectors, said plug sockets being distributed in four rows so that the intervals between a first row and the second, third and fourth rows corresponding respectively to the said three integrated-circuit spacing standards.

Claim 6

An integrated-circuit support device employed in a system for selecting high-reliability circuits as a function of predetermined thermal and dynamic stresses, the support device comprising a plurality of plates for receiving integrated circuits each of said integrated circuits having a plurality of terminal pins with each of said pins having a reference number, wherein said integrated circuits pins are arranged in two rows, and said plurality of plates establishing interface connections to connect in parallel those of said terminal pins of said integrated circuits having the same reference number, each plate being composed of a parent card and a plurality P of daughter cards, the said interface connections being formed as a same multilayer printed circuit on the daughter cards and is in the form of a double-face circuit on the parent card which is provided on one face with a first series of P socket connectors for receiving the said daughter cards and with a second series of NXP socket connectors for receiving said integrated circuits, each daughter card being associated with a plurality N of integrated circuits, the same plates each having the same structure to form a single version of plate design by utilizing only three types of integrated-circuit socket connectors for receiving the different integrated-circuit packages of usual types which correspond respectively to spacing standards of 0.3 inch, 0.4 inch and 0.6 inch between the two rows of terminal pins, said single version of plates being provided by making use of frusto-conical tulip-type plug sockets in order to form said second series of socket connectors, said plug sockets being distributed in four rows so that the intervals between a first row and the second, third and fourth rows corresponding respectively to the said three integrated-circuit spacing standards.

Claim 7

A device according to claim 3, wherein the printed circuits are so determined as to permit separate and active connection of all the terminal pins of the integrated circuits through the corresponding daughter cards from a single coupling connector located externally of the plate.

Claim 8

A device according to claim 4, wherein, in accordance with a first basic module, the arrangement of the plug sockets comprises: fourteen plug sockets in said first row, ten plug sockets in said second row, eleven sockets in said third row and fourteen sockets in said fourth row in order to receive a respectively integrated circuit having a spacing of 0.3 inch and having a maximum of twenty terminal pins, 0.4 inch circuits having twenty-two terminal pins and 0.6 inch circuits having twenty-four to twenty-eight terminal pins.

Claim 9

A device according to claim 5, wherein the plug sockets associated with a daughter card comprise three of said first basic modules as well as two other modules having two rows of ten plug sockets having a relative spacing of 0.3 inch in order to be capable of treating a total of five integrated circuits having a spacing of 0.3 inch or three integrated circuits having a spacing of 0.4 inch or 0.6 inch.

Claim 11

A device according to claim 7, wherein the daughter cards are formed by means of a printed circuit having at least three layers and wherein the protecting and matching means further comprise a switching matrix constituted by plug sockets of the tulip type and connection means for transmission of a dynamic signal or of a direct-current supply potential or of ground to each terminal of each integrated circuit to be selected according to the plug-in connection to be established.

Claim 12

A device according to claim 8, wherein the plug sockets of the switching matrix are uniformly spaced in two rows in order to produce said connections by means of a short-circuit U-link which is capable of occupying a number of different connection positions.