Patent US4512509A successfully refreshed from Google Patents.
US4512509A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Technique for bonding a chip carrier to a metallized substrate
Assignee: AT&T Inc
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Filing: 1983-02-25
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Granted: 1985-04-23
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Expires: 2003-02-25
Abstract
Abstract A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.
Inventors
- 👤 Roland Ellis, Jr.
- 👤 Brian E. Jacobs
- 👤 Edward J. March
- 👤 Raymond J. Newman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 18:25
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/04; H05K13/0478; H05K13/0482; H05K13/046; H05K13/0465; H05K3/00; H05K3/30; H05K3/303; H05K7/00; H05K7/02; H05K7/04; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0173; H05K2203/0186; H05K2203/04; H05K2203/048; H05K2203/16; H05K2203/168; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
38 words
A method of bonding leads of a substantially square chip carrier to respective bonding pads on a planar metallized substrate, a predeposited reflowable bonding material being interposed between the pads and leads; the method comprising the steps of:
Claim 2
Independent Claim
38 words
A method of bonding leads of a substantially square chip carrier to respective bonding pads on a planar metallized substrate, a predeposited reflowable bonding material being interposed between the pads and leads; the method comprising the steps of:
Claim 3
Dependent Claim
74 words
roughly aligning the chip carrier leads to the respective bonding pads on a first major surface of the planar substrate; loosely capturing a corner of the chip carrier in a notch of a circular aperture in a template overlying the substrate; reflowing the bonding material to self align the leads to the pads by permitting free rotation of the chip carrier about the loosely captured corner; and solidifying the material to form the bond.
Claim 4
Dependent Claim
74 words
roughly aligning the chip carrier leads to the respective bonding pads on a first major surface of the planar substrate; loosely capturing a corner of the chip carrier in a notch of a circular aperture in a template overlying the substrate; reflowing the bonding material to self align the leads to the pads by permitting free rotation of the chip carrier about the loosely captured corner; and solidifying the material to form the bond.
Claim 5
Dependent Claim
28 words
The method as set forth in claim 1, wherein the substrate is metallized on both major surfaces of the planar substrate, the method further comprising the steps of:
Claim 6
Dependent Claim
19 words
roughly aligning chip carrier leads to the respective bonding pads on the second major surface of the planar substrate;
Claim 7
Dependent Claim
19 words
roughly aligning chip carrier leads to the respective bonding pads on the second major surface of the planar substrate;
Claim 8
Dependent Claim
26 words
loosely capturing a corner of the chip carriers on the second major surface in a notch of a circular aperture in a template overlying the substrate;
Claim 9
Dependent Claim
26 words
loosely capturing a corner of the chip carriers on the second major surface in a notch of a circular aperture in a template overlying the substrate;
Claim 10
Dependent Claim
27 words
reflowing the bonding material to simultaneously self align the leads to the pads by permitting free rotation of the chip carrier about the loosely captured corner; and
Claim 11
Dependent Claim
27 words
reflowing the bonding material to simultaneously self align the leads to the pads by permitting free rotation of the chip carrier about the loosely captured corner; and
Claim 12
Dependent Claim
7 words
solidifying the material to form the bonds.
Claim 13
Dependent Claim
7 words
solidifying the material to form the bonds.
References Cited (Backward Citations)
US3429040A
Cited
US3387365A
Cited
US3480836A
Cited
US3457639A
Cited
US3871936A
Cited
US4079509A
Cited
US3802069A
Cited
US3777221A
Cited
US3869787A
Cited
US3982979A
Cited
US4032058A
Cited
US3918146A
Cited
US4295596A
Cited
US4334646A
Cited
US4371912A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-04-22 | 1988-10-22 | 1989-04-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-04-22 | 1992-10-22 | 1993-04-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-04-22 | 1996-10-22 | 1997-04-23 | $7700.00 | Window Closed / Lapsed |