US4508754A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of adding fine line conductive/resistive patterns to a thick film microcircuit
Assignee: AG Communication Systems Corp
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Filing: 1982-08-19
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Granted: 1985-04-02
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Expires: 2002-08-19
Abstract
Abstract A method of adding fine line circuits to a thick film microcircuit comprising the steps of: cutting a circuit pattern on a substrate; filling the circuit pattern with a conductive or resistive paste and removing the excess; adding screen printing thick film circuit elements on the substrate surface and over selected portions of the fine line pattern; and heating thereby sintering the paste and thick film elements to the substrate.
Inventors
- 👤 William E. Stepan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:06
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263; H05K1/0265; H05K3/00; H05K3/10; H05K3/12; H05K3/1258; H10; H10D; H10D84/00; H10D84/01; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K1/16; H05K1/167; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09209; H05K2201/09654; H05K2201/09727; H05K2203/00; H05K2203/02; H05K2203/0228; H05K2203/025; H05K2203/14; H05K2203/1476; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0029; H05K3/0044; H05K3/107; H05K3/1216
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
118 words
The method of adding fine line circuits to a thick film microcircuit comprising the steps of; providing a dielectric substrate surface; forming an engraved circuit pattern on said dielectric substrate surface by directing engraving means to cut and remove selected portions of said dielectric substrate surface; applying a circuit medium over said engraved pattern; wiping said circuit medium off of said dielectric substrate surface leaving said engraved pattern filled with said circuit medium; screen printing thick film circuit elements on said dielectric substrate surface and over selected portions of said engraved circuit pattern; and heating said substrate, to cause said circuit medium and said thick film elements to be sintered to said substrate establishing said thick film microcircuit.
Claim 2
Independent Claim
118 words
The method of adding fine line circuits to a thick film microcircuit comprising the steps of; providing a dielectric substrate surface; forming an engraved circuit pattern on said dielectric substrate surface by directing engraving means to cut and remove selected portions of said dielectric substrate surface; applying a circuit medium over said engraved pattern; wiping said circuit medium off of said dielectric substrate surface leaving said engraved pattern filled with said circuit medium; screen printing thick film circuit elements on said dielectric substrate surface and over selected portions of said engraved circuit pattern; and heating said substrate, to cause said circuit medium and said thick film elements to be sintered to said substrate establishing said thick film microcircuit.
Claim 3
Dependent Claim
22 words
The method according to claim 1, wherein said circuit medium is an electrically conductive paste, disposed to form electrically conductive circuit patterns.
Claim 4
Dependent Claim
22 words
The method according to claim 1, wherein said circuit medium is an electrically resistive paste disposed to form electrically resistive circuit patterns.
Claim 5
Dependent Claim
19 words
The method according to claim 3, wherein said engraving means includes directing a laser beam to form said pattern.
Claim 6
Dependent Claim
20 words
The method according to claim 4, wherein said engraving means includes directing a sandblasting stream to form said circuit pattern.
Claim 7
Dependent Claim
19 words
The method according to claim 4, wherein said engraving means includes directing engraving tools to form said circuit pattern.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-04-01 | 1988-10-01 | 1989-04-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-04-01 | 1992-10-01 | 1993-04-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-04-01 | 1996-10-01 | 1997-04-02 | $7700.00 | Window Closed / Lapsed |