US4336320A
Expired / Lapsed
US
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Process for dielectric stenciled microcircuits
Assignee: Honeywell Inc
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Filing: 1981-03-12
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Granted: 1982-06-22
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Expires: 2001-03-12
Abstract
Abstract The present invention is directed to a process for complex, high density microcircuits in which thick film dielectric pastes are photolithography patterned into high resolution stencils to produce complementary conductor circuitry patterns, the voids of the developed dielectric stencil are filled with thick film conductor paste, and then there is a cofiring of the conductor and the dielectric. With this new process the number of separate firing operations is reduced. The reduction in the number of firings is important in multilevel hybrid structures.
Inventors
- 👤 John P. Cummings
- 👤 Janice D. Makos
- 👤 David E. Pitkanen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 19:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; G; G03; G03F; G03F7/00; H05K3/10; H05K3/12; H05K3/1258; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0514; H05K2203/0562; H05K2203/0568; H05K3/0011; H05K3/0017; H05K3/002; H05K3/0023; H05K3/107; H05K3/40; H05K3/4038; H05K3/4053; H05K3/465
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
83 words
A process for fabricating dielectric stenciled microcircuits comprising the steps of: coating an insulating dielectric paste and photopatterning means over the surface of a substrate; selectively exposing through a photolithography mask the substrate coating to light; removing the exposed dielectric paste in the areas where the conductive circuit lines are to be located, thereby forming a dielectric stencil with voids; filling the dielectric stencil voids with thick-film conductive paste to form the conductive lines; and, cofiring the dielectric paste and the conductive paste.
Claim 2
Dependent Claim
83 words
A process for fabricating dielectric stenciled microcircuits comprising the steps of: coating an insulating dielectric paste and photopatterning means over the surface of a substrate; selectively exposing through a photolithography mask the substrate coating to light; removing the exposed dielectric paste in the areas where the conductive circuit lines are to be located, thereby forming a dielectric stencil with voids; filling the dielectric stencil voids with thick-film conductive paste to form the conductive lines; and, cofiring the dielectric paste and the conductive paste.
Claim 3
Dependent Claim
26 words
The process according to claim 1 wherein the cofiring is in a nitrogen atmosphere at a temperature range of about 800° C. to about 1000° C.
Claim 4
Dependent Claim
26 words
The process according to claim 1 wherein the cofiring is in an air atmosphere at a temperature range of about 800° C. to about 1000° C.
Claim 5
Dependent Claim
16 words
The process according to claim 3 wherein the thick film conductive paste is a noble metal.
Claim 6
Dependent Claim
16 words
The process according to claim 2 wherein the thick film conductive paste is a base metal.
Claim 7
Dependent Claim
12 words
The process according to claim 5 wherein the base metal is copper.
Claim 8
Dependent Claim
20 words
The process according to claim 1 wherein the photopatterning means of the coating is a constituent of the dielectric paste.
Claim 9
Dependent Claim
23 words
The process according to claim 1 wherein the photopatterning means of the coating is a layer of photoresist deposited over the dielectric paste.
Claim 10
Dependent Claim
101 words
A process for fabricating dielectric stenciled microcircuits comprising the steps of: depositing a layer of an insulating dielectric paste over the surface of a substrate and drying the dielectric paste layer; depositing a layer of photoresist over the insulating dielectric paste and drying the photoresist layer; selectively exposing through a photolithography mask the photoresist layer to light; removing the photoresist and dielectric layer where the conductive circuit lines are to be, thereby forming a dielectric stencil with voids; filling the dielectric stencil voids with thick-film conductive paste to form the conductive lines; and, cofiring the dielectric layer and the conductive paste.
Claim 11
Dependent Claim
101 words
A process for fabricating dielectric stenciled microcircuits comprising the steps of: depositing a layer of an insulating dielectric paste over the surface of a substrate and drying the dielectric paste layer; depositing a layer of photoresist over the insulating dielectric paste and drying the photoresist layer; selectively exposing through a photolithography mask the photoresist layer to light; removing the photoresist and dielectric layer where the conductive circuit lines are to be, thereby forming a dielectric stencil with voids; filling the dielectric stencil voids with thick-film conductive paste to form the conductive lines; and, cofiring the dielectric layer and the conductive paste.
Claim 12
Dependent Claim
26 words
The process according to claim 9 wherein the cofiring is in a nitrogen atmosphere at a temperature range of about 800° C. to about 1000° C.
Claim 13
Dependent Claim
26 words
The process according to claim 9 wherein the cofiring is in an air atmosphere at a temperature range of about 800° C. to about 1000° C.
Claim 14
Dependent Claim
16 words
The process according to claim 11 wherein the thick film conductive paste is a noble metal.
Claim 15
Dependent Claim
16 words
The process according to claim 10 wherein the thick film conductive paste is a base metal.
Claim 16
Dependent Claim
12 words
The process according to claim 13 wherein the base metal is copper.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-06-21 | 1985-12-21 | 1986-06-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-06-21 | 1989-12-21 | 1990-06-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-06-21 | 1993-12-21 | 1994-06-22 | $7700.00 | Window Closed / Lapsed |