Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
218 words
A method of selectively depositing brazeable and solderable coatings over an existing metallurgical pattern of a dielectric substrate, comprising: sequentially blanket coating said substrate, inclusive of said pattern, with discrete levels of two diverse alloyable metals capable of forming a continuous series of solid solutions and showing a minimum in the liquidus curve in their phase diagram to form brazeable and solderable with the alloys of said metals bondable to said pattern and non-wetting to the bare surfaces of said substrate, heating said substrate to a temperature below the melting points of said metals and above the lowest liquidus temperature in the phase diagram of the alloy system of said metals, with said heating being maintained for sufficient time to obtain interdiffusion of the component metals to form an alloy composition, at the interface with the substrate, corresponding to the composition of the said lowest liquidus temperature in the phase diagram of the component metals, whereby said alloy of said metals contacts and is bonded to said pattern and dewets the bare surfaces of said substrate to form loosely adhered alloy segments thereon; cooling said substrate to solidify said coating and said segments thereon; and removing said segments from said bare surfaces of said substrate with retention of a brazeable or solderable alloy coating formed on said pattern.
Claim 2
Independent Claim
218 words
A method of selectively depositing brazeable and solderable coatings over an existing metallurgical pattern of a dielectric substrate, comprising: sequentially blanket coating said substrate, inclusive of said pattern, with discrete levels of two diverse alloyable metals capable of forming a continuous series of solid solutions and showing a minimum in the liquidus curve in their phase diagram to form brazeable and solderable with the alloys of said metals bondable to said pattern and non-wetting to the bare surfaces of said substrate, heating said substrate to a temperature below the melting points of said metals and above the lowest liquidus temperature in the phase diagram of the alloy system of said metals, with said heating being maintained for sufficient time to obtain interdiffusion of the component metals to form an alloy composition, at the interface with the substrate, corresponding to the composition of the said lowest liquidus temperature in the phase diagram of the component metals, whereby said alloy of said metals contacts and is bonded to said pattern and dewets the bare surfaces of said substrate to form loosely adhered alloy segments thereon; cooling said substrate to solidify said coating and said segments thereon; and removing said segments from said bare surfaces of said substrate with retention of a brazeable or solderable alloy coating formed on said pattern.
Claim 3
Dependent Claim
18 words
The method of claim 1 where said segments are ultrasonically removed from said bare surfaces of said substrate.
Claim 4
Dependent Claim
15 words
The method of claim 1 wherein said metallurgical pattern is comprised of a refractory metal.
Claim 5
Dependent Claim
11 words
The method of claim 3 wherein said refractory metal is molybdenum.
Claim 6
Dependent Claim
15 words
The method of claim 1 wherein said substrate is comprised of an alumina based ceramic.
Claim 7
Dependent Claim
15 words
The method of claim 5 wherein said metallurgical pattern is comprised of a refractory metal.
Claim 8
Dependent Claim
13 words
The method of claim 6 wherein said refractory metal is comprised of molybdenum.
Claim 9
Dependent Claim
18 words
The method of claim 7 where said segments are ultrasonically removed from said bare surfaces of said substrate.
Claim 10
Dependent Claim
19 words
The method of claim 7 wherein said metals are selected to form Pd/Ni, Au/Ni or Au/Cu binary alloy systems.
Claim 11
Dependent Claim
18 words
The method of claim 9 where said segments are ultrasonically removed from said bare surfaces of said substrate.
Claim 12
Dependent Claim
24 words
The method of claim 7 wherein said metallurgical pattern comprises contact points on the surfaces of said substrate for solder or brazing elements thereto.
Claim 13
Dependent Claim
18 words
The method of claim 11 where said segments are ultrasonically removed from said bare surfaces of said substrate.
Claim 14
Dependent Claim
19 words
The method of claim 12 wherein said metals are selected to form Pd/Ni, Au/Ni or Au/Cu binary alloy systems.
Claim 15
Dependent Claim
18 words
The method of claim 13 where said segments are ultrasonically removed from said bare surfaces of said substrate.
Claim 16
Dependent Claim
12 words
The method of claim 5 wherein said substrate is a multilayer ceramic.
Claim 17
Dependent Claim
12 words
The method of claim 15 wherein said pattern is comprised of molybdenum.
Claim 18
Dependent Claim
19 words
The method of claim 16 wherein said metals are selected to form Pd/Ni, Au/Ni or Au/Cu binary alloy systems.
Claim 19
Dependent Claim
18 words
The method of claim 17 where said segments are ultrasonically removed from said bare surfaces of said substrate.
Claim 20
Dependent Claim
11 words
The method of claim 1 wherein said substrate comprises a ceramic.