Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
166 words
An improved permeable base transistor (PBT) structure comprising: an n + -type semiconductor material substrate; a metal ohmic emitter/cathode/source contact fashioned to the bottom of said n + -type semiconductor material substrate; an n-type semiconductor material epitaxially grown on the top of said n + -type semiconductor material substrate so as to configure a plurality of trenches in said n-type semiconductor material, said n-type semiconductor material including a plurality of implantation regions fashioned therein at the bottom of corresponding ones of said plurality of trenches, said implantation regions being formed after bombardment of said n-type semiconductor material with ions selected to render said implantation regions semi-insulating; a control grid structure including a plurality of Schottky metal control grid elements operatively emplaced contiguously to corresponding ones of said plurality of implantation regions; and a collector/anode/drain structure including a plurality of Schottky metal collector/anode/drain contacts deposited on the top surface of said n-type semiconductor material, said collector/anode/drain contacts being deposited during the fabrication of said control grid structure.
Claim 2
Dependent Claim
166 words
An improved permeable base transistor (PBT) structure comprising: an n + -type semiconductor material substrate; a metal ohmic emitter/cathode/source contact fashioned to the bottom of said n + -type semiconductor material substrate; an n-type semiconductor material epitaxially grown on the top of said n + -type semiconductor material substrate so as to configure a plurality of trenches in said n-type semiconductor material, said n-type semiconductor material including a plurality of implantation regions fashioned therein at the bottom of corresponding ones of said plurality of trenches, said implantation regions being formed after bombardment of said n-type semiconductor material with ions selected to render said implantation regions semi-insulating; a control grid structure including a plurality of Schottky metal control grid elements operatively emplaced contiguously to corresponding ones of said plurality of implantation regions; and a collector/anode/drain structure including a plurality of Schottky metal collector/anode/drain contacts deposited on the top surface of said n-type semiconductor material, said collector/anode/drain contacts being deposited during the fabrication of said control grid structure.
Claim 3
Dependent Claim
48 words
The improved structure of claim 1 wherein each one of said plurality of Schottky metal control grid elements, after fabrication, is configured like an inverted upper case letter T thereby remaining thin relative to the width of corresponding ones of said plurality of trenches at the tops thereof.
Claim 4
Dependent Claim
30 words
The improved structure of claim 2 wherein the widths of corresponding ones of said plurality of trenches at the tops thereof, after fabrication, are in the range of 1200-1500 Å.
Claim 5
Dependent Claim
16 words
The improved structure of claim 3 wherein said n + -type semiconductor material substrate comprises GaAs.
Claim 6
Dependent Claim
40 words
The improved structure of claim 4 wherein said n-type semiconductor material epitaxially grown on the top of said n + -type semiconductor material substrate is GaAs, and wherein the dominant donor impurity chosen for the sourcegrid (gate) region is silicon.
Claim 7
Dependent Claim
14 words
The improved structure of claim 5 wherein said ions selected are energetic oxygen ions.
Claim 8
Dependent Claim
16 words
The improved structure of claim 4 where said n + -type semiconductor material substrate comprises silicon.
Claim 9
Dependent Claim
26 words
The improved structure of claim 7 wherein said n-type semiconductor material epitaxially grown on the top of said n + -type semiconductor material substrate comprises silicon.
Claim 10
Dependent Claim
13 words
The improved structure of claim 8 wherein said ions selected are boron ions.
Claim 11
Dependent Claim
52 words
The improved structure of claim 9 wherein the bombardment of said plurality of implantation regions with said boron ions is followed by an etching so as to render said plurality of implantation regions porous, and wherein the etching is followed by an oxidation of the porous regions thereby producing silicon dioxide thereat.