US4488506A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metallization plant
Assignee: ITT Inc
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Filing: 1982-06-15
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Granted: 1984-12-18
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Expires: 2002-06-15
Abstract
Abstract An apparatus for depositing metal or alloy films by a thermal decomposition process on a substrate includes a furnace having a number of selectively heated zones. The temperature of each zone is controllable so as to provide compensation for changes in the concentration of reactant materials in the different regions of the furnace. Means are provided for the safe handling of highly pyrophoric organometallic reactants. The apparatus may be used for the deposition of aluminium/silicon alloy films on semiconductor wafers in the manufacture of integrated circuits.
Inventors
- 👤 Rudolf A. H. Heinecke
- 👤 Ronald C. Stern
- 👤 Michael J. Cooke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 17:48
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
147 words
An apparatus for depositing a metal or alloy film on solid substrates by thermal decomposition of one or more volatile metal compounds, comprising: means for defining an enclosed deposition zone; a vessel for receiving a quantity of the metal compound in liquified form and form which the compound evaporates as a volatile compound; means for supplying the volatile compound from the vessel to the deposition zone; and means for maintaining the vessel at a steady temperature at which said compound is substantially stable and for supplying heat to the liquid compound therein at a rate sufficient for replacing the latent heat of evaporation and controlling the rate at which the liquid is evaporated and further comprising a cold trap for condensing spent reactant gases, and means for spraying the cold trap with an inert liquid which freezes on the cold trap to form a barrier layer thereon.
Claim 2
Independent Claim
147 words
An apparatus for depositing a metal or alloy film on solid substrates by thermal decomposition of one or more volatile metal compounds, comprising: means for defining an enclosed deposition zone; a vessel for receiving a quantity of the metal compound in liquified form and form which the compound evaporates as a volatile compound; means for supplying the volatile compound from the vessel to the deposition zone; and means for maintaining the vessel at a steady temperature at which said compound is substantially stable and for supplying heat to the liquid compound therein at a rate sufficient for replacing the latent heat of evaporation and controlling the rate at which the liquid is evaporated and further comprising a cold trap for condensing spent reactant gases, and means for spraying the cold trap with an inert liquid which freezes on the cold trap to form a barrier layer thereon.
Claim 3
Independent Claim
133 words
An apparatus for depositing a metal or alloy film on solid substrates by thermal decomposition of one or more volatile metal compounds, comprising: a chamber for receiving said substrates for exposure to the volatile compounds, said chamber including a plurality of zones each of which is provided with heating means, and control means for selectively controlling the temperature of each of said zones via the respective heating means in such a manner in dependence on the depletion of the volatile compounds that the deposition rate of the metal or alloy in all of said zones is substantially the same and further comprising a cold trap for condensing spent reactant gases; and means for spraying the cold trap with an inert liquid which freezes on the cold trap to form a barrier layer thereon.
Claim 4
Independent Claim
133 words
An apparatus for depositing a metal or alloy film on solid substrates by thermal decomposition of one or more volatile metal compounds, comprising: a chamber for receiving said substrates for exposure to the volatile compounds, said chamber including a plurality of zones each of which is provided with heating means, and control means for selectively controlling the temperature of each of said zones via the respective heating means in such a manner in dependence on the depletion of the volatile compounds that the deposition rate of the metal or alloy in all of said zones is substantially the same and further comprising a cold trap for condensing spent reactant gases; and means for spraying the cold trap with an inert liquid which freezes on the cold trap to form a barrier layer thereon.
Claim 5
Dependent Claim
27 words
An apparatus as claimed in claim 1 or 2, and further comprising means for exposing the substrate to a surface catalyzing or activating gas prior to metallisation.
Claim 6
Dependent Claim
25 words
An apparatus as claimed in claim 1 or 2, and further comprising means for alloying a deposited metal film with a further vapour deposited element.
References Cited (Backward Citations)
US2916593A
Cited
US3206325A
Cited
US3160517A
Cited
US3637422A
Cited
US3791158A
Cited
US4328261A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-12-18 | 1988-06-18 | 1988-12-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-12-18 | 1992-06-18 | 1992-12-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-12-18 | 1996-06-18 | 1996-12-18 | $7700.00 | Window Closed / Lapsed |