Device for use in making encapsulated chip capacitor assemblies

Claim 1

An article adapted to be sliced and machined to provide encapsulated chip capacitors. (i) comprising an elongated U-shaped metal channel having parallel first and second side members and bottom member, said bottom member having therein a trough parallel to said side members and spaced therefrom, (ii) a plurality of spaced-apart electrolytic tantalum capacitors arranged within said channel, each said capacitor including: (a) a tantalum body of generally rectangular cross-section having front, rear, bottom, top and side surfaces with portions of said bottom and side surfaces being provided with a cathode metallization and, (b) an axial tantalum lead wire extending from said front surface, each said capacitor being positioned within said channel such that (i) the axial tantalum anode lead wire thereof is substantially perpendicular to and extends toward the first side member of said channel with the end of said extended wire being closely adjacent to said first side member, (ii) the rear surface thereof is closely adjacent to the second side member of said channel, (iii) the bottom surface thereof is closely adjacent to the bottom member of said channel, (iii) a plurality of separate first electrical connections between a portion of the cathode metallization of each said capacitor and an adjacently opposite portion of said channel on one side of said trough, (iv) a plurality of separate second electrical connections between the tantalum anode lead wire of each said capacitor and said channel at a portion of said channel adjacent to said anode lead wire on the opposite side of said trough, and (v) encapsulant insulating material surrounding each capacitor and said plurality of first and second electrical connections and filling the volume defined by said channel including the trough of said channel.