Patent US4479140A successfully refreshed from Google Patents.
← Back to Patent Explorer
US4479140A Expired / Lapsed US ⏱️ 0.0 years remaining

Thermal conduction element for conducting heat from semiconductor devices to a cold plate

Assignee: International Business Machines Corp
•
Filing: 1982-06-28
•
Granted: 1984-10-23
•
Expires: 2002-06-28
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cover positioned in close proximity to the bridge element has an axially compressible spring member with a bulged central portion, a first flat plate member adapted to be placed in contact with the device, a second flat plate member adapted to be disposed in contact with the cold plate or cover, and a means to maintain the spring member, the first plate member and the second plate member in operative engagement.

Inventors

  • 👤 Joseph L. Horvath

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 19:44
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 111 words
A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device mounted on a substrate to a cold plate in close proximity to the device comprising a generally annular shaped spring member provided with a compressible bulged first central portion a first flat plate member adapted to be disposed in contact with the back side of said device, a means to join said first plate to said bulged first central portion of said spring member, a second flat plate member adapted to be disposed in contact with said cold plate, and a means to join said spring member and second plate member in contacting engagement.
Claim 2
Dependent Claim 111 words
A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device mounted on a substrate to a cold plate in close proximity to the device comprising a generally annular shaped spring member provided with a compressible bulged first central portion a first flat plate member adapted to be disposed in contact with the back side of said device, a means to join said first plate to said bulged first central portion of said spring member, a second flat plate member adapted to be disposed in contact with said cold plate, and a means to join said spring member and second plate member in contacting engagement.
Claim 3
Dependent Claim 42 words
The bridge element of claim 1 wherein a coating of solder is provided at least on the interface between said spring member and said first plate member, and at least on the interface between said spring member and said second plate member.
Claim 4
Dependent Claim 47 words
The bridge element of claim 1 wherein said first plate member and said second plate members are formed of solder wettable metal, a coating layer of solder is provided on said first and said second members, and the surface of said spring member is unwettable to solder.
Claim 5
Dependent Claim 17 words
The bridge element of claim 3 wherein said first and second plate members are formed of Cu.
Claim 6
Dependent Claim 29 words
The bridge member of claim 3 wherein said spring member is formed of an alloy that includes Cu, and has a surface oxide layer that renders the surface non-solderable.
Claim 7
Dependent Claim 31 words
The bridge element of claim 3 wherein said coating layer of solder has a thickness in the range of 0.001-0.005 inches with a melting point in the range of 100°-200° C.
Claim 8
Dependent Claim 31 words
The bridge element of claim 2 wherein a coating of solder is provided on the face of said first plate member that is adapted to be in contact with the device.
Claim 9
Dependent Claim 49 words
The bridge element of claim 1 wherein said spring member is annular in shape with a bulged first central portion, and said means to join said first plate to said spring member is a projection received in an aperture in the bulged first central portion of said spring member.
Claim 10
Dependent Claim 29 words
The bridge element of claim 8 wherein said means to maintain said spring member and second plate member in contacting engagement is a flange on said second plate member.
Claim 11
Dependent Claim 23 words
The bridge element of claim 9 wherein clearance is provided between said flange and the edge of said spring member allowing for flexure.
Claim 12
Dependent Claim 25 words
The bridge element of claim 10 wherein said spring member is provided with radially outwardly extending slots to decrease the force necessary to produce flexure.

References Cited (Backward Citations)

US3315136A Cited
DE1564243A1 Cited
US3449642A Cited
US3717797A Cited
US3896544A Cited
US3996447A Cited
US4093971A Cited
US4235285A Cited
US4263965A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-10-23 1988-04-23 1988-10-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-10-23 1992-04-23 1992-10-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-10-23 1996-04-23 1996-10-23 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag