US3896544A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making resilient electrical contact assembly for semiconductor devices
Assignee: RTX Corp
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Filing: 1974-02-04
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Granted: 1975-07-29
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Expires: 1994-02-04
Abstract
Abstract A semiconductor assembly employing a resilient material having electrically conductive particles dispersed throughout in intimate electrical and thermal contact with a semiconductor chip. Pressure is applied to the resilient material to hold the semiconductor chip in place and to maintain good electrical and thermal contact to the chip. Electrical and thermal connections are made from semiconductor chip to the outside of a case member by electrical contact members which electrically contact the resilient material.
Inventors
- 👤 Robert D Fosnough
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 22:20
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W40/00; H10W40/70; H10W72/00; H10W76/00; H10W76/40; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/754
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
130 words
A method of making a semiconductor device having a PN semiconductor chip, a case member, and a cap assembly, comprising the steps of: placing said PN semiconductor chip between first and second preformed, resilient, elastomeric, compressible pads of substantially uniform thickness throughout, said pads having a plurality of electrically and thermally conductive particles dispersed therethrough, said particles engaging one another to establish electrically and thermally conductive paths through said pads to render them electrically and thermally conductive; positioning said first pad in abutting unbonded contact with said case member; positioning said cap assembly in abutting unbonded contact with said second pad; moving said cap assembly and said case member toward each other to compress said pads; securing said cap assembly to said case member while maintaining said pads in compression.
Claim 2
Independent Claim
130 words
A method of making a semiconductor device having a PN semiconductor chip, a case member, and a cap assembly, comprising the steps of: placing said PN semiconductor chip between first and second preformed, resilient, elastomeric, compressible pads of substantially uniform thickness throughout, said pads having a plurality of electrically and thermally conductive particles dispersed therethrough, said particles engaging one another to establish electrically and thermally conductive paths through said pads to render them electrically and thermally conductive; positioning said first pad in abutting unbonded contact with said case member; positioning said cap assembly in abutting unbonded contact with said second pad; moving said cap assembly and said case member toward each other to compress said pads; securing said cap assembly to said case member while maintaining said pads in compression.
Claim 3
Independent Claim
181 words
A method of making a transistor assembly having a semiconductor chip with emitter, collector and base contact areas, a case Member through which contact is made to the emitter and base contact areas of the semiconductor chip and to which said collector contact area is electrically and thermally connected, and a cap attached to said case member to enclose said semiconductor chip, comprising the steps of: positioning a preformed resilient elastomeric compressible pad of substantially uniform thickness throughout in abutting unbonded contact with said case member and said collector contact area to electrically and thermally connect said case member with said collector contact area, said pad containing a plurality of electrically and thermally conductive particles dispersed therethrough, said particles engaging one another to establish electrically and thermally conductive paths through said pad to render it electrically and thermally conductive; Compressing said pad to maintain electrical and thermal contact between said collector contact area and said case member; making electrical connections to said emitter and base contact areas; and attaching said cap member to said case member to enclose said semiconductor chip.
Claim 4
Independent Claim
181 words
A method of making a transistor assembly having a semiconductor chip with emitter, collector and base contact areas, a case Member through which contact is made to the emitter and base contact areas of the semiconductor chip and to which said collector contact area is electrically and thermally connected, and a cap attached to said case member to enclose said semiconductor chip, comprising the steps of: positioning a preformed resilient elastomeric compressible pad of substantially uniform thickness throughout in abutting unbonded contact with said case member and said collector contact area to electrically and thermally connect said case member with said collector contact area, said pad containing a plurality of electrically and thermally conductive particles dispersed therethrough, said particles engaging one another to establish electrically and thermally conductive paths through said pad to render it electrically and thermally conductive; Compressing said pad to maintain electrical and thermal contact between said collector contact area and said case member; making electrical connections to said emitter and base contact areas; and attaching said cap member to said case member to enclose said semiconductor chip.
Claim 5
Independent Claim
182 words
A method of making a semiconductor assembly having a semiconductor chip with a plurality of contact areas, a case member to which one of said contact areas is electrically and thermally connected, means for making electrical connections to the remainder of said contact areas, and a cap attached to said case member to enclose said semiconductor chip, comprising the steps of: positioning a preformed resilient elastomeric compressible pad of substantially uniform thickness throughout in abutting unbonded contact with said case member and said one of said contact areas to electrically and thermally connect said case member with said one of said contact areas, said pad containing a plurality of electrically and thermally conductive particles dispersed therethrough, said particles engaging one another to establish electrically and thermally conductive paths through said pad to render it electrically and thermally conductive; compressing said pad to maintain electrical and thermal contact between said one of said contact areas and said case member; making electrical connections to the remainder of said contact areas; and attaching said cap member to said case member to enclose said semiconductor chip.
Claim 6
Independent Claim
182 words
A method of making a semiconductor assembly having a semiconductor chip with a plurality of contact areas, a case member to which one of said contact areas is electrically and thermally connected, means for making electrical connections to the remainder of said contact areas, and a cap attached to said case member to enclose said semiconductor chip, comprising the steps of: positioning a preformed resilient elastomeric compressible pad of substantially uniform thickness throughout in abutting unbonded contact with said case member and said one of said contact areas to electrically and thermally connect said case member with said one of said contact areas, said pad containing a plurality of electrically and thermally conductive particles dispersed therethrough, said particles engaging one another to establish electrically and thermally conductive paths through said pad to render it electrically and thermally conductive; compressing said pad to maintain electrical and thermal contact between said one of said contact areas and said case member; making electrical connections to the remainder of said contact areas; and attaching said cap member to said case member to enclose said semiconductor chip.
Claim 7
Dependent Claim
28 words
The method as defined in claim 3 wherein said pad is normally electrically and thermally non-conductive and is rendered electrically and thermally conductive in response to compression thereof.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-07-28 | 1979-01-27 | 1979-07-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-07-28 | 1983-01-27 | 1983-07-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-07-28 | 1987-01-27 | 1987-07-29 | $7700.00 | Window Closed / Lapsed |