Abstract A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge formed at the boundary of a second face portion opposite said first face portion for increasing impact resistance to chipping and cracking of the ceramic substrate. A method of manufacturing the ceramic substrate includes adding the ceramic powder to a first mold member, pressing a force applying member into the first mold member, forming on the ceramic substrate a first and second stepped crest, sintering the ceramic substrate and grinding at least one of the first and second stepped crests so as to round the at least one of the stepped crests.
A method of manufacturing a ceramic substrate for a semiconductor package utilizing a first and second mold member and a force applying member projecting from said second mold member, said force applying member having a trapezoidal section projecting therefrom, which comprises: adding ceramic powder to said first mold member; pressing said force applying member into said first mold member so as to compact said ceramic powder and form said ceramic substrate; forming on said ceramic substrate a nearly rectangular parallelepiped form having rounded corners and a stepwisely formed portion with an upper crest portion having a rounded edge and a sharp lower crest portion; sintering said ceramic substrate; and grinding off said sharp lower crest portion of said substrate to provide a rounded crest so as to increase impact resistance to chipping and cracking upon said ceramic substrate being inpacted with an adjacent ceramic substrate wherein said stepwise forming of said upper and lower stepped crest further comprises forming said upper and lower stepped crests so as to have a radius of curvature of between 0.04 and 0.06 mm inclusive.
Claim 2
Independent Claim
180 words
A method of manufacturing a ceramic substrate for a semiconductor package utilizing a first and second mold member and a force applying member projecting from said second mold member, said force applying member having a trapezoidal section projecting therefrom, which comprises: adding ceramic powder to said first mold member; pressing said force applying member into said first mold member so as to compact said ceramic powder and form said ceramic substrate; forming on said ceramic substrate a nearly rectangular parallelepiped form having rounded corners and a stepwisely formed portion with an upper crest portion having a rounded edge and a sharp lower crest portion; sintering said ceramic substrate; and grinding off said sharp lower crest portion of said substrate to provide a rounded crest so as to increase impact resistance to chipping and cracking upon said ceramic substrate being inpacted with an adjacent ceramic substrate wherein said stepwise forming of said upper and lower stepped crest further comprises forming said upper and lower stepped crests so as to have a radius of curvature of between 0.04 and 0.06 mm inclusive.