US4457976A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for mounting a sapphire chip on a metal base and article produced thereby
Assignee: Intersil Corp
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Filing: 1983-03-28
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Granted: 1984-07-03
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Expires: 2003-03-28
Abstract
Abstract A sapphire chip is bonded to a metal substrate by means of an intermediate layer of 98% by weight of gold and 2% by weight of silicon. The intermediate layer directly contacts and is bonded to a bare, uncoated surface of the sapphire chip and a surface of the substrate.
Inventors
- 👤 Thomas J. Faith, Jr.
- 👤 Robert S. Irven
- 👤 Sabrina K. Plante
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 08:45
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/30; B23K35/3013; H; H10; H10W; H10W95/00; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/30; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W90/00; H10W90/701; H10W90/731; H10W90/736; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31652; Y10T428/31663; Y10T428/31678
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
51 words
An assembly comprising: a metal substrate, a sapphire chip seated on a surface of said substrate, and a bonding layer of gold-silicon eutectic directly contacting and bonded to a surface of said substrate and a bare surface of said sapphire chip so as to secure said sapphire chip to said substrate.
Claim 2
Dependent Claim
51 words
An assembly comprising: a metal substrate, a sapphire chip seated on a surface of said substrate, and a bonding layer of gold-silicon eutectic directly contacting and bonded to a surface of said substrate and a bare surface of said sapphire chip so as to secure said sapphire chip to said substrate.
Claim 3
Dependent Claim
23 words
An assembly in accordance with claim 1 wherein said gold-silicon eutectic contains 98% by weight of gold and 2% by weight of silicon.
Claim 4
Dependent Claim
17 words
An assembly in accordance with claim 2 wherein the said surface of the substrate is of gold.
Claim 5
Independent Claim
59 words
A method of bonding a sapphire chip to a metal substrate comprising the steps of: placing a preform of a gold-silicon between and in direct contact with a bare, uncoated surface of said sapphire chip and a surface of said substrate, and heating said assembly until the preform flows and bonds to each of said sapphire chip and substrate.
Claim 6
Independent Claim
59 words
A method of bonding a sapphire chip to a metal substrate comprising the steps of: placing a preform of a gold-silicon between and in direct contact with a bare, uncoated surface of said sapphire chip and a surface of said substrate, and heating said assembly until the preform flows and bonds to each of said sapphire chip and substrate.
Claim 7
Dependent Claim
23 words
A method in accordance with claim 4 in which the preform contains 98% by weight of gold and 2% by weight of silicon.
Claim 8
Dependent Claim
23 words
A method in accordance with claim 4 in which the assembly is heated to a temperature of between 400° C. and 445° C.
Claim 9
Dependent Claim
26 words
A method in accordance with claim 6 in which the sapphire chip is moved back and forth over the preform while the assembly is being heated.
Claim 10
Dependent Claim
26 words
A method in accordance with claim 2 in which the sapphire chip is pressed downwardly against the preform while it is being moved back and forth.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-07-03 | 1988-01-02 | 1988-07-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-07-03 | 1992-01-02 | 1992-07-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-07-03 | 1996-01-02 | 1996-07-03 | $7700.00 | Window Closed / Lapsed |