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US4452664A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for predetermining peel strength at copper/aluminum interface

Assignee: General Electric Co
•
Filing: 1983-08-01
•
Granted: 1984-06-05
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Expires: 2003-08-01
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Abstract

Abstract A low temperature (about 0° C. to about 100° C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch.

Inventors

  • 👤 Delton A. Grey, Jr.
  • 👤 Robert W. Green

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 03:59
CPC Classifications
B; B32; B32B; B32B7/00; B32B7/04; B32B7/06; H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/025; B32B15/00; B32B15/04; B32B15/043; B32B15/20; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/09; H05K2203/095; H05K2203/11; H05K2203/1105; H05K3/38; H05K3/389; Y; Y10; Y10T; Y10T156/00; Y10T156/11

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 102 words
The method of making a copper-clad laminate which comprises the steps of: forming a copper film on a flexible aluminum carrier sheet by vapor depositing copper directly on one clean major surface of said sheet, said major surface having a matte finish and simultaneously maintaining the temperature of said major surface in the temperature range from about 0° C. to about 100° C., the temperature being controlled such that the magnitude of the bonding developed between said copper film and bondable surface area of said major surface provides release peel strength therebetween of from about 0.1 to about 2.0 pounds per inch.
Claim 2
Independent Claim 102 words
The method of making a copper-clad laminate which comprises the steps of: forming a copper film on a flexible aluminum carrier sheet by vapor depositing copper directly on one clean major surface of said sheet, said major surface having a matte finish and simultaneously maintaining the temperature of said major surface in the temperature range from about 0° C. to about 100° C., the temperature being controlled such that the magnitude of the bonding developed between said copper film and bondable surface area of said major surface provides release peel strength therebetween of from about 0.1 to about 2.0 pounds per inch.
Claim 3
Dependent Claim 27 words
The method of claim 1 wherein the average hydrocarbon contamination of the major surface of the carrier sheet is less than about 0.4 micrograms per square centimeter.
Claim 4
Dependent Claim 30 words
The method of claim 2 wherein the level of hydrocarbon contamination is achieved by cleaning as-rolled aluminum by the process of plasma etch cleaning prior to forming the copper film.
Claim 5
Dependent Claim 15 words
The method of claim 1 wherein the copper film is deposited by electron beam evaporation.
Claim 6
Dependent Claim 27 words
The method of claim 4 wherein temperature control is effectuated by removing heat from the surface of the carrier sheet opposite the location of the copper deposition.
Claim 7
Dependent Claim 16 words
The method of claim 1 wherein the grain formation in the copper film is predominantly columnar.
Claim 8
Dependent Claim 24 words
The method of claim 1 wherein the surface roughness of the matte finish has an absolute peak-to-valley difference of less than about 0.5 micrometers.
Claim 9
Dependent Claim 19 words
The method of claim 1 wherein the thickness of the copper film deposited is less than about 5 micrometers.
Claim 10
Independent Claim 151 words
The method of making a copper-clad laminate which comprises the steps of: forming a copper film on a flexible aluminum carrier sheet by vapor depositing copper directly on one clean major surface of said carrier sheet, simultaneously maintaining the temperature of said major surface in the temperature range from about 0° C. to about 100° C., the temperature being controlled such that the magnitude of the bonding developed between said copper film and bondable surface area of said major surface provides release peel strength therebetween of from about 0.1 to about 2.0 pounds per inch, preparing the exposed major surface of said copper film for attachment thereof to an insulating substrate, placing the prepared copper film surface in juxtaposition with said substrate to form an assembly, laminating said assembly and peeling said carrier sheet away to expose the surface of said copper film that had been bonded to said carrier sheet.
Claim 11
Independent Claim 151 words
The method of making a copper-clad laminate which comprises the steps of: forming a copper film on a flexible aluminum carrier sheet by vapor depositing copper directly on one clean major surface of said carrier sheet, simultaneously maintaining the temperature of said major surface in the temperature range from about 0° C. to about 100° C., the temperature being controlled such that the magnitude of the bonding developed between said copper film and bondable surface area of said major surface provides release peel strength therebetween of from about 0.1 to about 2.0 pounds per inch, preparing the exposed major surface of said copper film for attachment thereof to an insulating substrate, placing the prepared copper film surface in juxtaposition with said substrate to form an assembly, laminating said assembly and peeling said carrier sheet away to expose the surface of said copper film that had been bonded to said carrier sheet.
Claim 12
Dependent Claim 24 words
The method of claim 9 wherein the copper film remaining attached to the substrate, after the carrier sheet is peeled away, is substantially pinhole-free.
Claim 13
Dependent Claim 18 words
The method of claim 10 wherein the thickness of the copper film is about 5 micrometers or less.

References Cited (Backward Citations)

GB990692A Cited
US3620933A Cited
GB1370893A Cited
GB1355927A Cited
GB1458260A Cited
US4372804A Cited
US4282266A Cited
US4354895A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-06-05 1987-12-05 1988-06-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-06-05 1991-12-05 1992-06-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-06-05 1995-12-05 1996-06-05 $7700.00 Window Closed / Lapsed

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