US4282266A
Expired / Lapsed
US
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Method for determining silicon content in layers of aluminum and silicon
Assignee: Intersil Corp
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Filing: 1980-05-29
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Granted: 1981-08-04
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Expires: 2000-05-29
Abstract
Abstract The method provides an extremely fast and non-destructive method for determining whether an integrated circuit will have good bonding characteristics. The method entails immersion plating of copper onto aluminum areas. Then, the aluminum areas are observed visually to see if the copper plated thereon is continuous or discontinuous. If the copper is discontinuous, the aluminum film will have good bonding characteristics.
Inventors
- 👤 Albert W. Fisher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 03:59
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/23; H10P74/235; H10P74/20; H10P74/203
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
73 words
A method for determining the silicon content in an aluminum film on a substrate comprising the steps of: (a) immersion plating said substrate in a solution comprising de-ionized water, hydrofluoric acid, and copper sulfate which will plate onto the silicon in the film while etching the aluminum film; then (b) removing said substrate from said solution and visually examining the aluminum film to determine whether the areas plated thereon are continuous or discontinuous.
Claim 2
Independent Claim
73 words
A method for determining the silicon content in an aluminum film on a substrate comprising the steps of: (a) immersion plating said substrate in a solution comprising de-ionized water, hydrofluoric acid, and copper sulfate which will plate onto the silicon in the film while etching the aluminum film; then (b) removing said substrate from said solution and visually examining the aluminum film to determine whether the areas plated thereon are continuous or discontinuous.
Claim 3
Dependent Claim
32 words
The method of claim 1 wherein said solution consists of 320 cc of de-ionized water, 8 cc of 49% hydroflouric acid, 8 cc of sulfuric acid and 8 g of copper sulfate.
Claim 4
Dependent Claim
26 words
The method of claim 1 wherein said solution consists of 320 cc of de-ionized water, 8 cc of hydroflouric acid and 8 g of copper sulfate.
Claim 5
Dependent Claim
26 words
The method of claim 1 wherein said solution consists of 320 cc of de-ionized water, 4 cc of hydroflouric acid and 4 g of copper sulfate.
References Cited (Backward Citations)
US3669734A
Cited
US3672964A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-08-03 | 1985-02-02 | 1985-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-08-03 | 1989-02-02 | 1989-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-08-03 | 1993-02-02 | 1993-08-04 | $7700.00 | Window Closed / Lapsed |