Lead frame device including ceramic encapsulated capacitor and IC chip

Claim 1

As a new article of manufacture, an integrated circuit device comprising a ceramic container including a lower shell half having a perimetral upper surface surrounding an upwardly facing central recess area and an upper shell half having a downwardly facing central recess area registering with the recess area of said lower shell half, said shell halves being bonded together along a planar parting line coincident with said upper surface of said lower shell half and together defining a chamber having a floor portion in said lower shell half, a ceramic chip capacitor bonded to said floor portion of said chamber, said capacitor including an upper surface portion and end terminations, an IC chip having an undersurface portion bonded to said upper surface portion of said capacitor, said chip including a pair of power supply input terminals, each said terminal being in proximate spaced relation to a respective one of said end terminations, a plurality of mutually spaced planar conductor members forming elements of an elongate lead frame sub-assembly interposed between said shells at said planar parting line, said conductor members being bonded to said upper surface of said lower shell half by a layer of low temperature melting insulating compound, the spaces between said conductor members being filled with increments of said insulating compound whereby the upper surface of said compound and the upper surfaces of said conductor members are in substantially co-planar alignment, said conductor members having inner end portions defining border portions of the said chamber and having outer end portions extending externally of said container, a first pair of connectors disposed within said chamber, each extending between a respective one of said power supply input terminals and end terminations, and a second pair of connectors within said chamber, each connecting one of said power supply input terminals with a different one of said conductor members.