US3846823A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor assembly
Assignee: Lucerne Products Inc
•
Filing: 1973-06-01
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Granted: 1974-11-05
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Expires: 1993-06-01
Abstract
Abstract A semiconductor assembly including a ceramic body formed to receive a semiconductor and its leads such that the body functions as an assembly fixture. The body, with the semiconductor and leads inserted therein, is positioned in a metallic cap with such assembly being retained in the cap by an encapsulating compound, or by a non-metallic cap. In another form of the invention, the assembly includes two coacting ceramic bodies secured together with a semiconductor therein. The leads may be straight, pin-shaped, L-shaped, etc.
Inventors
- 👤 B Matthews
- 👤 J Rhine
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 02:47
CPC Classifications
H; H10; H10W; H10W72/00; H10W44/00; H10W44/401; H10W72/20; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/136; H10W76/40; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
230 words
A semiconductor assembly comprising a semiconductor device having a predetermined peripheral shape, a non-conducting ceramic body defining a fixture for said assembly and having opposite faces, a shaped recess in one face thereof configured to closely coNform to the peripheral shape of said semiconductor device, a cathode electrode and a spaced gate electrode on one side of said semiconductor device, an anode electrode on the other side of said semiconductor device, an electrical lead bonded to each of said gate and cathode electrodes, openings extending through said body from said shaped recess and through to the other face thereof, said semiconductor device being received in said recess and presenting a substantially flush surface at said one face, said electrical leads extended through said openings, a cupshaped, one-piece metallic cap having a substantially flat end wall and an integral, upstanding side wall defining a cavity, said body and said semiconductor device fitted in said cavity in said cap with said anode electrode in engagement with said cap end wall, and an encapsulating compound secured in the cavity in the cap outwardly of the body to retain the assembled body, electrical leads, and semiconductor device in the cap, said ceramic body thus serving as a fixture for the electrical leads and semiconductor device in the cap whereby the semiconductor assembly can be easily and quickly fabricated under high speed production line conditions.
Claim 2
Dependent Claim
230 words
A semiconductor assembly comprising a semiconductor device having a predetermined peripheral shape, a non-conducting ceramic body defining a fixture for said assembly and having opposite faces, a shaped recess in one face thereof configured to closely coNform to the peripheral shape of said semiconductor device, a cathode electrode and a spaced gate electrode on one side of said semiconductor device, an anode electrode on the other side of said semiconductor device, an electrical lead bonded to each of said gate and cathode electrodes, openings extending through said body from said shaped recess and through to the other face thereof, said semiconductor device being received in said recess and presenting a substantially flush surface at said one face, said electrical leads extended through said openings, a cupshaped, one-piece metallic cap having a substantially flat end wall and an integral, upstanding side wall defining a cavity, said body and said semiconductor device fitted in said cavity in said cap with said anode electrode in engagement with said cap end wall, and an encapsulating compound secured in the cavity in the cap outwardly of the body to retain the assembled body, electrical leads, and semiconductor device in the cap, said ceramic body thus serving as a fixture for the electrical leads and semiconductor device in the cap whereby the semiconductor assembly can be easily and quickly fabricated under high speed production line conditions.
Claim 3
Dependent Claim
35 words
The structure of claim 1 wherein said electrical leads comprise pins, and said pins have heads that are disposed between the body and the semiconductor device and in electrical contact with the respective adjacent electrodes.
Claim 4
Dependent Claim
24 words
The structure of claim 2 wherein the cathode pin is of larger cross-sectional diameter than the gate pin to provide greater current carrying capacity.
Claim 5
Dependent Claim
16 words
The structure of claim 1 wherein said semiconductor is in the form of an equilateral triangle.
Claim 6
Dependent Claim
17 words
The structure of claim 1 wherein a semiconductor chip is disposed between an electrode and its lead.
Claim 7
Dependent Claim
12 words
The structure of claim 1 wherein said device is a semiconductor chip.
Claim 8
Dependent Claim
64 words
A semiconductor assembly as in claim 1 wherein said semiconductor device has the shape of an equilateral triangle, and said leads are headed pins disposed in said openings, whereby said body functions as a fixture for receiving the pins and semiconductor device; the heads on said pins being disposed between the body and the semiconductor device in electrical contact with the respective adjacent electrodes.
Claim 9
Dependent Claim
155 words
A semiconductor assembly comprising a substantially flat semiconductor device having a predetermined peripheral shape, a non-conducting body having opposite faces and having a recess in one face thereof, said semiconductor device snugly received in said recess and presenting a substantially flush surface at said one face, said recess conforming to the peripheral shape of the semiconductor device, at least one aperture through said body from said recess to the other face thereof, a first electrode bonded on one side of said semiconductor device and received in said recess behind said semiconductor device, an electrical lead extended through said aperture and into electrically conductive relationship with said first electrode, a second electrode bonded on the other side of said semiconductor device, and non-conducting means fixed to said body at said one face thereof and at least partially surrounding said body to retain said semiconductor device, said electrodes, said electrical leads, and said body in assembled relationship.
Claim 10
Dependent Claim
155 words
A semiconductor assembly comprising a substantially flat semiconductor device having a predetermined peripheral shape, a non-conducting body having opposite faces and having a recess in one face thereof, said semiconductor device snugly received in said recess and presenting a substantially flush surface at said one face, said recess conforming to the peripheral shape of the semiconductor device, at least one aperture through said body from said recess to the other face thereof, a first electrode bonded on one side of said semiconductor device and received in said recess behind said semiconductor device, an electrical lead extended through said aperture and into electrically conductive relationship with said first electrode, a second electrode bonded on the other side of said semiconductor device, and non-conducting means fixed to said body at said one face thereof and at least partially surrounding said body to retain said semiconductor device, said electrodes, said electrical leads, and said body in assembled relationship.
Claim 11
Dependent Claim
43 words
The structure of claim 8 wherein said lead has its end that is disposed within the body bent back upon itself in substantially a circle to effect an O-shaped configuration, with such O-shaped portion being disposed between an electrode and said non-metallic cap.
Claim 12
Dependent Claim
22 words
The structure of claim 8 wherein said lead is L-shaped in configuration with the foot of the L contacting the first electrode.
Claim 13
Dependent Claim
27 words
The structure of claim 9 wherein a trigger chip is disposed in the recess, and said O-shaped portion is disposed between the chip and the non-metallic cap.
Claim 14
Dependent Claim
31 words
The structure of claim 8 wherein said semiconductor device is a semiconductor chip, and said means is a non-Metallic cap, and a resistor is disposed between the cap and the chip.
Claim 15
Dependent Claim
31 words
The structure of claim 8 wherein said semiconductor device is a semiconductor chip, and said means is a non-metallic cap, and a capacitor is disposed between the cap and the chip.
Claim 16
Dependent Claim
13 words
The structure of claim 1 wherein the assembly is square in transverse configuration.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-11-04 | 1978-05-06 | 1978-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-11-04 | 1982-05-06 | 1982-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-11-04 | 1986-05-06 | 1986-11-05 | $7700.00 | Window Closed / Lapsed |