US4450191A
Expired / Lapsed
US
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Ammonium ions used as electroless copper plating rate controller
Assignee: Occidental Chemical Corp
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Filing: 1982-09-02
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Granted: 1984-05-22
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Expires: 2002-09-02
Abstract
Abstract A process and composition for use in electroless copper plating where the process includes contacting a substrate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster. A stabilizer may also be used. The improvement of the present invention includes contacting the substrate with a solution further comprising ammonium ions present in an amount effective to function as a plating rate controller. The improved solution is relatively stable, easy to control, and is of versatile use.
Inventors
- 👤 Donald A. Arcilesi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:01
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
65 words
In a process for applying electroless copper plating to a substrate which process includes contacting the substrate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster, the improvement comprising contacting the substrate with said solution wherein said solution further comprises ammonium ions present in an amount of from about 50-600 mg/l, effective to function as a plating rate controller.
Claim 2
Dependent Claim
65 words
In a process for applying electroless copper plating to a substrate which process includes contacting the substrate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster, the improvement comprising contacting the substrate with said solution wherein said solution further comprises ammonium ions present in an amount of from about 50-600 mg/l, effective to function as a plating rate controller.
Claim 3
Dependent Claim
25 words
The process as defined in claim 1 in which said ammonium ions are present in an amount of from about 250 to about 350 mg/L.
Claim 4
Dependent Claim
21 words
The process as defined in claim 1 in which said ammonium ions are present in an amount of about 275 mg/L.
Claim 5
Dependent Claim
67 words
In a process for applying electroless copper plating to a substrate which process includes contacting the substrate with a solution comprising copper, a complexing agent, a reducing agent, a pH adjuster, and a stabilizer, the improvement comprising contacting the substrate with said solution wherein said solution further comprises ammonium ions present in an amount of from about 50-600 mg/l, effective to function as a plating rate controller.
Claim 6
Dependent Claim
67 words
In a process for applying electroless copper plating to a substrate which process includes contacting the substrate with a solution comprising copper, a complexing agent, a reducing agent, a pH adjuster, and a stabilizer, the improvement comprising contacting the substrate with said solution wherein said solution further comprises ammonium ions present in an amount of from about 50-600 mg/l, effective to function as a plating rate controller.
Claim 7
Dependent Claim
25 words
The process as defined in claim 4 in which said ammonium ions are present in an amount of from about 250 to about 350 mg/L.
Claim 8
Dependent Claim
21 words
The process as defined in claim 4 in which said ammonium ions are present in an amount of about 275 mg/L.
Claim 9
Dependent Claim
44 words
In an electroless copper plating solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster, the improvement comprising said solution further comprising ammonium ions present in an amount of from about 50-600 mg/l, effective to function as a plating rate controller.
Claim 10
Dependent Claim
44 words
In an electroless copper plating solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster, the improvement comprising said solution further comprising ammonium ions present in an amount of from about 50-600 mg/l, effective to function as a plating rate controller.
Claim 11
Dependent Claim
25 words
The solution as defined in claim 7 in which said ammonium ions are present in an amount of from about 250 to about 350 mg/L.
Claim 12
Dependent Claim
21 words
The solution as defined in claim 7 in which said ammonium ions are present in an amount of about 275 mg/L.
Claim 13
Dependent Claim
46 words
In an electroless copper plating solution comprising copper, a complexing agent, a reducing agent, a pH adjuster, and a stabilizer, the improvement comprising said solution further comprising ammonium ions present in an amount of from about 50-600 mg/l, effective to function as a plating rate controller.
Claim 14
Dependent Claim
46 words
In an electroless copper plating solution comprising copper, a complexing agent, a reducing agent, a pH adjuster, and a stabilizer, the improvement comprising said solution further comprising ammonium ions present in an amount of from about 50-600 mg/l, effective to function as a plating rate controller.
Claim 15
Dependent Claim
25 words
The solution as defined in claim 10 in which said ammonium ions are present in an amount of from about 250 to about 350 mg/L.
Claim 16
Dependent Claim
21 words
The solution as defined in claim 10 in which said ammonium ions are present in an amount of about 275 mg/L.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-22 | 1987-11-21 | 1988-05-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-22 | 1991-11-21 | 1992-05-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-22 | 1995-11-21 | 1996-05-22 | $7700.00 | Window Closed / Lapsed |