Patent US4447842A successfully refreshed from Google Patents.
US4447842A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Finned heat exchangers for electronic chips and cooling assembly
Assignee: Control Data Corp
•
Filing: 1982-06-01
•
Granted: 1984-05-08
•
Expires: 2002-06-01
Abstract
Abstract A PC board supported by a frame has an electronic chip secured thereto. The chip has a pair of heat exchange fins. Each fin projects through a groove and into a channel of a cooling module intermediate a cooling surface of the cooling module and an expansible conduit. Each expansible conduit is totally contained within one of the channels of the cooling module and has an expanded condition and a collapsed condition. When the conduits are in their collapsed condition, the fins can be inserted through the grooves and moved along the channels of the cooling module. When the conduits are in their expanded condition, they press against the fins to force the fins against the cooling surfaces of the cooling module to cool the chip. When the expansible conduits are collapsed, the fins can be withdrawn from the cooling module channels as the PC board is withdrawn from the frame.
Inventors
- 👤 William C. Berg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 20:02
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20218; H05K7/20254
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
134 words
A cooling assembly including an electronic chip, comprising: a frame; a means supporting said chip, said chip supporting means being supported by said frame; a cooling member supported by said frame; a heat exchange member operably secured to said chip; an expansible conduit, and a means supporting said expansible conduit, said expansible conduit supporting means being supported by said frame, said expansible conduit having an expanded condition and a collapsed condition, and a means selectively converting said expansible conduit between said expanded and said collapsed conditions, said heat exchange member being positioned between said expansible conduit and said cooling member, said expansible conduit contacting said heat exchange member in said expanded condition and forcing said heat exchange member into contact with said cooling member so that said chip is cooled by said cooling member.
Claim 2
Dependent Claim
134 words
A cooling assembly including an electronic chip, comprising: a frame; a means supporting said chip, said chip supporting means being supported by said frame; a cooling member supported by said frame; a heat exchange member operably secured to said chip; an expansible conduit, and a means supporting said expansible conduit, said expansible conduit supporting means being supported by said frame, said expansible conduit having an expanded condition and a collapsed condition, and a means selectively converting said expansible conduit between said expanded and said collapsed conditions, said heat exchange member being positioned between said expansible conduit and said cooling member, said expansible conduit contacting said heat exchange member in said expanded condition and forcing said heat exchange member into contact with said cooling member so that said chip is cooled by said cooling member.
Claim 3
Dependent Claim
31 words
The cooling assembly of claim 1 wherein said expansible conduit supporting means comprises an expansible conduit carrying member secured to said frame, said expansible conduit carrying member supporting said expansible conduit.
Claim 4
Dependent Claim
28 words
The cooling assembly of claim 1 wherein said expansible conduit supporting means comprises a channel formed in said cooling member, said expansible conduit being supported in said channel.
Claim 5
Dependent Claim
90 words
The cooling assembly of claim 1 wherein said cooling member has a cooling surface and wherein a channel is provided adjacent said cooling surface, said expansible conduit being enclosed by said channel, said channel including a groove, said heat exchange member being received within said groove, and slideably moveable along said channel intermediate said cooling surface and said expansible conduit when said expansible conduit is in said collapsed condition, said expansible conduit forcing said heat exchange member against said cooling surface when said expansible conduit is in said expanded condition.
Claim 6
Dependent Claim
23 words
The cooling assembly of claim 1 wherein said heat exchange member is a fin, said fin providing a heat sink for said chip.
Claim 7
Dependent Claim
34 words
The cooling assembly of claim 5 wherein said expansible conduit overcomes a spring force in said fin to force said fin against said cooling member when said expansible conduit is in said expanded condition.
Claim 8
Dependent Claim
193 words
A cooling assembly including an electronic chip, comprising: a frame; a means supporting said chip supported by said frame; a cooling means supported by said frame, said cooling means having a first cooling surface and a second cooling surface; a heat exchange member operably secured to said chip and having a first fin and a second fin; a first length of expansible conduit and a second length of expansible conduit, said first and second lengths of expansible conduit having collapsed and expanded conditions, and a means operably associated therewith selectively converting said first and second expansible conduits between said collapsed and expanded conditions; a means supporting said first and second expansible conduits proximate to said first and second fins, respectively, said conduit supporting means being supported by said frame; said first fin being positioned intermediate said first cooling surface and said first expansible conduit, said second fin being positioned intermediate said second cooling surface and said second expansible conduit; said first expansible conduit forcing said first fin against said first cooling surface in said expanded condition; said second expansible conduit forcing said second fin against said second cooling surface in said expanded condition.
Claim 9
Dependent Claim
193 words
A cooling assembly including an electronic chip, comprising: a frame; a means supporting said chip supported by said frame; a cooling means supported by said frame, said cooling means having a first cooling surface and a second cooling surface; a heat exchange member operably secured to said chip and having a first fin and a second fin; a first length of expansible conduit and a second length of expansible conduit, said first and second lengths of expansible conduit having collapsed and expanded conditions, and a means operably associated therewith selectively converting said first and second expansible conduits between said collapsed and expanded conditions; a means supporting said first and second expansible conduits proximate to said first and second fins, respectively, said conduit supporting means being supported by said frame; said first fin being positioned intermediate said first cooling surface and said first expansible conduit, said second fin being positioned intermediate said second cooling surface and said second expansible conduit; said first expansible conduit forcing said first fin against said first cooling surface in said expanded condition; said second expansible conduit forcing said second fin against said second cooling surface in said expanded condition.
Claim 10
Dependent Claim
150 words
The cooling assembly of claim 7 wherein said cooling means comprises a first cooling block and a second cooling block, said first cooling block including said first cooling surface, said second cooling block including said second cooling surface, said conduit supporting means being positioned between said first cooling surface and said second cooling surface, said conduit supporting means having a first channel disposed adjacent said first cooling surface and a second channel disposed adjacent said second cooling surface, said first length of expansible conduit being disposed in said first channel, said second length of exansible conduit being disposed in said second channel, said first fin being moveable along said first channel adjacent said first cooling surface when said first expansible conduit is in said collapsed condition, said second fin being moveable along said second channel adjacent said second cooling surface when said second expansible conduit is in said collapsed condition.
Claim 11
Dependent Claim
97 words
The cooling assembly of claim 7 wherein said first expansible conduit overcomes an internal spring force of said first fin to force said first fin against said first cooling surface in said expanded condition, and said second expansible conduit overcomes an internal spring force of said second fin to force said second fin against said second cooling surface in said expanded condition, said first and second expansible conduits simultaneously applying opposite outward forces on said first and second fins in said expanded condition to force said first and second fins against said first and second cooling surfaces.
References Cited (Backward Citations)
US3064505A
Cited
US3589704A
Cited
US3596228A
Cited
US3893162A
Cited
US3924843A
Cited
US3911327A
Cited
US3938797A
Cited
US3993123A
Cited
US4298904A
Cited
US4381032A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-08 | 1987-11-07 | 1988-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-08 | 1991-11-07 | 1992-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-08 | 1995-11-07 | 1996-05-08 | $7700.00 | Window Closed / Lapsed |