Resilient tubular member for holding a semiconductor device together under pressure

Claim 2

An arrangement for holding the parts of a semiconductor package together under pressure and for directing a coolant over the package, the arrangement comprising: a cooling channel for receiving the semiconductor package therein and for directing a flow of the coolant thereover; the semiconductor package including at least one semiconductor component having a disc-like configuration, and contact members disposed on both sides of said component respectively; said cooling channel being made of resilient material and being in a tensioned condition so as to cause the same to apply a spring-like force directly to said package, said component and said contact members being disposed with respect to said force to conjointly coact with said channel to cause said force to hold said package together under pressure.

Claim 3

The semiconductor arrangement of claim 1, said cooling channel being a tube made of synthetic material reinforced with glass fibers.

Claim 4

The semiconductor arrangement of claim 2, said cooling channel having an elliptical cross-section.

Claim 5

The semiconductor arrangement of claim 1, said cooling channel having a non-uniform wall thickness.

Claim 6

The semiconductor arrangement of claim 1, said cooling channel being a resilient steel tube insulated at least at the interior thereof.

Claim 7

The semiconductor arrangement of claim 5, said cooling channel having an elliptical cross-section.

Claim 8

The semiconductor arrangement of claim 1 comprising additional cooling channels, each of said cooling channels being provided with at least two of said disc-like semiconductor components said two semiconductor components of each cooling channel having respective mutually adjacent surfaces defining a space therebetween, said contact members comprising for each cooling channel first and second contact members, said contact members being disposed at the respective surfaces of said semiconductor components facing away from said space, and a third contact member disposed in said space and contacting the respective surfaces of said semiconductors facing said space; and a plurality of insulating rings, said cooling channels being arranged in series with corresponding ones of said insulating rings being disposed between each two mutually adjacent ones of said cooling channels.

Claim 9

An arrangement for holding the parts of a semiconductor package together under pressure and for directing a coolant over the package, the arrangement comprising: a). an essentially elliptically shaped, cooling channel made of a resilient material, having a minor axis and a major axis; b. a semiconductor package including at least one semiconductor component having a disc-like configuration and contact therewith, the overall height of said semiconductor package from the outside of the contact member on one side to the outside of the contact member on the other side as measured along an axis through said disc-like semiconductor and perpendicular thereto being greater than the inner diameter of said cooling channel along its minor axis, said semiconductor package inserted within said cooling channel with said perpendicular axis essentially parallel to said minor axis, said cooling channel thereby being in a tension condition so as to cause the same to apply a spring-like force to said package with said force holding said package together under pressure, and wherein said package can be inserted into and removed from said resilient cooling channel by applying an inward pressure to the outsides of said channel along its major axis to compress it along its major axis and expand it along its minor axis.

Claim 10

An arrangement for holding the parts of a semiconductor package together under pressure and for directing a coolant over the package, the arrangement comprising: a). an essentially elliptically shaped, cooling channel made of a resilient material, having a minor axis and a major axis; b. a semiconductor package including at least one semiconductor component having a disc-like configuration and contact therewith, the overall height of said semiconductor package from the outside of the contact member on one side to the outside of the contact member on the other side as measured along an axis through said disc-like semiconductor and perpendicular thereto being greater than the inner diameter of said cooling channel along its minor axis, said semiconductor package inserted within said cooling channel with said perpendicular axis essentially parallel to said minor axis, said cooling channel thereby being in a tension condition so as to cause the same to apply a spring-like force to said package with said force holding said package together under pressure, and wherein said package can be inserted into and removed from said resilient cooling channel by applying an inward pressure to the outsides of said channel along its major axis to compress it along its major axis and expand it along its minor axis.

Claim 11

The semiconductor arrangement of claim 8 said cooling channel being a tube made of synthetic material reinforced with glass fibers.

Claim 12

The semiconductor arrangement of claim 9 said cooling channel having a non-uniform wall thickness.