Heat-absorbing heat sink

Claim 2

An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings by radiation, covection, and conduction, wherein the improvement comprises: a device-embedded compound that absorbs heat at a specific temperature, delaying temperature rise in the heat generator; and a multiplicity of fibers to absorb and retain said compound within the device, both below and above said specific temperature, said fibers being partially exposed as an outer surface of the device providing heat transfer by radiation and convection.

Claim 3

A heat sink as in claim 1 wherein said compound melts at said specific temperature absorbing without temperature rise a quantity of heat proportional to the latent heat of fusion of the compound, and said multiplicity of fibers comprises metallic wire structured as a mesh of one or more layers.

Claim 4

A heat sink as in claim 2 wherein the constituents of said compound are selected from the group consisting of lead, tin, bismuth, gold, silver, cadmium, antimony, and mercury.

Claim 5

A heat sink as in claim 3 wherein said compound is a tertiary eutectic alloy comprising bismuth, lead, and tin.

Claim 6

A heat sink as in claim 1 wherein said compound is a wax that melts at said specific temperature absorbing without temperature rise a quantity of heat proportional to the latent heat of fusion of the wax and said multiplicity of fibers are structured as a cloth of one or more layers.

Claim 7

A heat sink as in claim 5 wherein said cloth is selected from the group consisting of cotton, nylon, and linen.

Claim 8

A heat sink as in claim 1 wherein said compound undergoes an endothermic chemical change at the said specific temperature absorbing heat without appreciable temperature rise.

Claim 9

A heat sink as in claim 7 wherein said compound can undergo repeated endothermic chemical change when temperature-cycled above and below said specific temperature.

Claim 10

An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings, wherein the improvement comprises: a device-embedded compound formed in filaments that melt at a specific temperature absorbing without temperature rise a quantity of heat proportional to the latent heat of fusion of said compound delaying temperature rise in the heat generator, said filaments first being wrapped and twisted with many smaller diameter metallic wires to form yarn which is then woven into a mesh used in at least one layer, said metallic wires absorbing and retaining said compound within the device, both below and above said specific temperature.

Claim 11

An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings, wherein the improvement comprises: a device-embedded compound formed in filaments that melt at a specific temperature absorbing without temperature rise a quantity of heat proportional to the latent heat of fusion of said compound delaying temperature rise in the heat generator, said filaments first being wrapped and twisted with many smaller diameter metallic wires to form yarn which is then woven into a mesh used in at least one layer, said metallic wires absorbing and retaining said compound within the device, both below and above said specific temperature.

Claim 12

An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings, wherein the improvement comprises: a device-embedded metallic compound formed in filaments that melt at a specific temperature absorbing without temperature rise a quantity of heat proportional to the latent heat of fusion of said compound delaying temperature rise in the heat generator, said filaments first being wrapped and twisted with many smaller diameter metallic wires to form yarn which is then woven into a mesh used in at least one layer, said metallic wires absorbing and retaining said compound within the device, both below and above said specific temperature.

Claim 13

An improved heat sink device for transferring heat from a heat generator to lower-temperature surroundings, wherein the improvement comprises: a device-embedded metallic compound formed in filaments that melt at a specific temperature absorbing without temperature rise a quantity of heat proportional to the latent heat of fusion of said compound delaying temperature rise in the heat generator, said filaments first being wrapped and twisted with many smaller diameter metallic wires to form yarn which is then woven into a mesh used in at least one layer, said metallic wires absorbing and retaining said compound within the device, both below and above said specific temperature.

Claim 14

A heat sink as in claim 10 wherein the constituents of said compound are selected from the group consisting of lead, tin, bismuth, gold, silver, cadmium, antimony, and mercury.

Claim 15

A heat sink as in claim 11 wherein said compound is a tertiary eutectic alloy comprising bismuth, lead, and tin.