Diblocked diisocyanate diurea oligomers and coating compositions comprising same

Claim 2

A solvent based resin composition comprising:

Claim 3

A. a chain-extendable crosslinkable diblocked diisocyanate diurea oligomer of number average molecular weight about 300 to about 5000 comprising the reaction product of diamine of molecular weight about 50 to about 700, with half-blocked organic diisocyanate of molecular weight about 120 to about 2000 in molar ratio of about 1:2, respectively, said half-blocked organic diisocyanate comprising the reaction product of a monofunctional blocking agent with organic diisocyanate in molar ratio of about 1:1, said oligomer having de-blocking temperature of about 120° C. to about 250° C. B. polyepoxide bearing about 2 to about 10 epoxide groups and having molecular weight of about 100 to about 1000, in a weight ratio to said oligomer of about 1:1 to about 1:10; and C. organic solvent.

Claim 4

A. a chain-extendable crosslinkable diblocked diisocyanate diurea oligomer of number average molecular weight about 300 to about 5000 comprising the reaction product of diamine of molecular weight about 50 to about 700, with half-blocked organic diisocyanate of molecular weight about 120 to about 2000 in molar ratio of about 1:2, respectively, said half-blocked organic diisocyanate comprising the reaction product of a monofunctional blocking agent with organic diisocyanate in molar ratio of about 1:1, said oligomer having de-blocking temperature of about 120° C. to about 250° C. B. polyepoxide bearing about 2 to about 10 epoxide groups and having molecular weight of about 100 to about 1000, in a weight ratio to said oligomer of about 1:1 to about 1:10; and C. organic solvent.

Claim 5

The resin composition of claim 1 wherein said oligomer has a number average molecular weight of about 300 to about 1500.

Claim 6

The resin composition of claim 1 wherein said oligomer has a deblocking temperature of about 150° C. to about 220° C.

Claim 7

The resin composition of claim 3 wherein said diamine comprises alkylenediamine wherein the alkylene moiety is straight or branched chain and has about 2 to about 20 carbons.

Claim 8

The resin composition of claim 4 wherein said diamine bears two terminal amine groups.

Claim 9

The resin composition of claim 5 wherein said diamine is selected from the group consisting of 1,6-hexanediamine, 1,5-pentanediamine, 1,4-butanediamine and a mixture of any of them.

Claim 10

The resin composition of claim 3 wherein said diamine comprises cycloaliphatic diamines of about 4 to about 20 carbons.

Claim 11

The resin composition of claim 7 wherein said diamine is isophorone diamine.

Claim 12

The resin composition of claim 1 wherein said diamine comprises aromatic diamine wherein each amine is substituted on the same benzene ring or on different benzene rings linked through a covalent bond or through one or more carbons of a one to seven carbon aliphatic moiety.

Claim 13

The resin composition of claim 9 wherein said diamine is selected from the group consisting of toluene diamine, 4,4-methylenedianiline and a mixture of them.

Claim 14

The resin composition of claim 1 wherein said monofunctional blocking agent is selected from the group consisting of primary alcohol, secondary alcohol, amide, phenol, ketoxime and a mixture of any of them.

Claim 15

The resin composition of claim 1 wherein said monofunctional blocking agent is alcohol of one to about eight carbons.

Claim 16

The resin composition of claim 1 wherein said monofunctional blocking agent is ethanol.

Claim 17

The resin composition of claim 1 wherein said polyepoxide has 2 to about 4 epoxide groups.

Claim 18

The resin composition of claim 1 wherein said polyepoxide bears two terminal epoxide groups.

Claim 19

The resin composition of claim 1 wherein said polyepoxide comprises diepoxide.

Claim 20

The resin composition of claim 16 wherein said diepoxide is selected from the group consisting of 1,4-butandiol digylcidyl ether, 4-vinylcyclohexenedioxide, Bisphenol A epichlorohydrin epoxy resin, cycloaliphatic diepoxy resin, hydantoin epoxy resin, epoxy novalak resin and a mixture of any of them.

Claim 21

The resin composition of claim 1 wherein said oligomer and said polyepoxide are present in molar equivalent ratio of about 1:1 to about 2:1.

Claim 22

The resin composition of claim 1 wherein said solvent is selected from the group consisting of butanol, methyl amyl ketone, methyl ethyl ketone and a mixture of any of them.

Claim 23

A solvent based resin composition comprising: A. the reaction product of diamine selected from the group consisting of 1,6-hexanediamine, 1,5-pentanediamine, 1,4-butanediamine, toluene diamine, methylenedianiline and a mixture of any of them, with half-blocked organic diisocyanate in molar ratio of about 1:2, respectively, said half-blocked diisocyanate comprising the reaction product of monofunctional blocking agent selected from the group consisting of phenol, amide, primary alcohol, secondary alcohol, ketoxime and a mixture of any of them, with an approximately equal molar amount of organic diisocyanate of molecular weight less than about 250, said oligomer having a number average molecular weight of about 300 to about 1500 and a de-blocking temperature of about 150° C. to about 220° C.; B. polyepoxide of molecular weight about 300 to about 700, bearing 2 to about 4 epoxide groups, in weight ratio to said oligomer of about 1:1 to about 1:2, respectively; and C. organic solvent in amount sufficient to provide a volatile organic content (calculated) of less than about 400 g/l.

Claim 24

A solvent based resin composition comprising: A. the reaction product of diamine selected from the group consisting of 1,6-hexanediamine, 1,5-pentanediamine, 1,4-butanediamine, toluene diamine, methylenedianiline and a mixture of any of them, with half-blocked organic diisocyanate in molar ratio of about 1:2, respectively, said half-blocked diisocyanate comprising the reaction product of monofunctional blocking agent selected from the group consisting of phenol, amide, primary alcohol, secondary alcohol, ketoxime and a mixture of any of them, with an approximately equal molar amount of organic diisocyanate of molecular weight less than about 250, said oligomer having a number average molecular weight of about 300 to about 1500 and a de-blocking temperature of about 150° C. to about 220° C.; B. polyepoxide of molecular weight about 300 to about 700, bearing 2 to about 4 epoxide groups, in weight ratio to said oligomer of about 1:1 to about 1:2, respectively; and C. organic solvent in amount sufficient to provide a volatile organic content (calculated) of less than about 400 g/l.

Claim 25

The resin composition of claim 20 wherein said organic diisocyanate is selected from the group consisting of toluene diisocyanate, phenylene diisocyanate, isophorone diisocyanate diisocyanatoalkane wherein the alkylene moiety has about 3 to about 10 carbons and a mixture of any of them.

Claim 26

The resin composition of claim 20 wherein said polyepoxide is Bisphenol A epichlorohydrin epoxy resin.

Claim 29

A corrosion, humidity and solvent resistant coating made, in situ, on the surface of a substrate according to the method of claim 23.