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US4436570A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for bonding films

Assignee: Bayer AG
•
Filing: 1982-07-15
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Granted: 1984-03-13
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Expires: 2002-07-15
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Abstract

Abstract A film is bonded to a substrate by applying a layer of adhesive to the film to be bonded, contacting the film with a substrate and subjecting the adhesive to high energy radiation either before, during or after the film and substrate are contacted. The adhesive layer is from 0.5 to 20 μm thick. The adhesive employed is a mixture of at least one polyisocyanate and at least one compound containing both a (meth)acryloyl group and a hydroxyl group in which the equivalent ratio of hydroxyl to isocyanate groups is from 0.8 to 1 to 1.3 to 1. The substrate to which the film is to be bonded may also be a film. Composites formed in accordance with the present invention are characterized by high initial bond strengths.

Inventors

  • 👤 Karl-Friedrich Neuhaus
  • 👤 Horst Muller-Albrecht
  • 👤 Manfred Dollhausen
  • 👤 Hermann Perrey

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 19:27
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/04; B32B27/06; B32B27/08; B32B27/32; B32B27/34; B32B7/00; B32B7/04; B32B7/12; C; C08; C08G; C08G18/00; C08G18/06; C08G18/28; C08G18/67; C08G18/70; C08G18/81; C08G18/8141; C08G18/815; C08G18/8158; C08G18/8175; C09; C09J; C09J175/00; C09J175/04; C09J175/14; B32B2323/00; B32B2323/04; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31551

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 98 words
A process for bonding a film to a substrate comprising: (a) applying a layer from 0.5 to 20 μm thick of an adhesive which may be cross-linked by high energy radiation to the film to be bonded, (b) contacting the film of (a) with the substrate, and (c) subjecting the adhesive to high energy radiation wherein the adhesive is a mixture of (i) at least one polyisocyanate and (ii) at least one compound containing both a (meth)acryloyl group and a hydroxyl group in which the equivalent ratio of hydroxyl groups to isocyanate groups is from 0.8:1 to 1.3:1.
Claim 2
Dependent Claim 98 words
A process for bonding a film to a substrate comprising: (a) applying a layer from 0.5 to 20 μm thick of an adhesive which may be cross-linked by high energy radiation to the film to be bonded, (b) contacting the film of (a) with the substrate, and (c) subjecting the adhesive to high energy radiation wherein the adhesive is a mixture of (i) at least one polyisocyanate and (ii) at least one compound containing both a (meth)acryloyl group and a hydroxyl group in which the equivalent ratio of hydroxyl groups to isocyanate groups is from 0.8:1 to 1.3:1.
Claim 3
Dependent Claim 21 words
The process of claim 1 wherein the substrate is a film of the same composition as the film to be bonded.
Claim 4
Dependent Claim 11 words
The process of claim 1 wherein the adhesive contains a photoinitiator.
Claim 5
Dependent Claim 12 words
The process of claim 1 wherein the adhesive contains a copolymerizable monomer.
Claim 6
Dependent Claim 18 words
The process of claim 1 wherein the adhesive contains additives and auxiliaries known to those in the art.
Claim 7
Dependent Claim 19 words
The process of claim 1 wherein the adhesive contains a photoinitiator, a copolymerizable monomer and other additives and auxiliaries.
Claim 8
Dependent Claim 26 words
The process of claim 2 wherein the adhesive is cross-linked by electron beams or ultraviolet light before the films have been contacted to form a composite.
Claim 9
Dependent Claim 22 words
The process of claim 2 wherein the adhesive is cross-linked by electron beams or ultraviolet light while the films are being contacted.
Claim 10
Dependent Claim 25 words
The process of claim 2 wherein the adhesive is cross-linked by electron beams or ultraviolet light after the films are in contact with each other.
Claim 11
Dependent Claim 59 words
The process of claim 1 wherein the polyisocyanate is an aromatic diisocyanate selected from the group consisting of 2,4-diisocyanatotoluene, 2,6-diisocyanatotoluene, mixtures of 2,4- and 2,6-diisocyanatotoluenes, 2,4'-diisocyanato diphenyl methane, 4,4'-diisocyanato diphenyl methane, mixtures of 2,4'- and 4,4'-diisocyanato diphenyl methanes and isocyanate-group-containing reaction products of these diisocyanates with dihydric and/or trihydric alcohols having a molecular weight of from 62 to 700.
Claim 12
Dependent Claim 51 words
The process of claim 1 wherein the compound (ii) has an OH number of from 20 to 600, contains (on a statistical average) from 1 to 3 hydroxy groups per molecule and from 0.012 to 1.12 olefinic double bonds in the form of (meth)acryloyl groups for each 100 molecular weight units.

References Cited (Backward Citations)

US3028367A Cited
US3644569A Cited
US3891523A Cited
US3823051A Cited
US3783151A Cited
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US3759809A Cited
US3915935A Cited
US4092202A Cited
US4018333A Cited
US4105118A Cited
US4367302A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-03-13 1987-09-12 1988-03-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-03-13 1991-09-12 1992-03-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-03-13 1995-09-12 1996-03-13 $7700.00 Window Closed / Lapsed

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