US4426769A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Moisture getter for integrated circuit packages
Assignee: TE Connectivity Corp
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Filing: 1981-08-14
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Granted: 1984-01-24
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Expires: 2001-08-14
Abstract
Abstract A moisture getter, which is a material capable of absorbing moisture, is painted within the cap of an integrated circuit package prior to sealing. The package is then heated to the high sealing temperature necessary to provide sealing without affecting the getter material. The getter material is formed from a family of materials which is capable of withstanding the high temperature of the sealing process without degradation and which can absorb a large amount of water after exposure to sealing temperatures.
Inventors
- 👤 Dimitry G. Grabbe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 18:32
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/48; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
98 words
A method of forming an hermetically sealed integrated circuit package comprising the steps of: (a) providing a substrate having a lead structure thereon, (b) assembling a semiconductor chip onto said substrate, (c) making appropriate interconnection between said chip and said substrate, (d) providing a cap having a polyimide getter material therein capable of retaining its getter properties after exposure to sealing temperatures, (e) placing said cap on said substrate enclosing said chip, (f) placing a sealant between said cap and said substrate, and (g) heating said cap, sealant and substrate to hermetically seal said cap to said substrate.
Claim 2
Independent Claim
98 words
A method of forming an hermetically sealed integrated circuit package comprising the steps of: (a) providing a substrate having a lead structure thereon, (b) assembling a semiconductor chip onto said substrate, (c) making appropriate interconnection between said chip and said substrate, (d) providing a cap having a polyimide getter material therein capable of retaining its getter properties after exposure to sealing temperatures, (e) placing said cap on said substrate enclosing said chip, (f) placing a sealant between said cap and said substrate, and (g) heating said cap, sealant and substrate to hermetically seal said cap to said substrate.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-01-23 | 1987-07-25 | 1988-01-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-01-23 | 1991-07-25 | 1992-01-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-01-23 | 1995-07-25 | 1996-01-24 | $7700.00 | Window Closed / Lapsed |