US4410612A
Expired / Lapsed
US
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Electrical device formed from polymeric heat resistant photopolymerizable composition
Assignee: EIDP Inc
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Filing: 1981-12-24
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Granted: 1983-10-18
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Expires: 2001-12-24
Abstract
Abstract An electrical device formed from a polymeric heat resistant photopolymerizable composition of a polyamide ester, resin containing photopolymerizable groups which forms a relief structures on electrical devices such as capacitors, integrated circuits, printed circuits, multilayer circuits or semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition: a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.
Inventors
- 👤 David L. Goff
- 👤 Edward L. Yuan
- 👤 Stephen Proskow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:15
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; C; C08; C08F; C08F290/00; C08F290/08; C08F290/14; C08F290/145; G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/037; H10P14/63; H10P14/6326; H10P14/6342; H10P14/65; H10P14/6502; H10P14/6506; Y; Y10; Y10S; Y10S428/00; Y10S428/901
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
184 words
An electrical device having at least one semiconductive dielectric layer and a relief structure thereon; wherein the relief structure consists of a stable heat resistant polyimide material formed by applying a solvent soluble radiation sensitive polyamide ester resin composition to a substrate, drying the composition, exposing the composition to radiation through a pattern, dissolving the unradiated portions and converting the resulted relief structure by heating to form a polyimide structure and wherein the polyamide ester resin composition consists essentially of (a) a polyamide ester resin containing photopolymerizable groups comprising the following structure: ##STR2## wherein →denotes isomerism, R is an aromatic radical, R 1 is an organic radical containing a photo polymerizable olefinic double bond, R 2 is an aromatic, aliphatic or cycloaliphatic radical and n is a positive integer sufficiently large to provide the resin with a weight average molecular weight of about 5,000 to 75,000 determined by gel permeation chromatography; (b) solvent for the resin; (c) radiation sensitive polymerizable polyfunctional acrylate compound and (d) photopolymerization initiator of an aromatic biimidazole; wherein the polyamide ester resin being converted by heating to a polyimide structure.
Claim 2
Dependent Claim
184 words
An electrical device having at least one semiconductive dielectric layer and a relief structure thereon; wherein the relief structure consists of a stable heat resistant polyimide material formed by applying a solvent soluble radiation sensitive polyamide ester resin composition to a substrate, drying the composition, exposing the composition to radiation through a pattern, dissolving the unradiated portions and converting the resulted relief structure by heating to form a polyimide structure and wherein the polyamide ester resin composition consists essentially of (a) a polyamide ester resin containing photopolymerizable groups comprising the following structure: ##STR2## wherein →denotes isomerism, R is an aromatic radical, R 1 is an organic radical containing a photo polymerizable olefinic double bond, R 2 is an aromatic, aliphatic or cycloaliphatic radical and n is a positive integer sufficiently large to provide the resin with a weight average molecular weight of about 5,000 to 75,000 determined by gel permeation chromatography; (b) solvent for the resin; (c) radiation sensitive polymerizable polyfunctional acrylate compound and (d) photopolymerization initiator of an aromatic biimidazole; wherein the polyamide ester resin being converted by heating to a polyimide structure.
Claim 3
Dependent Claim
37 words
The electrical device of claim 1 in which the polyamide ester resin of the composition comprises R from pyromellitic dianhydride, R 1 from hydroxy alkyl methacrylate or hydroxy alkyl acrylate and R 2 from an aromatic diamine.
Claim 4
Dependent Claim
65 words
The electrical device of claim 1 in which the polymerizable polyfunctional acrylate of the composition is selected from the group consisting of trimethylol propane trimethacrylate, trimethylol propane triacrylate, trimethylol propane ethoxylate trimethacrylate, trimethylol propane ethoxylate triacrylate, trimethylol propane polyethoxylate trimethacrylate, trimethylol propane polyethoxylate triacrylate, pentaerythritol triacrylate, polyethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol dimethacrylate, polymethylene diacrylate, polymethylene dimethacrylate, trimethylene glycol dimethacrylate and mixtures thereof.
Claim 5
Dependent Claim
26 words
The electrical device of claim 3 in which the composition contains about 0.1-10% by weight, based on the weight of the resin, of a leuco dye.
Claim 6
Dependent Claim
16 words
The electrical device of claim 4 in which the leuco dye is an alkyl amino-aromatic alkane.
Claim 7
Dependent Claim
19 words
The electrical device of claim 3 or 4 in which the photopolymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl) or bis[2-o-chloro-phenyl-4,5-di(m-methoxyphenyl) imidazolyl].
Claim 8
Dependent Claim
33 words
The electrical device of claim 3 or 4 in which the composition contains in addition to the photopolymerization initiator about 0.1-10% by weight based on the weight of the resin, of a photosensitizer.
Claim 9
Dependent Claim
82 words
The electrical device of claim 1 in which the polyamide ester resin is of pyromellitic dianhydride esterified with hydroxyethyl methacrylate and reacted with oxydianiline, the polyfunctional acrylate compound is trimethylol propane polyethoxylate having a weight average molecular weight of about 500-1500, the photopolymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl), and the composition contains about 0.1-10% by weight, based on the weight of the resin, of tris(diethylamino-o-tolyl) methane, and about 0.1-10% by weight, based on the weight of the resin, of a photosensitizer of tetramethyldiaminobenzophenone.
Claim 10
Dependent Claim
77 words
The electrical device of claim 1 in which the polyamide ester is of pyromellitic dianhydride, esterified with hydroxy ethyl methacrylate and reacted with oxydianiline, the polyfunctional acrylate is trimethylol propane trimethacrylate or trimethylol propane triacrylate, the polymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl) and the composition contains about 0.1-10% by weight, based on the weight of the resin, of tris(diethyl amino-o-tolyl) methane and about 0.1-10% by weight, based on the weight of the resin, of a photosensitizer of tetramethyldiaminobenzophenone.
Claim 11
Dependent Claim
21 words
The electrical device of claims 8 or 9 which is a capacitor, semiconductor, multilayer circuit, printed circuit or an integrated circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-10-17 | 1987-04-18 | 1987-10-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-10-17 | 1991-04-18 | 1991-10-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-10-17 | 1995-04-18 | 1995-10-18 | $7700.00 | Window Closed / Lapsed |