Very high density cells comprising a ROM and method of manufacturing same

Claim 1

A process for manufacturing high density VLSI circuits comprising control FETs, and ROM cells which are FETs for "1" logic state or incomplete FETs for "0" logic state to determine the ROM programming comprising the steps of: forming a gate oxide layer on p type substrate; using a drain, source, contact mask to open the drain source contact areas for the control FETs; depositing a first layer of n+ doped polysilicon over the gate oxide layer on the substrate; depositing silicon nitride over the polysilicon; using an active area mask to define active areas for the diffusion bit lines of the ROM cells, control FETs, and ROM FETs 1 and 0; removing the silicon nitride and polysilicon not defined by said mask which is the silicon nitride and polysilicon not covering the active areas and diffused lines; field implanting the areas exposed by said removal of the silicon nitride and polysilicon with p type dopant channel stops for improved isolation of the active areas; growing field oxide in the field implanted channel stop areas; using a diffusion bit line mask to remove silicon nitride and polysilicon from the diffusion bit lines for ROM cells 1 and 0; doping the diffusion bit lines with n+ dopant; growing cross-over oxide over the diffused bit lines; using a first polysilicon mask to remove silicon nitride and polysilicon except under the mask; using a ROM code program mask to cover all 0 ROM cells; implanting drains and sources of the ROM cells 1 and of the control FETs with n+ dopant; growing cross-over oxide over the implanted drain and source areas; using a poly to poly contact mask to open such contacts in the cross-over oxide; depositing a second layer of n+ doped polysilicon over the so-formed substrate which contacts the first polysilicon layer through said openings; depositing silicon nitride over the second polysilicon; using a second poly interconnect mask to define a second poly pattern; etching the nitride and polysilicon where not protected by said last mentioned mask; using a metal to poly contact mask to remove silicon nitride from the non-contact areas, thereby exposing underlying polysilicon; oxidizing all polysilicon to form isolation oxide over the polysilicon; removing silicon nitride from the contact areas; depositing metal completely across the so-formed substrate; using a metal mask to define the metal interconnect pattern; and sintering the so-formed wafer to provide said circuit with self-aligned devices.