Patent US4402448A successfully refreshed from Google Patents.
US4402448A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mass soldering system
Assignee: HOLLIS AUTOMATION Co A Corp OF
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Filing: 1981-10-30
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Granted: 1983-09-06
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Expires: 2001-10-30
Abstract
Abstract A soldering system is described in which a freshly soldered board is heated substantially immediately following deposition of molten solder onto the board so as to maintain the freshly applied solder in molten condition, and a fluid stream is then directed onto the molten solder. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.
Inventors
- 👤 Harold T. O'Rourke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 04:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K1/00; B23K1/018; B23K1/08; B23K1/085; B23K2101/00; B23K2101/36; B23K2101/42; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0776; H05K2203/08; H05K2203/081; H05K2203/11; H05K2203/1105
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
247 words
Apparatus for mass joining with solder electrical and electronic components assembled in a circuit board wherein said components have leads which protrude downward through apertures in the board, and comprising in combination: a mass soldering station adapted to deposit a quantity of molten solder onto said board underside and said protruding leads whereby to join said board and said leads; a post soldering heating station adjacent said soldering station, said post soldering heating station comprising a heat source adapted to input heat onto the freshly deposited solder on said board underside and said protruding leads so as to maintain said freshly deposited solder in molten condition; an excess solder removal station adjacent said post soldering heating station, said excess solder removal station comprising at least one gas jet disposed below the travel path of said board and adapted to direct a fluid gas stream onto the freshly deposited solder on said board underside and said protruding leads before said solder fully solidifies as joints thereon, a source of pressurized fluid, and means connecting said source and said at least one fluid jet; said excess solder removal station being adapted to relocate or remove a portion of the molten solder deposited on said board and said protruding leads before said molten solder solidifies thereon while leaving said molten solder in said apertures substantially intact; and means for transporting said circuit board in line-through said mass soldering station, and post soldering heating station and said excess sold removal station.
Claim 2
Dependent Claim
247 words
Apparatus for mass joining with solder electrical and electronic components assembled in a circuit board wherein said components have leads which protrude downward through apertures in the board, and comprising in combination: a mass soldering station adapted to deposit a quantity of molten solder onto said board underside and said protruding leads whereby to join said board and said leads; a post soldering heating station adjacent said soldering station, said post soldering heating station comprising a heat source adapted to input heat onto the freshly deposited solder on said board underside and said protruding leads so as to maintain said freshly deposited solder in molten condition; an excess solder removal station adjacent said post soldering heating station, said excess solder removal station comprising at least one gas jet disposed below the travel path of said board and adapted to direct a fluid gas stream onto the freshly deposited solder on said board underside and said protruding leads before said solder fully solidifies as joints thereon, a source of pressurized fluid, and means connecting said source and said at least one fluid jet; said excess solder removal station being adapted to relocate or remove a portion of the molten solder deposited on said board and said protruding leads before said molten solder solidifies thereon while leaving said molten solder in said apertures substantially intact; and means for transporting said circuit board in line-through said mass soldering station, and post soldering heating station and said excess sold removal station.
Claim 3
Dependent Claim
23 words
Apparatus according to claim 1 including a source of said heated fluid, and means connecting said source to said excess solder removal station.
Claim 4
Dependent Claim
14 words
Apparatus according to claim 2, wherein said source comprises a source of heated gas.
Claim 5
Dependent Claim
14 words
Apparatus according to claim 1, wherein said source comprises a source of pressurized air.
Claim 6
Dependent Claim
30 words
Apparatus according to any one of claims 1 to 4, and further including a source of liquid, and means for introducing droplets of said liquid into said heated fluid stream.
Claim 7
Dependent Claim
28 words
Apparatus according to claim 1, wherein said post soldering heating station heat source comprises at least one quartz lamp heater disposed along the travel path of said board.
Claim 8
Dependent Claim
19 words
Apparatus according to claim 6, wherein said quartz lamp heaters are disposed below the travel path of said board.
Claim 9
Dependent Claim
22 words
Apparatus according to claim 6, wherein said quartz lamp heaters are disposed both below and above the travel path of said board.
Claim 10
Dependent Claim
48 words
Apparatus according to any of claims 6 to 8, and including (a) means for sensing the position of said circuit board relative to said post soldering heating station, and (b) means for activating said quartz lamp heaters when said circuit board is within said post soldering heating station.
Claim 11
Independent Claim
126 words
A method of mass joining with solder printed circuit boards having mounted thereon components with leads protruding downward through holes said board, said method comprising the steps of: depositing a quantity of molten solder onto the underside of said board and said downward protruding leads whereby to fill said holes at least in part with molten solder; substantially immediately following said depositing, heating said freshly deposited solder so as to maintain said solder in molten condition; and, substantially immediately following said heating impinging a stream of fluid directly onto the still molten deposited solder whereby to relocate or remove a portion of said deposited molten solder before said molten solder solidifies on said circuit board and leads while leaving molten solder in said holes substantially intact.
Claim 12
Independent Claim
126 words
A method of mass joining with solder printed circuit boards having mounted thereon components with leads protruding downward through holes said board, said method comprising the steps of: depositing a quantity of molten solder onto the underside of said board and said downward protruding leads whereby to fill said holes at least in part with molten solder; substantially immediately following said depositing, heating said freshly deposited solder so as to maintain said solder in molten condition; and, substantially immediately following said heating impinging a stream of fluid directly onto the still molten deposited solder whereby to relocate or remove a portion of said deposited molten solder before said molten solder solidifies on said circuit board and leads while leaving molten solder in said holes substantially intact.
Claim 13
Dependent Claim
12 words
A method according to claim 10, wherein said fluid stream comprises air.
Claim 14
Dependent Claim
32 words
A method according to claim 11, including the step of heating said stream of air to a temperature in the range of about 93° C. to 350° C. prior to said impinging.
Claim 15
Dependent Claim
30 words
A method according to claim 12, including the step of heating said stream of air to a temperature in the range of from about 290° C. to about 300° C.
Claim 16
Independent Claim
25 words
A method according to any of claims 10 to 13, including the step of dispersing liquid droplets into said fluid stream prior to said impinging.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-09-05 | 1987-03-07 | 1987-09-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-09-05 | 1991-03-07 | 1991-09-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-09-05 | 1995-03-07 | 1995-09-06 | $7700.00 | Window Closed / Lapsed |